초록 ▼

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in plac

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

대표청구항 ▼

1. A method of forming an image sensor package comprising:coupling an image sensor to a substrate; forming an optical lid, said optical lid comprising: an optical element; and a snapping feature; and coupling said optical lid to said substrate comprising: mounting a molding comprising a locking feat

1. A method of forming an image sensor package comprising:coupling an image sensor to a substrate; forming an optical lid, said optical lid comprising: an optical element; and a snapping feature; and coupling said optical lid to said substrate comprising: mounting a molding comprising a locking feature to said substrate; and snapping said snapping feature to said locking feature. 2. The method of claim 1 wherein said substrate is a ceramic substrate.3. The method of claim 1 wherein said image sensor is selected from the group consisting of a CMOS image sensor device, a charge coupled device and a pyroelectric ceramic on CMOS device.4. The method of claim 1 wherein said optical element comprises a lens.5. The method of claim 1 wherein said optical element comprises a window.6. The method of claim 5 wherein said window comprises a filter.7. The method of claim 1 wherein said optical element consists of a lens.8. The method of claim 1 wherein said image sensor package is a leadless chip carrier (LCC) package.9. The method of claim 1 wherein said molding is mounted to said substrate with an adhesive layer.10. The method of claim 9 wherein said molding, said substrate and said adhesive layer form an enclosure, said image sensor being located in said enclosure.11. The method of claim 1 wherein said optical lid is coupled to said substrate by an adhesive layer.12. A method of forming an image sensor package comprising:forming a means for supporting an optical element, said means for supporting comprising: a threaded interior cylindrical surface defining an aperture; and a pocket for supporting said optical element; placing said optical element in said pocket; threadedly attaching a threaded exterior cylindrical surface of a support to said threaded interior cylindrical surface of said means for supporting; and coupling said means for supporting to a first surface of a substrate, said substrate comprising means for electrically connecting said image sensor package to a printed circuit board, said means for electrically connecting being coupled to a second surface of said substrate. 13. The method of claim 12 wherein said optical element comprises a lens.14. The method of claim 12 wherein said substrate comprises a ceramic substrate, said image sensor package being an leadless chip carrier (LCC) package.