$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Fluid pressure bonding 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/30
  • H01L-021/46
  • C03C-027/00
  • B65C-003/26
출원번호 US-0161776 (2002-06-04)
발명자 / 주소
  • Chou, Stephen Y.
출원인 / 주소
  • Nanonex Corporation
대리인 / 주소
    Polster, Lieder, Woodruff &
인용정보 피인용 횟수 : 30  인용 특허 : 17

초록

An improved method of bonding involves using direct fluid pressure to press together the layers to be bonded. Advantageously one or more of the layers are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing an assembly of layers

대표청구항

1. A method of bonding a plurality of layers comprising the steps of:providing the layers; stacking the layers together into an assembly to be bonded; pressing the layers together by direct fluid pressure; and bonding the layers of the assembly together; wherein the layers are pressed together by st

이 특허에 인용된 특허 (17)

  1. Andrea Bartoli IT, Apparatus and method for blow moulding two thermoplastic sheets with the use of pneumatic operable membranes which close the mould halfs.
  2. Gutowski Timothy G. (Newton MA) Dillon Gregory P. (Erie PA) Chey Sukyoung (Cambridge MA) Li Haorong (Cambridge MA), Apparatus for diaphragm forming.
  3. Nakanishi Hironori,JPX ; Kawauchi Yuji,JPX ; Kawakami Akira,JPX, Composite material for electronic part and method of producing same.
  4. Henley Francois J. ; Cheung Nathan W., Economical silicon-on-silicon hybrid wafer assembly.
  5. Radzwill John E. (Arnold PA) Bartoli Roger F. (Natrona Heights PA), Fabricating shaped laminated transparencies.
  6. Bertin Claude L. ; Tonti William R. ; Zalesinski Jerzy M., Formation of charge-coupled-device with image pick-up array.
  7. Fritz Michael L. (2440 E. Dahlia Phoenix AZ 85032) Fritz Alton L. (12121 N. 83rd Ave. Peoria AZ 85345), Hydroforming platen and seal.
  8. Harshberger ; Jr. Robert L. ; Olsen Keith A. ; Potter John E. ; McLaughlin Martin J. ; Grossman Stephen P., Isostatic pressure resin transfer molding.
  9. Dlubak Frank C. (104 Sipes Freeport PA 16229), Laminated article and process for making same.
  10. Fosaaen, Ken Ervin; Yates, Travis Lee; Measley, Robert Eugene, Method and apparatus for making ceramic cores and other articles.
  11. Park James F. (P.O. Box 532 Park City UT 84060), Method and system for curing fiber reinforced composite structures.
  12. Mori Haruhiko (Kyoto JPX) Hiramatsu Ikuko (Kyoto JPX) Saito Koichi (Kyoto JPX), Method of manufacturing multilayer ceramic electronic component.
  13. Richard J. McReynolds, Methods of manufacturing microfabricated substrates.
  14. Tully John W. ; McCoy Don L. ; Sorensen Richard F., Optically transparent, electrically conductive semiconductor windows.
  15. Heider James E. (Toledo OH), Plastic container with multilayer label applied by in-mold labeling.
  16. Anastasie Maurice G. E. (4 ; rue Changarnier 75012 Paris FRX), Protective composite glass and method of manufacturing thereof.
  17. Greschner Johann (Pliezhausen DEX) Schmid Gerhard (Leinfelden-Echterdingen DEX) Steiner Werner (Bblingen DEX) Trippel Gerhard (Sindelfingen DEX) Wolter Olaf (Schnaich DEX), System for stamping an optical storage disk.

이 특허를 인용한 특허 (30)

  1. Cherala, Anshuman; Choi, Byung Jin; Lad, Pankaj B.; Shackleton, Steven C., Chucking system comprising an array of fluid chambers.
  2. Sreenivasan, Sidlgata V.; Choi, Byung-Jin; Voisin, Ronald D., Conforming template for patterning liquids disposed on substrates.
  3. Voisin, Ronald D., Imprint alignment method, system and template.
  4. Voisin, Ronald D., Imprint alignment method, system, and template.
  5. Sunaga, Tadahiro; Oda, Takashi; Onishi, Hitoshi, Imprint product and method for producing the same.
  6. Sreenivasan, Sidlgata V.; Choi, Byung-Jin, Imprinting of partial fields at the edge of the wafer.
  7. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Method and system for double-sided patterning of substrates.
  8. Schumaker, Philip D., Method for detecting a particle in a nanoimprint lithography system.
  9. McMackin, Ian M.; Lad, Pankaj B.; Truskett, Van N., Method for fast filling of templates for imprint lithography using on template dispense.
  10. Xu, Frank Y.; Sreenivasan, Sidlgata V.; Fletcher, Edward Brian, Method for imprint lithography utilizing an adhesion primer layer.
  11. Maekawa, Shinji, Method for manufacturing semiconductor device.
  12. Choi, Byung-Jin; Sreenivasan, Sidlgata V.; Willson, Carlton Grant; Colburn, Mattherw E.; Bailey, Todd C.; Ekerdt, John G., Method of automatic fluid dispensing for imprint lithography processes.
  13. Sreenivasan, Sidlgata V.; McMackin, Ian M.; Melliar-Smith, Christopher Mark; Choi, Byung-Jin, Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks.
  14. Choi, Byung Jin; Cherala, Anshuman; Babbs, Daniel A., Method of retaining a substrate to a wafer chuck.
  15. Choi, Yeong-Jun; Choi, Byung-Jin, Method to control an atmosphere between a body and a substrate.
  16. Sreenivasan, Sidlgata V., Pattern reversal employing thick residual layers.
  17. Sreenivasan, Sidlgata V.; Schumaker, Philip D., Patterning a plurality of fields on a substrate to compensate for differing evaporation times.
  18. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Patterning substrates employing multiple chucks.
  19. Nguyen, Houng T.; Xu, Ren; Barnes, Michael S., Process for optimization of island to trench ratio in patterned media.
  20. Thompson, David Samuel, Process for the manufacture of multilayer articles.
  21. Imada, Aya; Den, Toru, Process of production of patterned structure.
  22. Privett, Angie; Brummell, Roger; Forbis, Larry, Reduced cycle time manufacturing processes for thick film resistive devices.
  23. Privett, Angie; Brummell, Roger; Forbis, Larry, Reduced cycle time manufacturing processes for thick film resistive devices.
  24. Choi,Byung Jin; Sreenivasan,Sidlgata V.; Johnson,Stephen C., Remote center compliant flexure device.
  25. Jones, Christopher Ellis; Khusnatdinov, Niyaz; Johnson, Stephen C.; Schumaker, Philip D.; Lad, Pankaj B., Residual layer thickness measurement and correction.
  26. Schmid, Gerard M.; Stacey, Nicholas A; Resnick, Douglas J.; Voisin, Ronald D.; Myron, Lawrence J., Self-aligned process for fabricating imprint templates containing variously etched features.
  27. Schumaker, Philip D.; Fancello, Angelo; Kim, Jae H.; Choi, Byung-Jin; Babbs, Daniel A., System to transfer a template transfer body between a motion stage and a docking plate.
  28. GanapathiSubramanian, Mahadevan; Choi, Byung-Jin; Miller, Michael N.; Stacey, Nicholas A., Technique for separating a mold from solidified imprinting material.
  29. Selinidis, Kosta S.; Choi, Byung-Jin; Schmid, Gerard M.; Thompson, Ecron D.; McMackin, Ian Matthew, Template having alignment marks formed of contrast material.
  30. Sreenivasan, Sidlgata V.; Schumaker, Philip D.; McMackin, Ian M., Tessellated patterns in imprint lithography.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로