The invention provides a hot melt adhesive composition including a tubular reactor copolymer of ethylene and 5 to 20 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of at least 300 g/10 min. The alkyl group of the alkyl acrylate o
The invention provides a hot melt adhesive composition including a tubular reactor copolymer of ethylene and 5 to 20 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of at least 300 g/10 min. The alkyl group of the alkyl acrylate or alkyl methacrylate can be a linear or branched C1 to C12 group, particularly n-butyl. If desired, the hot melt adhesive can further include tackifiers, waxes, antioxidants and other desired additives. The hot melt adhesive composition shows improved heat resistance and favorable properties, such as has a shear adhesion fail temperature of at least 80° C., without the need to use high melting waxes. The invention further provides articles such as cartons, cases, trays, bookbindings or disposables including the hot melt adhesive compositions.
대표청구항▼
1. A hot melt adhesive composition comprising a tubular reactor copolymer of ethylene and at least 5 mol % of comonomer units derived from alkyl acrylates, alkyl methacrylates, or mixtures thereof, wherein the copolymer has:(a) a melt index of from 300-10,000 g/10 min; (b) a maximum peak melting tem
1. A hot melt adhesive composition comprising a tubular reactor copolymer of ethylene and at least 5 mol % of comonomer units derived from alkyl acrylates, alkyl methacrylates, or mixtures thereof, wherein the copolymer has:(a) a melt index of from 300-10,000 g/10 min; (b) a maximum peak melting temperature of at least 100° C.; and (c) a temperature required to melt 50% of the copolymer of at least 80° C. 2. The hot melt adhesive composition of claim 1, wherein the alkyl group of the alkyl acrylate or alkyl methacrylate is a linear or branched C1 to C12 group.3. The hot melt adhesive composition of claim 1, wherein the alkyl acrylate is selected from the group consisting of methyl acrylate, ethyl acrylate, n-butyl acrylate, iso-butyl acrylate, t-butyl acrylate, n-hexyl acrylate, 2-ethylbutyl acrylate, and 2-ethylhexyl acrylate.4. The hot melt adhesive composition of claim 1, wherein the alkyl acrylate is n-butyl acrylate.5. The hot melt adhesive composition of claim 1, further comprising a tackifier, and wherein said tackifier is present in an amount of from 5 to 60 percent by weight, based on the total weight of the composition.6. The hot melt adhesive composition of claim 1, wherein the composition has a shear adhesion fail temperature of at least 80° C.7. The hot melt adhesive composition of claim 1, wherein the composition has an adhesive melt viscosity of less than 2200 cps at 180° C. as measured by ASTM D-3236.8. The hot melt adhesive composition of claim 1, further comprising a wax.9. A hot melt adhesive composition comprising a tubular reactor copolymer of ethylene and at least 5 mol % comonomer, the comonomer comprising a first comonomer component comprising an alkyl acrylate, an alkyl methacrylate or a mixture thereof; and a second comonomer component comprising a compound having a reactivity ratio r2 of 2 or less relative to ethylene, wherein the copolymer has:(a) a melt index of from 300 to 10,000 g/10 min; (b) a maximum peak melting temperature of at least 80° C.; and (c) a temperature required to melt 50% of the copolymer of at least 40° C. 10. The hot melt adhesive composition of claim 9, further comprising a plasticizer, an antioxidant, a pigment, or a mixture thereof.11. The hot melt adhesive composition of claim 4, having at least 5 mol % of n-butyl acrylate derived units, and from 5 to 60% by weight of a compatible tackifier, based on the total weight of the composition.12. The hot melt adhesive composition of claim 11, wherein the copolymer comprises 6 to 14 mol % n-butyl acrylate derived units.13. The hot melt adhesive composition of claim 11, wherein the composition has an adhesive melt viscosity of less than 1500 cps at 180° C. as measured by ASTM D-3236.14. The hot melt adhesive composition of claim 11, further comprising a wax.15. The hot melt adhesive composition of claim 11, wherein the copolymer is a copolymer of ethylene, n-butyl acrylate, and at least one additional comonomer selected from the group consisting of C1 to C12 alkyl acrylates, C1 to C12 alkyl methacrylates, vinyl acetate, acrylic acid, methacrylic acid, partial esters of maleic acid, and carbon monoxide.16. The hot melt adhesive composition of claim 11, further comprising a plasticizer, an antioxidant, a pigment, or a mixture thereof.17. An article comprising a first surface and a second surface, wherein at least a portion of the second surface is adhered to at least a portion of the first surface by the hot melt adhesive composition of claim 1.18. The article of claim 17, wherein the article is a bookbinding, a product assembly, a disposable article, a case, a carton or a tray.19. A glue stick comprising the hot melt adhesive composition of claim 1.
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이 특허에 인용된 특허 (11)
Milks Robert R. (Baton Rouge LA), Bookbinding adhesives; processes for production of bookbinding adhesives; and methods of bookbinding.
Liedermooy Ingrid (Bridgewater NJ) Birch Julie (Surrey NJ GB3) Stauffer Daniel C. (Flemington NJ) Puletti Paul P. (Pittstown NJ), Low application temperature hot melt adhesive.
Arvedson Marsha M. (Houston TX) Domine Joseph D. (Humble TX) German Paul M. (Friendswood TX), Low comonomer content ethylene-acrylate polymers in stretch/cling films.
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