Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/11
H05K-001/14
출원번호
US-0147138
(2002-05-16)
발명자
/ 주소
DiBene, II, Joseph Ted
Hartke, David H.
출원인 / 주소
Incep Technologies
대리인 / 주소
Knobbe Martens Olson &
인용정보
피인용 횟수 :
7인용 특허 :
127
초록▼
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
대표청구항▼
1. A modular circuit board assembly, comprising:a substrate, having one or more components mounted thereon; a circuit board, including a power circuit supplying power to the one or more components; at least one conductive interconnect device disposed between the substrate and the circuit board, the
1. A modular circuit board assembly, comprising:a substrate, having one or more components mounted thereon; a circuit board, including a power circuit supplying power to the one or more components; at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device for physically separably and electrically coupling the circuit board to the substrate; wherein the substrate is communicatively coupled to a plurality of signal conductors disposed on a side of the substrate opposite the circuit board; and wherein substantially all power supplied to the substrate is provided by the at least one conductive interconnect device. 2. The modular circuit board assembly of claim 1, wherein each of the one or more components are a power dissipating elements, and the circuit is a power conditioning circuit.3. The modular circuit board assembly of claim 1, wherein:the circuit board comprises a circuit board first conductive surface and the substrate comprises a substrate first conductive surface; and the at least one conductive interconnect device is disposed between and in electrical contact with the circuit board first conductive surface and the substrate first conductive surface. 4. The modular circuit board assembly of claim 1, wherein:the circuit board comprises a circuit board first conductive surface and a circuit board second conductive surface; the substrate comprises a substrate first conductive surface and a substrate second conductive surface; and the at least one conductive interconnect device comprises a first portion disposed between the circuit board first conductive surface and the substrate first conductive surface, and a second portion disposed between the circuit board second conductive surface and the substrate second conductive surface. 5. The modular circuit board assembly of claim 1, wherein the conductive interconnect device includes a first portion and a second portion.6. The modular circuit board assembly of claim 1, further comprising a plurality of conductive interconnect devices, wherein the plurality of conductive interconnect devices are disposed proximate the periphery of the power dissipating element and between the circuit board and the substrate.7. The modular circuit board assembly of claim 2, wherein each of the power dissipating elements are processors.8. The modular circuit board assembly of claim 4, wherein the first portion of the conductive interconnect device is disposed within the second portion of the conductive interconnect device.9. The modular circuit board assembly of claim 5, wherein the conductive interconnect device first portion is disposed within the conductive interconnect device second portion.10. The modular circuit board of claim 5, wherein the first portion provides power from the circuit to the component and the second portion grounds at least a portion of the circuit board to at least a portion of the substrate.11. The modular circuit board of claim 7, wherein the substrate is communicatively coupled to a plurality of pins, the pins communicatively coupleable to a computer motherboard, the plurality of pins excluding a pin providing power to the component.12. The modular circuit board assembly of claim 8, wherein the first portion of the conductive interconnect device is substantially coaxial with the second portion of the conductive interconnect device and of a different length than the second portion of the conductive interconnect device.13. The modular circuit board assembly of claim 9, wherein the conductive interconnect device first portion is disposed substantially coaxially with the conductive interconnect device second portion.14. The modular circuit board assembly of claim 13, further comprising a dielectric region between the conductive interconnect device first portion and the conductive interconnect device second portion.15. The modular circuit board assembly of claim 14, wherein the conductive interconnect device first portion and the conductive interconnect device second portion are substantially cylindrical in shape.16. The modular circuit board assembly of claim 15, wherein the conductive interconnect device first portion comprises a press pin.17. The modular circuit board assembly of claim 16, wherein the conductive interconnect device first portion comprises a hollow portion for accepting a fastening device.18. The modular circuit board assembly of claim 16, wherein the conductive interconnect device first portion comprises a tapered top portion.19. The modular circuit board assembly of claim 18, further comprising a washer disposed between the fastening device and the tapered top portion, the washer including a first tapered surface substantially mating with the tapered top portion of the conductive interconnect device first portion.20. The modular circuit board assembly of claim 19, wherein the washer further comprises a split section.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (127)
Freuler Raymond G. ; Flynn Gary E., Adhesive thermal interface and method of making the same.
Borkar Shekhar Yeshwant ; Dreyer Robert S. ; Mulder Hans ; Obinata Naomi ; Wells Calvin E., Apparatus for mounting a chip package to a chassis of a computer.
Giannetti William B. (Fall River MA) Hess David G. (Atkinson NH) McCord Stuart J. (Westford MA) Rudd ; III Robert E. (Vergennes VT) Shih Wei-Tei (Yorba Linda CA), Composite enclosure for electronic hardware.
Colella Nicholas J. ; Davidson Howard L. ; Kerns John A. ; Makowiecki Daniel M., Composite material having high thermal conductivity and process for fabricating same.
Harris Willard Stephen ; Kemink Randall Gail ; McClafferty William David ; Schmidt Roger Ray, Cooling device for hard to access non-coplanar circuit chips.
Suzuki Masahiro (Inagi) Yamamoto Haruhiko (Yokohama) Udagawa Yoshiaki (Tokyo JPX), Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally.
Barrell David (Temple City CA) Kennedy Donald E. (Baldwin Park CA) Marino ; Jr. James J. (Monrovia CA) Rollen Donald C. (Railto CA), Copper-clad polyester-glass fiber laminates using zinc-coated copper.
Fortune G. Clark (Farmington Hills MI), Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and cha.
Taylor Billy K. ; Mellitz Richard I., Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit dens.
Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and.
Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Harvilchuck Joseph M. (Billings NY), High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology.
Schwiebert Matthew K. ; Hutchison Brian R. ; Chew Geary L. ; Barnett Ron, High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding.
Dawson ; deceased Peter F. (late of Portola Valley CA by Shirley B. Dawson ; executrix ) Leibovitz Jacques (San Jose CA) Nagesh Voddarahalli K. (Cupertino CA), Low cost, high thermal performance package for flip chips with low mechanical stress on chip.
Bujalski C. Gregory ; Petsinger Jeffrey M. ; Rooney Daniel T., Multi-board electronic assembly including spacer for multiple electrical interconnections.
Beilin Solomon I. (San Carlos CA) Chou William T. (Cupertino CA) Kudzuma David (San Jose CA) Lee Michael G. (San Jose CA) Murase Teruo (San Jose CA) Peters Michael G. (Santa Clara CA) Roman James J. , Multichip module substrate.
Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
Suarez Jose I. (Coral Gables FL) Martin William J. (Fort Lauderdale FL) Lauder James V. (Fort Lauderdale FL) Cook Harold M. (Sunrise FL), RF interconnect.
Frankeny Richard Francis ; Frankeny Jerome Albert ; Massey Danny Edward ; Vanderlee Keith Allan, Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer.
Skinner Harry G. ; Delaplane Neil C. ; Mahajan Ravi V. ; Starkston Robert ; Lii Mirng-ji ; Edsall Ron, Substrate for reducing electromagnetic interference and enclosure.
Ameen Joseph G. (Newark DE) Korleski Joseph E. (Newark DE) Mortimer ; Jr. William P. (Conowingo MD) Yokimcus Victor P. (Landenberg PA), Thermally conductive adhesive interface.
McAllister, Michael F.; Pross, Harald; Ruehle, Gerhard H.; Scholz, Wolfgang A.; Schoor, Gerhard, Gel package structural enhancement of compression system board connections.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.