IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0356503
(2003-02-03)
|
우선권정보 |
JP-0032659 (2002-02-08) |
발명자
/ 주소 |
- Neho, Yasushi
- Hotta, Daichi
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
17 인용 특허 :
7 |
초록
▼
An electronic device has a first case which houses a part of a liquid cooling system and mounted components, and a second case which houses the other part of the liquid cooling system. In one example, the second case houses and a display unit. In an all-in-one computer example, the second case may s
An electronic device has a first case which houses a part of a liquid cooling system and mounted components, and a second case which houses the other part of the liquid cooling system. In one example, the second case houses and a display unit. In an all-in-one computer example, the second case may serve as the access lid. In the electronic device, the liquid cooling system has a pump which feeds cooling liquids a heat block which receives heat from an electronic component, a pipe which transfers heat from the liquid to a heat sink, and a tube which connects these parts with one another. The first case has a first board mounted with the electronic component over a part of the liquid cooling system. Methods of manufacturing electronic devices with such cooling systems also are disclosed.
대표청구항
▼
1. An electronic device comprising:a heat producing electronic component,a printed board mounted with the heat producing electronic component,a main unit case enclosing the printed board,a display unit,a display case enclosing the display unit, anda liquid cooling system comprising:a heat block betw
1. An electronic device comprising:a heat producing electronic component,a printed board mounted with the heat producing electronic component,a main unit case enclosing the printed board,a display unit,a display case enclosing the display unit, anda liquid cooling system comprising:a heat block between the printed board and a bottom of the main unit case and abutted against the heat producing electronic component,a heat sink comprising a first plate installed in the display case,a drive for circulating liquid between the heat block and the heat sink, anda second plate mounted with the heat block.2. The electronic device according to claim 1, whereinthe heat producing electronic component is mounted on a face of the printed board opposite the heat block.3. The electronic device according to claim 1, whereinthe second plate is between the heat block and the bottom of the main unit case.4. The electronic device according to claim 1, further comprisinga hinge which joins together the first plate and the second plate.5. The electronic device according to claim 4, whereinthe hinge comprises a sleeve.6. The electronic device according to claim 1, whereinthe heat producing electronic component is a processor.7. The electronic device according to claim 1, whereinthe electronic device is a notebook computer.8. The electronic device according to claim 1, wherein the liquid cooling system further comprises a reservoir tank.9. An electronic device having a liquid cooling system, comprising:an electronic component which produces heat,a first case which houses the electronic component,a part of the liquid cooling system, and a first board, said first board mounted with the electronic component positioned over the part of the liquid cooling system,a display unit, anda second case which houses the display unit and another part of the liquid cooling system,the liquid cooling system having:a heat block coupled to the electronic component,a pipe through which the cooling liquid flows,a pump circulating the cooling liquid,at least one tube which connects the heat block, the pipe, and the pump,a heat sink coupled to dissipate heat carried by the pipe, the heat sink comprisinga first plate having a portion of the pipe coupled thereto for heat radiation, wherein the second case has the heat sink as the other part of the liquid cooling system, anda second plate mounted with the heat block in the first case.10. The electronic device having the liquid cooling system according to claim 9, whereinthe first board is mounted with the electronic component on the face thereof opposite the part of the liquid cooling system.11. The electronic device having the liquid cooling system according to claim 9, whereinthe first board is a mother board.12. The electronic device having the liquid cooling system according to claim 9, whereinthe part of the liquid pooling system includes the pump and the heat block.13. The electronic device having the liquid cooling system according to claim 9, whereinthe first case further comprises a keyboard on the first board.14. The electronic device having the liquid cooling system according to claim 9, whereinthe second plate is installed between the heat block and the bottom of the first case.15. The electronic device having the liquid cooling system according to claim 9, further comprisinga joint of the first plate and the second plate.16. The electronic device having the liquid cooling system according to claim 15, whereinthe joint comprises at least one hinge with at least one sleeve through which the cooling liquid passes.17. The electronic device having the liquid cooling system according to claim 9, wherein the liquid cooling system further has a reservoir tank.18. The electronic device having the liquid cooling system according to claim 9, whereinthe electronic device is a notebook computer.
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