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Dynamic control of wafer processing paths in semiconductor manufacturing processes 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-019/00
출원번호 US-0927444 (2001-08-13)
발명자 / 주소
  • Ward, Nicholas A.
  • Danielson, Richard
  • Corey, David B.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Wilmer Cutler Pickering Hale &
인용정보 피인용 횟수 : 37  인용 특허 : 106

초록

A semiconductor fabrication system, method and medium are disclosed. The system includes a semiconductor fabrication tool and a software application, in communication with the semiconductor fabrication tool. The semiconductor fabrication tool includes a chamber configured to perform at least one pro

대표청구항

1. A semiconductor fabrication system, comprising:a first semiconductor fabrication tool; wherein the first semiconductor fabrication tool includes a first chamber configured to perform at least one process on a semiconductor wafer; a software application, in communication with the first semiconduct

이 특허에 인용된 특허 (106)

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