초록

A method of bonding multiple layers is provided. The method includes the steps of stacking the multiple layers on top of each other and volumetrically heating the stack of multiple layers to a predetermined temperature. It is preferred that the stack is heated by electromagnetic induction.

대표청구항 ▼

1. A method of bonding multiple layers, the method comprising the steps of:stacking the multiple layers on top of each other; and generating an electromagnetic field which intersects and volumetrically heats the multiple layers to a predetermined temperature. 2. The method of claim 1 comprising the

1. A method of bonding multiple layers, the method comprising the steps of:stacking the multiple layers on top of each other; and generating an electromagnetic field which intersects and volumetrically heats the multiple layers to a predetermined temperature. 2. The method of claim 1 comprising the additional steps of:providing a resonant cavity extending along a longitudinal axis, the cavity having length which is adjustable along the axis; and positioning the stack of multiple layers in the cavity. 3. The method of claim 2 wherein the stack of multiple layers are positioned within the cavity at a predetermined location wherein the intensity of the electromagnetic field is maximized.4. The method of claim 2 comprising the additional step of adjusting the length of cavity to a user selected length to vary the electromagnetic field.5. The method of claim 2 wherein the step of generating electromagnetic fields includes injecting microwave radiation into the cavity.6. The method of claim 5 comprising the additional step of tuning the microwave radiation to minimize reflections from the cavity.7. The method of claim 1 wherein the step of generating the electromagnetic field includes the step of generating a magnetic field which intersects the stack of multiple layers.8. The method of claim 7 wherein the step of generating a magnetic field includes the steps of providing a conducting material and passing a current at a predetermined frequency through the conducting material.9. The method of claim 7 wherein the predetermined frequency is less than 300 MHz.10. The method of claim 1 comprising the additional step of preheating the stack of multiple layers to a coupling temperature so as to initiate bonding of the multiple layers.11. The method of claim 10 wherein the coupling temperature is between 20° and 200° Celsius.12. The method of claim 1 wherein the predetermined temperature is between 800° and 1100° Celsius.13. The method of claim 1 further comprising the additional step of cleaning the multiple layers prior to stacking the multiple layers.14. The method of claim 13 comprising the additional step of bringing the multiple layers into contact after the step of stacking the multiple layers.15. The method of claim 13 wherein the step of cleaning the multiple layers includes the steps:depositing each of the multiple layers in a NaOH:H2O2:H2O (5:1:1) solution at 80° Celsius; and depositing each of the multiple layers in a H2SO4:H2O (5:1) solution at 80° Celsius. 16. The method of claim 13 wherein the step of cleaning the multiple layers includes the additional steps:dipping each of the multiple layers in dilute (100:1) HF; rinsing each of the multiple layers in deionized water; and spinning the multiple layers completely dry. 17. A method of bonding multiple layers, the method comprising the steps of:stacking the multiple layers on top of each other; and generating an electromagnetic field which intersects the stack of the multiple layers to volumetrically heat the stack of multiple layers to a predetermined temperature. 18. The method of claim 17 comprising the additional steps of:providing a resonant cavity extending along a longitudinal axis, the cavity having length which is adjustable along the axis; and positioning the stack of multiple layers in the cavity. 19. The method of claim 18 wherein the stack of multiple layers are positioned within the cavity at a predetermined location wherein the intensity of the electromagnetic field is maximized.20. The method of claim 18 comprising the additional step of adjusting the length of cavity to a user selected length to vary the electromagnetic field.21. The method of claim 18 wherein the step of generating electromagnetic fields includes injecting microwave radiation into the cavity.22. The method of claim 21 comprising the additional step of tuning the microwave radiation to minimize reflections from the cavity.23. The method of claim 17 comprising the additional step of preheating the stack of multiple layers to a coupling temperature so as to initiate bonding of the multiple layers.24. The method of claim 23 wherein the coupling temperature is between 20° and 200° Celsius.25. The method of claim 17 wherein the predetermined temperature is between 800° and 1100° Celsius.26. The method of claim 17 further comprising the additional step of cleaning the multiple layers prior to stacking the multiple layers.27. The method of claim 26 wherein the step of cleaning the multiple layers includes the steps:depositing each of the multiple layers in a NaOH:H2O2:H2O (5:1:1) solution at 80° Celsius; and depositing each of the multiple layers in a H2SO4:H2O (5:1) solution at 80° Celsius. 28. The method of claim 27 wherein the step of cleaning the multiple layers includes the additional steps:dipping each of the multiple layers in dilute (100:1) HF; rinsing each of the multiple layers in deionized water; and spinning the multiple layers completely dry. 29. The method of claim 17 comprising the additional step of bringing the multiple layers into contact after the step of stacking the multiple layers.30. The method of claim 17 wherein the stack of multiple layers is heated by electromagnetic induction.31. A method of bonding multiple layers, the method comprising the steps of:depositing each of the multiple layers in a NaOH:H2O2:H2O (5:1:1) solution at 80° Celsius; depositing each of the multiple layers in a H2SO4:H2O (5:1) solution at 80° Celsius; pressing the multiple layers together to form a stack; and volumetrically heating the stack to a predetermined temperature. 32. The method of claim 31 wherein the step of heating the stack includes the step of generating an electromagnetic field which intersects the stack.33. The method of claim 32 comprising the additional steps of:providing a resonant cavity extending along a longitudinal axis, the cavity having length which is adjustable along the axis; and positioning the stack in the cavity. 34. The method of claim 33 wherein the stack is positioned within the cavity at a predetermined location wherein the intensity of the electromagnetic field is maximized.35. The method of claim 33 comprising the additional step of adjusting the length of cavity to a user selected length to vary the electromagnetic field.36. The method of claim 33 wherein the step of generating the electromagnetic field includes injecting microwave radiation into the cavity.37. The method of claim 36 comprising the additional step of tuning the microwave radiation to minimize reflections from the cavity.38. The method of claim 31 wherein the step of heating the stack includes the step of generating a magnetic field which intersects the stack of multiple layers.39. The method of claim 38 wherein the step of generating the magnetic field includes the steps of providing a conducting material and passing a current at a predetermined frequency through the conducting material.40. The method of claim 38 wherein the predetermined frequency is less than 300 MHz.41. The method of claim 31 comprising the additional step of preheating the stack to a coupling temperature so as to initiate bonding of the multiple layers.42. The method of claim 41 wherein the coupling temperature is between 20° and 200° Celsius.43. The method of claim 31 wherein the predetermined temperature is between 800° and 1100° Celsius.44. The method of claim 31 wherein the stack is heated by electromagnetic induction.45. The method of claim 31 further comprising the additional step of cleaning the multiple layers by:dipping each of the multiple layers in dilute (100:1) HF; rinsing each of the multiple layers in deionized water; and spinning the multiple layers completely dry. 46. A method of bonding multiple layers, the method comprising the steps of:stacking the multiple layers on top of each other; and generating a magnetic field which intersects the stack of multiple layers to volumetrically heat the stack of multiple layers to a predetermined temperature. 47. The method of claim 46 wherein the step of generating the magnetic field includes the steps of providing a conducting material and passing a current at a predetermined frequency through the conducting material.48. The method of claim 47 wherein the wherein the predetermined frequency is less than 300 MHz.