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A method of cutting at least one thin layer from a substrate or ingot forming element for an electronic or optoelectronic or optical component or sensor. This method includes the steps of forming a weakened zone in the substrate or ingot forming element, wherein the weakened zone has a thickness tha

A method of cutting at least one thin layer from a substrate or ingot forming element for an electronic or optoelectronic or optical component or sensor. This method includes the steps of forming a weakened zone in the substrate or ingot forming element, wherein the weakened zone has a thickness that corresponds to that of the layer that is to be removed; and directing a pulse of energy into the substrate or forming element wherein the pulse has a duration shorter than or of the same order as that needed by a sound wave to pass through the thickness of the weakened zone. The energy of the pulse is sufficient to cause cleavage to take place in the weakened zone as the energy of the pulse is absorbed therein.

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1. A method of cutting at least one thin layer from a substrate or ingot forming element for an electronic, optoelectronic or optical component or sensor, the method comprising:forming a weakened zone in the substrate or ingot forming element, the weakened zone having a thickness that corresponds to

1. A method of cutting at least one thin layer from a substrate or ingot forming element for an electronic, optoelectronic or optical component or sensor, the method comprising:forming a weakened zone in the substrate or ingot forming element, the weakened zone having a thickness that corresponds to that of a first thin layer that is to be removed; and directing a pulse of energy into the substrate or forming element wherein the pulse has a duration that is shorter than or of the same order of magnitude as the time required by a sound wave to pass through the thickness of the weakened zone, and the energy of the pulse is sufficient to cause cleavage to take place in the weakened zone as the energy of the pulse is absorbed therein, thereby detaching the first thin layer from the substrate, wherein the substrate or ingot forming element has a face oriented substantially parallel to the weakened zone and the energy pulse is completely uniformly directed over the entire surface through that face and into the substrate or ingot forming element. 2. The method according to claim 1, wherein the weakened zone is a porous zone.3. The method according to claim 1, wherein the weakened zone is formed by deposition.4. The method according to claim 1, wherein the weakened zone is formed by implantation.5. The method according to claim 4, wherein the implantation is of phosphorus, arsenic, protons, or rare gas ions.6. The method according to claim 1, wherein the substrate or ingot forming element comprises semiconductor material(s), LiNbO3, LiTaO3, or a composite material thereof.7. The method according to claim 6, wherein the substrate or ingot forming element comprises silicon, SiC, GaAs, InP, GaN, SiGe, Ge, LiNbO3, LiTaO3, or a composite material thereof.8. The method according to claim 1, wherein, after weakened zone forming, the substrate or ingot forming element is bonded onto a support to form a block, with the energy pulse being directed into the block so that, after detaching, the first thin layer is bonded to the support.9. The method according to claim 8, wherein the substrate or ingot forming element is bonded onto the support by molecular adhesion bonding or by adhesive bonding.10. The method according to claim 8, wherein the block further comprises a layer of SiO2, Si3N4, or a combination thereof.11. The method according to claim 1, wherein the energy pulse is generated by a laser beam.12. The method according to claim 1, wherein the energy pulse is a beam of electrons.13. The method according to claim 1, wherein the energy pulse has a duration of less than 1 ns.14. The method according to claim 1, wherein the energy pulse is a single pulse.15. The method according to claim 1, wherein the energy pulse is repeated multiple times.16. The method according to claim 1, wherein the face of the substrate or ingot forming element is polished.17. The method according to claim 4, wherein the implantation occurs through the same face of the substrate or ingot forming element into which the energy pulse is directed.18. The method according to claim 4, wherein the implantation occurs through one face of the substrate or ingot forming element and the energy pulse is directed into the substrate or ingot forming element through a second face that is on an opposite side of the substrate or ingot forming element.19. The method according to claim 1, wherein the energy pulse is directed to be selectively absorbed directly on the weakened zone.20. The method according to claim 19, which further comprises doping the substrate or ingot forming element so that the energy pulse is selectively absorbed in the weakened zone.21. The method according to claim 20, wherein the doping comprises ionically implanting phosphorus or arsenic into the substrate or ingot forming element.22. The method according to claim 19, wherein the selective absorption is performed in a metal layer.23. The method according to claim 22, wherein that the selective absorption is obtained within a deposited layer.24. The method according to claim 22, wherein the selective absorption is obtained within a layer whose properties have been modified by implantation.25. The method according to claim 1, wherein the energy pulse is directed onto the substrate or ingot forming element after all or part of a component of an electronic, optoelectronic or optical component or sensor has been made.26. A method of making an electronic or optoelectronic or optical component or sensor which includes a method of cutting at least one thin layer from a substrate or ingot forming element according to claim 1.27. The method of claim 1, wherein the pulse of energy that is directed into the substrate or forming element is from a YAG or a neodymium-doped glass laser suitable for delivering one or more pulses that each have a duration of less than 1 ns.28. The method of claim 1, wherein the pulse of energy that is directed into the substrate or forming element is from a sheet of solid lasers.29. A method of cutting at least one thin layer from a substrate for an electronic, optoelectronic or optical component or sensor, the method comprising:forming a weakened zone in a substrate of a semiconductor material by implantation of protons into the substrate, the weakened zone having a thickness that corresponds to that of a first thin layer that is to be removed; and directing a single pulse of energy from a laser into the substrate wherein the pulse has a duration that is shorter than or of the same order of magnitude as the time required by a sound wave to pass through the thickness of the weakened zone, and the energy of the pulse is sufficient to cause cleavage to take place in the weakened zone as the energy of the pulse is absorbed therein, thereby detaching the first thin layer from the substrate, wherein the substrate or ingot forming element has a face oriented substantially parallel to the weakened zone and the energy pulse is completely uniformly directed over the entire surface through that face and into the substrate or ingot forming element. 30. The method of claim 29, wherein the substrate is molecularly bonded to an insulating substrate of a silicon semiconductor that includes a surface layer of SiO2 so that the thin layer is transferred onto the SiO2 layer of the insulating substrate.