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A substrate removal apparatus capable of cutting a plurality of aligned, precision slots in a variety of surfaces, such as concrete, asphalt pavement, and other composite substrates, utilizes high-pressure liquid cutting devices. Slots may be cut in pavement for such applications as dowel bar retrof

A substrate removal apparatus capable of cutting a plurality of aligned, precision slots in a variety of surfaces, such as concrete, asphalt pavement, and other composite substrates, utilizes high-pressure liquid cutting devices. Slots may be cut in pavement for such applications as dowel bar retrofitting for joint load transfer restoration. An apparatus according to one embodiment includes a support frame, a carriage carried by the support frame, and cutting devices coupled to the carriage. The apparatus is configured so that the carriage is movable along a generally horizontal path of travel and a generally vertical path of travel.

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1. An apparatus for cutting at least six slots into a surface of a substrate, comprising:a support frame having a front end and a rear end;a carriage movably carried by the support frame, the carriage reciprocally movable along a first path of travel between the front and rear ends of the support fr

1. An apparatus for cutting at least six slots into a surface of a substrate, comprising:a support frame having a front end and a rear end;a carriage movably carried by the support frame, the carriage reciprocally movable along a first path of travel between the front and rear ends of the support frame; andat least six spaced-apart and substantially collinearly arranged cutting devices carried on the carriage for movement therewith, the cutting devices each including at least one discharge orifice coupled in fluid communication with a source of high pressure liquid for supplying pressurized liquid to the orifice, the pressurized liquid being discharged from the cutting devices at the discharge orifices with sufficient discharge pressure for simultaneously cutting at least six slots into the surface of the substrate.2. The apparatus of claim 1, wherein the support frame is adapted to traverse the surface of the substrate.3. The apparatus of claim 1, further comprising a first drive source associated with the carriage for effecting reciprocal movement of the carriage along the first path of travel.4. The apparatus of claim 3, further comprising linear actuators coupled to the ends of the carriage, the first drive source drivingly connected to the linear actuators for effecting movement of the carriage along the first path of travel.5. The apparatus of claim 1, wherein the first path of travel is substantially parallel to the surface of the substrate.6. The apparatus of claim 1, wherein the carriage is further reciprocally movable with respect to the support frame along a second path of travel different than the first path of travel.7. The apparatus of claim 6, wherein the second path of travel is substantially orthogonal to the first path of travel.8. The apparatus of claim 6, wherein the second path of travel is vertically oriented with relation to the surface of the substrate.9. The apparatus of claim 6, further comprising a second drive source associated with the carriage for effecting reciprocal movement of the carriage along the second path of travel.10. The apparatus of claim 9, further comprising linear actuators coupled to the ends of the carriage, the second drive source drivingly connected to the linear actuators for effecting movement of the carriage along the second path of travel.11. The apparatus of claim 1, wherein the cutting device has an operating position substantially orthogonal to the surface of the substrate.12. The apparatus of claim 1, wherein each cutting device further includes a drive source coupled to the discharge orifice for rotating the discharge orifice about an axis.13. The apparatus of claim 12, wherein the orientation of the rotational axis is generally vertical in relation to the surface of the substrate.14. The apparatus of claim 1, further comprising at least one shield assembly connected to a lower portion of the support frame and associated with one cutting device, the shield assembly defining an interior cavity having a rim section forming an opening to the substrate, wherein the cutting device extends into the shield assembly.15. The apparatus of claim 14, wherein the shield assembly is adapted to be connected in fluid communication with a vacuum source for removing a mixture of loose substrate and liquid produced by the discharging liquid impinging against the surface of the substrate.16. The apparatus of claim 14, wherein the shield assembly includes a template coupled to a lower portion of the shield assembly and occupying the opening formed by the rim section, the template configured to extend around the rim section and include an opening corresponding in shape and size with the slot to be formed in the substrate.17. The apparatus of claim 1, wherein at least one of the cutting devices is removably coupled to the carriage.18. An apparatus for cutting a plurality of slots into a surface of a substrate, comprising:a mobile support frame having a front end and a rear end,a carriage moveably carried by the support frame, the carriage reciprocally movable along a first path of travel between the front and rear ends of the support frame; andfirst and second sets of cutting devices carried on the carriage for movement therewith and spaced apart a distance of approximately 60 inches, wherein the first and second sets of cutting devices each includes three cutting devices equally spaced apart a distance of approximately 12 inches, the cutting devices each including at least one discharge orifice, wherein the cutting devices are adapted to be connected to a source of high pressure liquid for supplying pressurized liquid to the discharge orifices, the pressurized liquid being discharged from the cutting devices at the discharge orifices with sufficient discharge pressure for simultaneously cutting six spaced slots in the substrate.19. An apparatus for cutting a plurality of slots into a surface of a substrate, comprising:a mobile support frame having a front end and a rear end;a carriage moveably carried by the support frame, the carriage reciprocally movable along a generally horizontal path of travel between the front and rear ends of the support frame, the carriage further reciprocally movable with respect to the support frame along a generally vertical path of travel;at least six substantially collinearly arranged cutting devices carried on the carriage in a spaced apart manner for movement therewith, the cutting devices each including a tubular shaft and at least one discharge orifice coupled in fluid communication with the shaft, the shaft having a generally vertical operating position, wherein the shaft is adapted to be connected to a source of high pressure liquid for supplying pressurized liquid to the shaft, the pressurized liquid being discharged from the cutting devices at the discharge orifices with sufficient discharge pressure for simultaneously cutting at least six spaced slots in the substrate;a first drive source drivingly connected to the carriage for effecting reciprocal movement of the carriage along the generally horizontal path of travel; anda second drive source drivingly connected to the carriage for raising and lowering the carriage along the generally vertical reciprocal path of travel.20. A method for simultaneously cutting at least six spaced-apart slots in a surface of a substrate with at least six high pressure liquid cutting heads carried on a frame in spaced relation, the method comprising:positioning the frame in a desired location with respect to the surface of the substrate with the at least six cutting heads positioned above a portion of the surface of the substrate in which slots are to be cut; anddischarging liquid at high pressure from the at least six high pressure liquid cutting heads to impinge against the surface of the substrate with sufficient force to simultaneously cut at least six, spaced slots in the surface of the substrate.21. The method of claim 20, further comprising:moving the cutting heads from a first position in a first direction substantially parallel to the surface of the substrate and relative to the frame to elongate the slots.22. The apparatus of claim 18, wherein the discharge pressure of the liquid is greater than 30,000 p.s.i.23. The apparatus of claim 1, wherein the substrate is concrete.24. The apparatus of claim 18, wherein the substrate is concrete.25. The apparatus of claim 19, wherein the substrate is concrete.26. The method of claim 20, wherein the substrate is concrete.