|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H01L-021/44 H01L-021/48 H01L-021/50 H01L-023/20 H01L-023/26|
|미국특허분류(USC)||438/115; 438/116; 257/682; 257/E23.137|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 7 인용 특허 : 16|
A method, system and materials for use in hydrogen gettering in conjunction with microelectronic and microwave components that are generally hermetically sealed in an enclosure typically referred to as a “package”. Gettering materials that can be used include titanium with or without a hydrogen permeable coating or covering, alloys of zirconium-vanadium iron and zeolites and several ways to apply these materials to the package. In addition, the hydrogen permeable material can be used over a vent from the interior of the package to the exterior wherein hy...
1. A method of making a package containing a substantially hydrogen-free interior which comprises the steps of:(a) providing a hermetically sealed package having a hollow interior region;(b) providing a hydrogen degradable semiconductor device material within said hollow interior;(c) forming a hydrogen permeable layer onto a surface of said package;(d) then forming a vent through said package from said hollow interior region to the exterior of said package through said layer to form a hydrogen permeable layer over said vent.2. The method of claim 1 where...