초록 ▼

A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequential

A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

대표청구항 ▼

1. A heat sink for a heat generating component, the heat sink comprising:a base part for contacting with the heat generating component, the base part comprising a plurality of arcuate spacers;a fin part comprising a pair of outer fins and a plurality of inner fins cooperatively defining a chamber be

1. A heat sink for a heat generating component, the heat sink comprising:a base part for contacting with the heat generating component, the base part comprising a plurality of arcuate spacers;a fin part comprising a pair of outer fins and a plurality of inner fins cooperatively defining a chamber between the outer fins; anda heat pipe extending through the base part and the fin part and bonding the base part and the fin part together with the spacers interleaved between the inner fins, whereinthe chamber and the arcuate spacers cooperatively facilitate cooling air from a top side of the fin part to blow to opposite sides of the fin part thereby improving heat dissipation efficiency of the heat sink.2. The heat sink as claimed in claim 1, wherein each spacer comprises a flat bottom face for contacting with the heat generating component and an arcuate top face.3. The heat dissipating device as claimed in claim 1, wherein each inner fin defines a V-shaped cutout in a top portion thereof, the cutouts of the inner fins cooperatively form the chamber.4. The heat sink as claimed in claim 1, wherein the heat pipe is U-shaped, each inner fin defines a pair of through holes, and each spacer defines a through hole aligned with one of the through holes of the inner fin, the heat pipe extending through the through holes of the spacers and the through holes of the inner fins.5. A heat dissipating device assembly comprising:a circuit board having an electronic component mounted thereon;a retention module mounted on the circuit board;a heat sink attached to the retention module, the heat sink comprising:a plurality of fins and a plurality of arcuate spacers interleaved between lower portions of the fins, the spacers contacting the electronic component;a heat pipe sequentially extending through the lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together; anda fan mounted on the heat sink, whereinthe arcuate spacer facilitates cooling air from the fan to blow to opposite sides of the fins thereby improving heat dissipation efficiently of the heat sink.6. The heat dissipating device assembly as claimed in claim 5, wherein the heat sink further comprises a locking part, the locking part comprises a frame fixed with the heat sink, and a pair of locking plates supported the fan thereon.7. The heat dissipating device assembly as claimed in claim 6, wherein the retention module comprises a bottom plate defining an opening for extension of the electronic component therethrough to contact the spacers, and a pair of lateral sidewalls each defining a barb engaging with the frame of the locking part to thereby attach the heat sink to the electronic component.8. The heat dissipating device assembly as claimed in claim 5, wherein the finscomprises a pair of outer fins and a plurality of inner fins between the outer fins, and each of the inner fins defines a V-shaped cutout in a top portion thereof, the cutouts cooperatively forming a chamber between the outer fins.9. The heat dissipating device assembly as claimed in claim 5, wherein each spacer comprises a flat bottom face contacting the electronic component and an arcuate top face.10. The heat dissipating device assembly as claimed in claim 5, wherein the heat pipe is U-shaped, each inner fin defines a pair of through holes, and each spacer defines a through hole aligned with one of the through holes of the inner fin, the heat pipe extending through the through holes of the spacers and the through holes of the inner fins.11. A heat sink assembly comprising:a locking part including a frame defining an opening;a base part including a plurality of shorter spacers;a fin part including a plurality of higher inner fins;said spacers being interleaved between bottom portions of said inner fins so as to form a stack including the alternately arranged inner fins and spacers along a horizontal direction under a condition that the interleaved spacer and bottom portions of the inner fins are restrained in the opening of the frame; andat least one heat pipe extending through said interleaved inner fins and spacers; whereina fan is secured to said locking part above both the frame and the interleaved inner fins and spacers.12. The assembly as claimed in claimed 11, wherein upper portions of the inner fins are configured with curved edges, and upper portions of the spacers are configured with complementary curved edges to commonly define a sand glass configuration for improving heat dissipation.13. The assembly as claimed in claim 11, wherein said heat pipe further extend through said frame.14. The assembly as claimed in claim 11, wherein extension of the heat pipe through all said frame and said interleaved inner fins and spacers, occurs at a same level.