초록 ▼

A high-powered lighting assembly includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed-loop refrigeration system to maximize operational efficiencies and increase unit life. The thermal barrier prevents thermal back-flow from a heat sink plate or a housing

A high-powered lighting assembly includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed-loop refrigeration system to maximize operational efficiencies and increase unit life. The thermal barrier prevents thermal back-flow from a heat sink plate or a housing to a lighting array while insulating a control module and a thermal sensor with improved sealing geometry. The refrigeration system is optimally positioned to controllably pump heat from the lighting array to the heat sink plate.

대표청구항 ▼

1. A high-powered lighting assembly, comprising:a heat sink plate in thermal contact with a housing;a light-emitting array on a thermally conductive printed circuit board having at least a metal layer opposite said array;means for sensing a temperature of said metal layer;means for cooling and trans

1. A high-powered lighting assembly, comprising:a heat sink plate in thermal contact with a housing;a light-emitting array on a thermally conductive printed circuit board having at least a metal layer opposite said array;means for sensing a temperature of said metal layer;means for cooling and transferring thermal energy from at least a first portion of said metal layer to said heat sink plate;means for controlling said cooling means and maintaining said temperature at a predetermined temperature during an operation of said assembly; andan insulation layer thermally isolating said array, said metal layer, said sensing means, and said control means from each of said housing and said heat sink plate, whereby said insulating layer prevents at least one of a convective and a conductive thermal back flow from said housing and said heat sink plate.2. A high-powered lighting assembly, according to claim 1, wherein:said cooling means includes at least one thermo-electric module having a cool side and a hot side during said operation;said cool side in sealed thermal contact with said metal layer;said hot side in sealed thermal contact with said heat sink plate; andsaid insulation layer bounding said thermo-electric module, whereby said insulation layer provides unidirectional thermal transfer to said heat sink plate through said at least one thermo-electric module.3. A high-powered lighting assembly, according to claim 2, further comprising:a plurality of Light Emitting Diodes in said array; anda dielectric layer on a front face of said metal layer adjacent said array.4. A high-powered lighting assembly, according to claim 2, wherein:said sensor means is on a back surface of said metal layer opposite said array;said control means includes at least one encapsulated electronics module;said electronics module is on said back surface of said metal layer proximate said sensor means; andsaid insulation layer thermally isolates both said sensor means and said electronics module from said heat sink plate and said housing, whereby said insulation layer maintains said sensor means and said electronics module at said predetermined temperature during said operation.5. A high-powered lighting assembly, according to claim 4, wherein:said heat sink plate defines a central opening; andsaid insulating layer extends within said central opening, whereby a thickness of said insulating layer thermally isolating said electronics module from said heat sink plate is uniform.6. A high-powered lighting assembly, according to claim 2, wherein:said cooling means includes at least two thermo-electric modules; andsaid thermo-electric modules symmetrically positioned relative to said sensor means, whereby during said operation said metal layer receives symmetrical cooling and relative to said sensor means an accuracy of said sensor means and said control means is improved.7. A high-powered lighting assembly, according to claim 6, wherein:said cooling means includes at least four thermo-electric modules; andsaid thermo-electric modules quadratically positioned relative to said sensor means, whereby during said operation said metal layer receives symmetrical cooling and relative to said sensor means an accuracy of said sensor means and said control means is improved.8. A high-powered lighting assembly, according to claim 2, further comprising:means for dissipating heat from said housing during said operation; andsaid means for dissipating heat from said housing includes at least a plurality of heat radiating fins on an outer surface of said housing.9. A high-powered lighting assembly, according to claim 8, further comprising means for dissipating heat from said heat sink plate during said operation.10. A high-powered lighting assembly, according to claim 1, further comprising:at least a cover bounding a display side of said circuit board;said cover in sealing contact with said display side of said circuit board;said cover in sealing contact with an inner surface of a rim on said insulation layer; andan outer surface of said rim in sealing contact with said housing, whereby said insulation layer prevents conductive thermal transfer from said housing to said cover and said cover minimizes condensation on said array during said operation.11. A high-powered lighting assembly, according to claim 10, wherein:said cover includes at least one of a translucent, transparent, and optically refractive surface;said cover is constructed from at least one of a plastic and a ceramic; anda space defined between said cover and said display side of said circuit board contains an operably desirable gas.12. An high-powered lighting assembly, comprising:a heat sink plate in thermal contact with a housing;a light-emitting array on a thermally conductive printed circuit board having at least a metal layer opposite said array;a thermal sensor unit for detecting a temperature of said metal layer;a thermo-electric cooling unit thermally joining said metal layer opposite said array and said heat sink plate;a control unit for controlling said cooling unit and maintaining said temperature at a predetermined temperature during an operation of said assembly; andan insulation layer sealingly and thermally isolating said array, said metal layer, said sensor unit, and said control unit from each of said housing and said heat sink plate, thereby preventing at least one of a convective and a conductive thermal back flow from both said housing and said heat sink plate.13. A high-powered lighting assembly, according to claim 12, wherein:said cooling unit includes at least one thermo-electric module having a cool side and a hot side during said operation of said assembly;said cool side in sealed thermal contact with said metal layer;said hot side in sealed thermal contact with said heat sink plate; andsaid insulation layer bounding said at least one thermo-electric module, whereby said insulation layer mandates unidirectional thermal transfer to said heat sink plate through said at least one thermo-electric module.14. A high-powered lighting assembly, according to claim 13, further comprising:a plurality of Light Emitting Diodes in said array; anda dielectric layer on a front face of said metal layer adjacent said array.15. A high-powered lighting assembly, according to claim 13, wherein:said sensor unit is on a back surface of said metal layer opposite said array;said control unit includes at least one encapsulated electronics module;said electronics module on said back surface of said metal layer proximate said sensor means; andsaid insulation layer thermally isolating both said sensor unit and said electronics module from said heat sink plate and said housing, whereby said insulation layer maintains said sensor means and said electronics module at said predetermined temperature during said operation.16. A high-powered lighting assembly, according to claim 12, further comprising:at least a cover bounding a display side of said circuit board;said cover in sealing contact with said display side of said circuit board;said cover in sealing contact with an inner surface of a rim on said insulation layer; andan outer surface of said rim in sealing contact with said housing, whereby said insulation layer prevents conductive thermal transfer from said housing to said cover and said cover prevents condensation on said array during said operation.17. A high-powered lighting assembly, comprising:a heat sink plate in thermal contact with a housing;a light-emitting array on a first member having at least a metal layer opposite said array;means for sensing a temperature of said array;means for cooling and transferring thermal energy from at least a first portion of said array to said heat sink plate;means for controlling said cooling means and maintaining said temperature at a predetermined temperature during an operation of said assembly; andmeans for insulating and thermally isolating said array, said metal layer, said sensor means, and said control means from each of said housing and said heat sink plate, and preventing at least one of a convective and a conductive thermal back flow from one of said housing and said heat sink plate to said metal layer.18. A high-powered lighting assembly, comprising:a heat sink plate in thermal contact with a housing;a light-emitting array;control means for controllably maintaining a temperature of said array at a predetermined temperature during an operation of said assembly; andinsulation means for thermally isolating said array and said control means from said heat sink plate and said housing during said operation by preventing one of a convective and a conductive thermal back flow from one of said housing and said heat sink plate to said array.