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The described embodiments relate to laser micromachining a substrate. One exemplary embodiment includes a chamber configured to receive an assist gas from an assist gas source. The chamber is configured to allow a laser beam to pass through the chamber to contact a substrate positioned outside of th

The described embodiments relate to laser micromachining a substrate. One exemplary embodiment includes a chamber configured to receive an assist gas from an assist gas source. The chamber is configured to allow a laser beam to pass through the chamber to contact a substrate positioned outside of the chamber. The laser machine also includes a nozzle plate positioned in gas receiving relation with the chamber, the nozzle plate having at least one nozzle opening formed therein, wherein the at least one nozzle opening is substantially coincident a footprint of a feature desired to be formed in the substrate.

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1. A laser micro-machining apparatus comprising:a chamber configured to receive an assist gas, the chamber comprising a window through which a laser beam can be directed; a nozzle plate positioned against the chamber having a nozzle opening that defines a pattern that represents a footprint of a fea

1. A laser micro-machining apparatus comprising:a chamber configured to receive an assist gas, the chamber comprising a window through which a laser beam can be directed; a nozzle plate positioned against the chamber having a nozzle opening that defines a pattern that represents a footprint of a feature to be formed in a substrate; and, a gas supply connected to the chamber for supplying an assist gas into the chamber and through the nozzle opening. 2. The apparatus of claim 1, wherein the chamber and the nozzle plate remain stationary relative to the substrate during formation of the feature.3. The apparatus of claim 1, further comprising a fixture to position the substrate relative to the nozzle plate and external to the chamber and upon which the substrate can be contacted by the laser beam and wherein the fixture can move the substrate in relation to the laser beam.4. The apparatus of claim 1, further comprising a mechanism for moving the laser beam relative to the substrate.5. The apparatus of claim 1, wherein the pattern of the nozzle plate approximates a rectangle.6. The apparatus of claim 1, wherein the pattern of the nozzle plate approximates a circle.7. The apparatus of claim 1 further comprising a controller for controlling conditions for supplying the assist gas from the gas source to the chamber, wherein the conditions comprise one or more of temperature of the assist gas, composition of the assist gas, and flow rate of the assist gas.8. The apparatus of claim 1, wherein the nozzle plate is configured to allow assist gas to flow toward the substrate generally coaxially to the laser beam.9. The apparatus of claim 1, wherein the nozzle opening and the window are configured to allow the feature to be formed without moving the chamber relative to the substrate.10. The apparatus of claim 1, wherein the substrate comprises a wafer.11. The apparatus of claim 1, wherein the window comprises a quartz crystal.12. A micromachining apparatus comprising:a chamber configured to receive an assist gas from an assist gas source and configured to allow a laser beam to pass through the chamber to contact a substrate positioned outside of the chamber; and, a nozzle plate positioned in gas receiving relation with the chamber, the nozzle plate having at least one nozzle opening formed therein, wherein the at least one nozzle opening is substantially coincident a footprint of a feature desired to be formed in the substrate. 13. The apparatus of claim 12, wherein the nozzle opening generally circumscribes the footprint.14. The apparatus of claim 12, wherein the chamber is configured to remain stationary relative to the substrate when the feature is formed in the substrate.15. The apparatus of claim 12, wherein the nozzle opening allows assist gas to flow through the nozzle opening toward the substrate generally coaxially to the laser beam.16. The apparatus of claim 12 further comprising an evacuation system.17. The apparatus of claim 16, wherein the evacuation system is positioned generally opposite the laser beam relative to the nozzle opening.18. A micromachining apparatus comprising:a laser source configured to generate a laser beam to remove substrate material through a first surface of a substrate to form a feature in the substrate; and, a chamber comprising a window and a nozzle plate that has an opening, wherein the chamber is configured to allow the laser beam to enter the chamber via the window and exit the chamber via the opening wherein the opening defines a pattern of the feature at the first surface of the substrate and an assist gas can exit the chamber via the opening to promote substrate removal. 19. The apparatus of claim 18, wherein the chamber is configured to remain stationary relative to the substrate when the feature is formed in the substrate.20. The apparatus of claim 18, wherein the nozzle plate is an integral portion of the chamber.21. The apparatus of claim 18, wherein the nozzle plate is a distinct removable component of the chamber.22. The apparatus of claim 18, wherein the opening of the nozzle plate comprises less than about 50 percent of the surface area of the nozzle plate.23. The apparatus of claim 18 further comprising an evacuation system configured to supply a vacuum to a region surrounding and generally coplanar with the opening.24. An apparatus comprising:a nozzle plate that has an opening, wherein the nozzle plate is configured to be positioned in gas receiving relation to a chamber that is configured to allow a laser beam to exit the chamber via the opening, wherein the opening defines a pattern of a feature to be formed in a substrate, and wherein the opening comprises less than 50 percent of the surface area of the nozzle plate. 25. The apparatus of claim 24, wherein the opening approximates a rectangle.26. An apparatus comprising:a chamber configured to receive a nozzle plate that has an opening, wherein the chamber is configured to allow a laser to enter the chamber via a window and exit the chamber via the opening, and the opening being configured to allow the laser passing through the window to trace an elongate pattern within the opening without striking the nozzle plate, wherein the chamber is further configured to receive an assist gas that can exit the chamber via the opening. 27. The apparatus of claim 26, wherein the opening of the nozzle plate is rectangular.28. An apparatus comprising:means for removing substrate material from a substrate to form a desired feature through a first surface of the substrate; and, means for supplying an assist gas to essentially all portions of the first surface through which the feature is to be formed, without placing the substrate in a chamber, and without moving said means for supplying during formation of the desired feature, and while further allowing the removing means to trace a pattern of the desired feature on the first surface. 29. The apparatus of claim 28, wherein the pattern of the desired feature defines an elongate footprint on the first surface.