IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0071420
(2002-02-08)
|
발명자
/ 주소 |
- Valek, Timothy J.
- O'Shaughnessy, Roger D.
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
31 |
초록
▼
The present invention relates to methods and apparatus for removing coatings from generally opposed first and second major surfaces of a substrate. The method includes providing a table having a surface for slidable receipt of the substrate. First and second grinding apparatuses are provided at a mo
The present invention relates to methods and apparatus for removing coatings from generally opposed first and second major surfaces of a substrate. The method includes providing a table having a surface for slidable receipt of the substrate. First and second grinding apparatuses are provided at a mounting portion of the table, opposite one another. As the substrate moves over the table surface, it contacts the first and second grinding apparatuses. The coatings are simultaneously removed from the first major surface with the first grinding apparatus from the second major surface with the second grinding apparatus.
대표청구항
▼
1. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a table having a table surface for slidable receipt of a substrate, the table including a mounting portion
1. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a table having a table surface for slidable receipt of a substrate, the table including a mounting portion and an access recess for an operator; a first grinding apparatus mounted at the mounting portion of the table; a second grinding apparatus mounted at the mounting portion of the table, opposite the first grinding apparatus; and a first height adjustment mechanism to control a distance of the first grinding apparatus from the substrate and a second height adjustment mechanism to control a distance of the second grinding apparatus from the substrate.2. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a table having a mounting portion and a table surface configured for slidable receipt of a substrate, the table surface including a plurality of rollers for slidable receipt of the substrate, the rollers being spaced apart from one another and including balls and enclosures for supporting the balls; a first grinding apparatus mounted at the mounting portion of the table; and a second grinding appanitus mounted at the mounting portion of the table, opposite the first grinding apparatus.3. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a table having a mounting portion and a table surface configured for slidable receipt of a substrate, the table surface having an axis and including a plurality of rollers for slidable receipt of the substrate, the rollers being spaced apart from one another and being oriented to rotate about an axis that is substantially parallel with the axis of the table surface; a first grinding apparatus mounted at the mounting portion of the table; and a second grinding apparatus mounted at the mounting portion of the table, opposite the first grinding apparatus.4. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a table having a mounting portion and a table surface configured for slidable receipt of a substrate, the table including an access recess; a first grinding apparatus mounted at the mounting portion of the table; and a second grinding apparatus mounted at the mounting portion of the table, opposite the first grinding apparatus.5. The apparatus of claim 4, wherein the table comprises a central section having a first end and a second end, a first end section extending from the first end of the table and a second end section extending from the second end of the table, the first end section and the second end section spaced parallel and apart from one another to form the access recess.6. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a table having a mounting portion and a table surface configured for slidable receipt of a substrate, the table surface including a plurality of side rollers for supporting a portion of the substrate proximate the first and second grinding apparatuses; a first grinding apparatus mounted at the mounting portion of the table; and a second grinding apparatus mounted at the mounting portion of the table, opposite the first grinding apparatus.7. An apparatus of claim 6, wherein the side rollers are oriented to rotate about an axis that is substantially normal to the surface of the table.8. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a support surface configured for slidable receipt of a substrate, the support surface including a mounting portion; a first grinding apparatus mounted at the mounting portion of the support surface; a second grinding apparatus mounted at the mounting portion of the support surface, opposite the first grinding apparatus; and a motor to drive both the first and second grinding apparatuses.9. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a support surface configured for slidable receipt of a substrate, the support surface including a mounting portion; a first grinding apparatus mounted at the mounting portion of the support surface; a second grinding apparatus mounted at the mounting portion of the support surface, opposite the first grinding apparatus; and a first height adjustment mechanism to control a distance of the first grinding apparatus from the substrate and a second height adjustment mechanism to control a distance of the second grinding apparatus from the substrate, wherein the first and second height adjustment mechanisms are configured for simultaneous movement of the first and second grinding apparatuses toward or away from one another.10. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a support surface configured for slidable receipt of a substrate, the support surface including a mounting portion; a first grinding apparatus mounted at the mounting portion of the support surface; a second grinding apparatus mounted at the mounting portion of the support surface, opposite the first grinding apparatus; and a first height adjustment mechanism to control a distance of the first grinding apparatus from the substrate and a second height adjustment mechanism to control a distance of the second grinding apparatus from the substrate, wherein the first and second height adjustment mechanisms each comprises two guide posts, a threaded shaft being located intermediate the guide posts and being rotatable about a central axis thereof, the first and second grinding apparatuses being operably attached to the threaded shaft such that rotation of the threaded shaft causes the first and second grinding apparatuses to move vertically with respect to the table.11. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a support surface configured for slidable receipt of a substrate, the support surface including a mounting portion; a first grinding apparatus mounted at the mounting portion of the support surface; a second grinding apparatus mounted at the mounting portion of the support surface, opposite the first grinding apparatus; and a first height adjustment mechanism to control a distance of the first grinding apparatus from the substrate and a second height adjustment mechanism to control a distance of the second grinding apparatus from the substrate, wherein the first and second height adjustment mechanisms control a distance of the first grinding apparatus from the substrate and a distance of the second grinding apparatus from the substrate while maintaining a horizontal position of the first and second grinding apparatuses.12. An apparatus for removing coatings from portions of first and second surfaces of a substrate, the portions comprising a width and a depth of coatings to be removed, the apparatus comprising: a support surface configured for slidable receipt of a substrate, the support surface including a mounting portion; a first grinding apparatus mounted at the mounting portion of the support surface; a second grinding apparatus mounted at the mounting portion of the support surface, opposite the first grinding apparatus; and a dust collection system.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.