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A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section directs a fluid flow along the axis an

A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section directs a fluid flow along the axis and the thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

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1. An apparatus comprising a portable computer which includes:a housing; circuitry disposed within said housing and having a component; and a temperature adjusting arrangement thermally coupled to said component, said temperature adjusting arrangement including: a thermally conductive section having

1. An apparatus comprising a portable computer which includes:a housing; circuitry disposed within said housing and having a component; and a temperature adjusting arrangement thermally coupled to said component, said temperature adjusting arrangement including: a thermally conductive section having a side which faces in a direction approximately parallel to an axis, and which is thermally coupled to said component; and a fluid supply section disposed on a side of said thermally conductive section opposite from said component and operable to direct a fluid flow along said axis toward said thermally conductive section, said thermally conductive section causing said fluid flow to split into a plurality of flow portions which each flow through said thermally conductive section in a direction approximately parallel to a plane perpendicular to said axis, said flow portions exiting said thermally conductive section at a plurality of respective locations which are disposed along a substantial portion of the periphery of said thermally conductive section. 2. An apparatus according to claim 1, wherein said plural flow portions each flow away from said axis through said thermally conductive section in a respective one of at least three directions that each extend approximately radially of said axis.3. An apparatus according to claim 2, wherein said thermally conductive section includes:a base portion with first and second sides facing in respective first and second directions which are approximately opposite and which are each approximately parallel to said axis, said first side being said side thermally coupled to said component; and a plurality of fins which project outwardly from said second side of said base portion in approximately said second direction, said fins being arranged in at least three groups which are distributed angularly about said axis, the fins in each said group extending approximately parallel to each other, and each said group including at least one said fin which extends approximately radially of said axis, said flow portions being equal in number to the number of said groups, and each flowing away from said axis between and parallel to the fins of a respective said group. 4. An apparatus according to claim 3, wherein there are four said groups of fins, the fins of two of said groups extending approximately parallel to a first line which is perpendicular to said axis, and the fins of the other two of said groups extending approximately parallel to a second line which is perpendicular to each of said axis and said first line.5. An apparatus according to claim 2, wherein said thermally conductive section includes: a block of a heat-conductive open-celled porous material which is thermally coupled to said component, said flow portions each flowing away from said axis through said porous material in a respective said direction that extends approximately radially of said axis.6. An apparatus according to claim 5, wherein said thermally conductive section includes a base portion which is disposed between said component and said porous material, said base portion having first and second sides which face in respective first and second directions that are approximately opposite and which are each approximately parallel to said axis, said first side being said side thermally coupled to said component, and said second side being thermally coupled to said porous material.7. An apparatus according to claim 6, wherein said porous material is one of a sintered porous material and a foamed porous material.8. An apparatus according to claim 1, wherein said housing has first and second ports therethrough, said fluid supply section being in fluid communication with said first port for drawing into said housing through said first port from externally of said housing a flow of air, said fluid flow including said flow of air, and wherein at least part of the air in said flow portions, after leaving said thermally conductive section, travels to and exits said housing through said second port.9. An apparatus according to claim 8,wherein said second port is spaced from said thermally conductive section; and wherein said circuitry includes a further component disposed along a path of air flowing from said thermally conductive section to said second port. 10. An apparatus according to claim 9, including a vane which is provided within said housing and which influences the route of said path for air flowing from said thermally conductive section to said second port.11. An apparatus according to claim 9, including a heatsink mounted on said further component and disposed in said path for air flowing from said thermally conductive section to said second port.12. An apparatus according to claim 8, wherein said housing has therethrough a third port which is spaced from said second port, wherein part of the air in said flow portions, after leaving said thermally conductive section, travels to and exits said housing through said third port.13. An apparatus according to claim 12, wherein said second and third ports have different sizes in order to influence the proportional amount of said air in said air flow sections which flow through each of said second and third ports.14. An apparatus according to claim 8,wherein said housing has a third port therethrough; wherein said second and third ports are each spaced from said thermally conductive section and from each other; wherein respective parts of the air in said flow portions, after leaving said thermally conductive section, respectively travel to and exit said housing through said second and third ports; and wherein said circuitry includes two further components which are respectively disposed along respective paths of said respective parts of the air in said flow portions. 15. An apparatus according to claim 1,wherein said circuitry includes a further component; and including a heatpipe disposed within said housing, said heatpipe having a first portion which is thermally coupled to said further component, and having a second portion which is spaced from said first portion and which is thermally coupled to said thermally conductive section. 16. An apparatus according to claim 1, wherein said fluid supply section includes a fan that effects an air flow which is said fluid flow.17. An apparatus according to claim 1, wherein said component contains a processor.18. A method of cooling a portable computer which includes a housing having therein circuitry with a component, comprising the steps of:thermally coupling to said component a temperature adjusting arrangement, said temperature adjusting arrangement including a thermally conductive section having a side which faces in a direction approximately parallel to an axis and which is thermally coupled to said component; and directing a fluid flow along said axis toward a side of said thermally conductive section opposite from said component, said thermally conductive section causing said fluid flow to split into a plurality of flow portions which each flow through said thermally conductive section in a direction approximately parallel to a plane perpendicular to said axis, said flow portions exiting said thermally conductive section at a plurality of respective locations which are disposed along a substantial portion of the periphery of said thermally conductive section. 19. A method according to claim 18, wherein said step of directing said fluid flow includes the step of effecting said splitting of said fluid flow in a manner so that said flow portions each flow away from said axis through said thermally conductive section in a respective one of at least three directions that each extend approximately radially of said axis.20. A method according to claim 19, including the step of configuring said thermally conductive section to have a block of a heat-conductive open-celled porous material which is thermally coupled to said component, said flow portions each flowing away from said axis through said porous material in a respective said direction that extends approximately radially of said axis.21. A method according to claim 20, including the step of configuring said thermally conductive section to have a base portion which is disposed between said component and said porous material, said base portion having first and second sides which face in respective first and second directions that are approximately opposite and which are each approximately parallel to said axis, said first side being said side thermally coupled to said component, and said second side being thermally coupled to said porous material.22. A method according to claim 21, including selecting as said porous material one of a sintered porous material and a foamed porous material.23. A method according to claim 19, including the steps of:configuring said thermally conductive section to have a base portion with first and second sides facing in respective first and second directions which are approximately opposite and which are each approximately parallel to said axis, said first side being said side which is thermally coupled to said component; and configuring said thermally conductive section to have a plurality of fins which project outwardly from said second side of said base portion in approximately said second direction, said fins being arranged in at least three groups which are distributed angularly about said axis, the fins in each said group extending approximately parallel to each other, and each said group including at least one said fin which extends approximately radially of said axis, said flow portions being equal in number to the number of said groups, and each flowing away from said axis between and parallel to the fins of a respective said group. 24. A method according to claim 23, including the step of grouping said fins into four groups, the fins of two of said groups extending approximately parallel to a first line which is perpendicular to said axis, and the fins of the other two of said groups extending approximately parallel to a second line which is perpendicular to each of said axis and said first line.25. A method according to claim 18, including the steps of:configuring said housing to have first and second ports therethrough; drawing into said housing through said first port from externally of said housing a flow of air, said fluid flow including said flow of air; and causing at least part of the air in said flow portions, after leaving said thermally conductive section, to travel to and exit said housing through said second port. 26. A method according to claim 25,wherein said configuring step includes the step of providing said second port at a location spaced from said thermally conductive section; and including the step of locating a further component of said circuitry along a path of air flowing from said thermally conductive section to said second port. 27. A method according to claim 26, including the step of using a vane disposed within said housing to influence the route of said path for air flowing from said thermally conductive section to said second port.28. A method according to claim 26, including the step of locating in said path for air flowing from said thermally conductive section to said second port a heatsink which is mounted on said further component.29. A method according to claim 25,wherein said configuring step includes the step of providing a third port through said housing and locating said second and third ports at respective locations which are spaced from each other and from said thermally conductive section; including the step of causing respective parts of the air in said flow portions, after leaving said thermally conductive section, to respectively travel to and exit said housing through said second and third ports; and including the step of locating each of two further components of said circuitry along respective paths of said respective parts of the air in said flow portions. 30. A method according to claim 18, including the steps of:thermally coupling a first portion of a heatpipe to a further component of said circuitry; and thermally coupling a second portion of said heatpipe which is spaced from said first portion thereof to said thermally conductive section.