최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
---|---|
국제특허분류(IPC7판) |
|
출원번호 | US-0405765 (2003-03-31) |
발명자 / 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 | 피인용 횟수 : 264 인용 특허 : 209 |
A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes fanning channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on th
A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes fanning channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.
1. A method of making a transcutaneous electrochemical sensor, the method comprising the steps of:providing a substrate having a sensor planform, the sensor planform having a connector portion and a transcutaneous portion, the transcutaneous portion being adjacent to the connector portion and extend
1. A method of making a transcutaneous electrochemical sensor, the method comprising the steps of:providing a substrate having a sensor planform, the sensor planform having a connector portion and a transcutaneous portion, the transcutaneous portion being adjacent to the connector portion and extending therefrom; applying at least one contact pad to the connector portion; applying at least one conductive trace to the transcutaneous portion and the connector portion such that the at least one conductive trace electrically communicates with the at least one contact pad; and removing the sensor planform of the substrate by cutting through the substrate to form a removed sensor, wherein the connector portion of the removed sensor has first and second opposite edges and the transcutaneous portion has third and fourth opposite edges, wherein the first and third edges together form a continuous straight edge, and wherein the second and fourth edges do not form a continuous straight edge. 2. The method of claim 1 wherein a distance between the first and second edges formed in the removing step is at least about three times greater than a distance between the third and fourth edges.3. The method of claim 1 wherein a distance between the first and second edges formed in the removing step is at least about six times greater than a distance between the third and fourth edges.4. The method of claim 1 wherein the connector portion has a width between the first and second edges formed in the removing step and also a length, the width being substantially greater than the length.5. The method of claim 1 wherein the connector portion has a width between the first and second edges formed in the removing step and also a length, the width being at least about twenty percent greater than the length.6. The method of claim 1 wherein the connector and transcutaneous portions each have a length, the length of the connector portion being at least about ninety percent of the length of the transcutaneous portion.7. The method of claim 1 wherein the removing step further includes cutting at least one of the third and fourth opposite edges of the transcutaneous portion such that it has a barb.8. The method of claim 1 wherein the connector portion has a width between the first and second edges formed in the removing step of 0.5-15 mm.9. The method of claim 8 wherein the connector portion has a width between the first and second edges formed in the removing step of 1-10 mm.10. The method of claim 1 wherein the transcutaneous portion has a width between the third and fourth edges formed in the removing step of 2 mm or less.11. The method of claim 10 wherein the transcutaneous portion has a width between the third and fourth edges formed in the removing step of 1 mm or less.12. The method of claim 1 wherein after the step of applying at least one conductive trace to the transcutaneous portion and the connector portion, applying a sensing layer over at least a portion of the conductive trace.
Copyright KISTI. All Rights Reserved.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.