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An imager temperature sensor and a current correction apparatus are provided which use dark pixel measurements from an imager chip during operation together with a fabrication process constant as well as a chip dependent constant to calculate chip temperature. The chip temperature may be used to gen

An imager temperature sensor and a current correction apparatus are provided which use dark pixel measurements from an imager chip during operation together with a fabrication process constant as well as a chip dependent constant to calculate chip temperature. The chip temperature may be used to generate a current correction signal. The correction signal is used to tune a current on the imager chip to correct for temperature variations.

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1. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of temperature using said dark current signal, a fabrication process dependent parameter, and an imaging chip dependent v

1. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of temperature using said dark current signal, a fabrication process dependent parameter, and an imaging chip dependent value; and a circuit for adjusting an imager current based on said temperature representation. 2. An imager device comprising:a pixel array formed on an imaging chip and comprising a plurality of pixels supplying dark current signals which are selectively used to calculate a plurality of temperature representations, each dark current signal being associated with at least one circuit used on said imager; a circuit for providing said plurality of temperature representations using said dark current signal, a fabrication process dependent parameter, and an imaging chip dependent value; and a circuit for determining at least one current correction signal based on at least one of said plurality of temperature representations. 3. An imager device of claim 2 wherein said circuit determines a separate current correction signal for each said plurality of temperature representations.4. An imager device of claim 2 wherein said at least one current correction signal is a master current correction signal for said imager device.5. An imager device of claim 3 wherein at least one of said current correction signals is a master current correction signal for said imager device and at least one other of said current correction signals is a local circuit current correction signal.6. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of at least one of a temperature of said chip and a temperature of a portion of said chip using said dark current signal, a fabrication process dependent parameter and an imaging chip dependent value; and a circuit for determining a correction signal based on said temperature representation, wherein said correction signal is a correction signal for correcting an impedance of said imager. 7. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of at least one of a temperature of said chip and a temperature of a portion of said chip using said dark current signal, a fabrication process dependent parameter and an imaging chip dependent value; and a circuit for determining a correction signal based on said temperature representation, wherein said correction signal is a correction signal for correcting a resistance of said imager. 8. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of at least one of a temperature of said chip and a temperature of a portion of said chip using said dark current signal, a fabrication process dependent parameter and an imaging chip dependent value; and a circuit for determining a correction signal based on said temperature representation, wherein said correction signal is a correction signal for correcting a capacitance of said imager. 9. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of at least one of a temperature of said chip and a temperature of a portion of said chip using said dark current signal, a fabrication process dependent parameter and an imaging chip dependent value; and a circuit for determining a correction signal based on said temperature representation, wherein said correction signal is a correction signal for correcting a voltage of said imager. 10. An imager device comprising:a pixel array formed on an imaging chip and comprising a plurality of pixels provided at spaced locations within said array respectively supplying dark current signals, at least one pixel at each of said spaced locations providing said respective dark current signal which is associated with a respective area of said imaging chip; a circuit for providing a representation of a temperature of a portion of said chip using said respective dark current signal, a fabrication process dependent parameter and an imaging chip dependent value, said circuit determining a separate temperature representation for each said portion based at least in part on said respective dark current signal; and a circuit for respectively adjusting a plurality of current signals based on said respective separate temperature representation. 11. An imager device of claim 10 wherein each adjusting circuit determines a current scaling value from an associated temperature representation using a look-up table.12. An imager device of claim 11 wherein said look-up table has scaling values which are each associated with a representation of a temperature range.13. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of at least one of a temperature of said chip and a temperature of a portion of said chip using said dark current signal, a fabrication process dependent parameter and an imaging chip dependent value; and a circuit for adjusting an imager current based on said temperature representation. 14. An imager device comprising:a pixel array formed on an imaging chip and comprising at least one pixel providing a dark current signal; a circuit for providing a representation of at least one of a temperature of said chip and a temperature of a portion of said chip using said dark current signal, a fabrication process dependent parameter and an imaging chip dependent value; and a circuit for determining a current correction signal for a master current source for said imaging chip based on said temperature representation. 15. An imager device of claim 14 further comprising a plurality of pixels provided at spaced locations within said array respectively supplying dark current signals, at least one pixel at each of said spaced locations providing a respective dark current signal which is associated with a respective area of said imaging chip, said circuit determining a separate temperature representation for each said area based at least in part on a respective one of said dark current signals.16. An imager device of claim 15 further comprising a circuit for respectively adjusting a plurality of current signals based on a respective separate temperature representation.17. An imager device comprising:a pixel array comprising a plurality of dark pixels, said dark pixels comprising at least one dark pixel for providing a plurality of dark current signals; a memory which stores values comprising a process dependent value and at least one other value related to a reference dark current signal measured at a reference temperature; and a circuit for calculating at least one temperature value based on a sensed dark current value, said process dependent dark current value, and said at least one other value, wherein said sensed dark current value is based on at least one of said plurality of dark pixel signals, and wherein said circuit removes a signal offset present in said plurality of dark current pixel signals prior to using said sensed dark current value to determine said temperature value. 18. An imager device comprising:a pixel array comprising a plurality of dark pixels, said dark pixels comprising at least one dark pixel for providing a plurality of dark current signals; a memory which stores values comprising a process dependent value and at least one other value related to a reference dark current signal measured at a reference temperature; a circuit for calculating at least one temperature value based on a sensed dark current value, said process dependent dark current value, and said at least one other value, wherein said sensed dark current value is based on at least one of said plurality of dark pixel signals; and a circuit for determining a current correction signal based on said temperature value. 19. An imager device of claim 18 further comprising a current multiplication stage for adjusting a first current signal using said current correction signal to produce a second current signal.20. An imager device comprising:a pixel array comprising a plurality of dark pixels, said dark pixels comprising at least one dark pixel for providing a plurality of dark current signals; a memory which stores values comprising a process dependent value and at least one other value related to a reference dark current signal measured at a reference temperature; and a circuit for calculating at least one temperature value based on a sensed dark current value, said process dependent dark current value, and said at least one other value, wherein said sensed dark current value is based on at least one of said plurality of dark pixel signals; wherein said pixel array comprises a plurality of pixel clusters, each cluster comprising at least one said dark pixel for providing a plurality of dark current signals, wherein said circuit calculates a respective temperature value for each of said pixel clusters. 21. An imager device of claim 20 further comprising a circuit for determining at least one current correction signal based on at least one said temperature value.22. An imager device of claim 21 wherein said circuit for determining determines a plurality of current correction signals respectively associated with each said associated temperature value.23. An imager device of claim 21 further comprising a current multiplication stage for adjusting a first current signal using said at least one current correction signal to produce a second current signal.24. An imager device of claim 22 further comprising a plurality of current multiplication stages, each said multiplication stages multiplying an associated first current signal with a respective current correction signal to produce a respective corrected current signal.25. An imager device comprising:means for providing at least one reference pixel signal; means for determining at least one temperature value for said device based on said reference pixel signal, a fabrication process value, and at least one other value related to a reference pixel signal taken from said device at a reference temperature; and means for adjusting a temperature dependent electrical property of said current signal based on a said determined temperature value. 26. An imager device of claim 25 wherein said at least one other value is a chip dependent value.27. An imager device comprising:means for providing a dark current signal; means for providing a representation of temperature using said dark current signal, a fabrication process dependent parameter, and an imaging chip dependent value; and means for adjusting at least one temperature dependant parameter of said device using said temperature representation. 28. An imager of claim 27 wherein said temperature dependent parameter is a current parameter.29. An imager of claim 27 wherein said temperature dependent parameter is an impedance parameter.30. An imager of claim 27 wherein said temperature dependent parameter is a resistance parameter.31. An imager of claim 27 wherein said temperature dependent parameter is a capacitance parameter.32. An imager of claim 27 wherein said temperature dependent parameter is a voltage parameter.33. An imager device of claim 27 wherein said chip dependent value is based on a pixel reference dark current value taken at a reference temperature.34. An imager device of claim 33 further comprising a means for storing said reference dark current value and said reference temperature.35. An imager device of claim 27 wherein said fabrication process value is a value associated with a plurality of imager chips produced by the same fabrication process.36. An imager device of claim 27 further comprising a means for storing said chip dependent value on said imager.37. An imager device of claim 27 further comprising a means for supplying dark current signals which are selectively used by said means for providing a representation to calculate a plurality of said temperature representations, each said dark current signal being associated with at least one circuit used in said imager device.38. An imager device of claim 37 wherein said means for adjusting adjusts a plurality of current parameters of said imager device in accordance with a respective one of said temperature representations.39. An imager device of claim 37 wherein said means for adjusting adjusts a plurality of capacitance parameters of said imager device in accordance with a respective one of said temperature representations.40. An imager device of claim 37 wherein said means for adjusting adjusts a plurality of impedance parameters of said imager device in accordance with a respective one of said temperature representations.41. An imager device of claim 37 wherein said means for adjusting adjusts a plurality of voltage parameters of said imager device in accordance with a respective one of said temperature representations.42. An imager device of claim 37 wherein said means for adjusting adjusts a plurality of resistance parameters of said imager device in accordance with a respective one of said temperature representations.