[특허]Computing apparatus with cooling fan

Sun Microsystems, Inc.

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Computing apparatus with cooling fan

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G06F-001/20
미국특허분류(USC)	361/687; 361/697; 165/080.2
출원번호	US-0146849 (2002-05-16)
발명자 / 주소	Osborn, Jay K. Wilson, Helenaur
출원인 / 주소	Sun Microsystems, Inc.
대리인 / 주소	Meyertons Hood Kivlin Kowert &
인용정보	피인용 횟수 : 5 인용 특허 : 59

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Computing apparatus including a housing that defines a cavity. The computer apparatus further includes within the cavity multiple computing components, such as a processor, memory, and so on, and a fan for generating an airflow to cool these components. There is a first path defining an air inflow for the fan, and a second path defining an air outflow for the fan. One of these paths is externally ducted to a vent facility in a first wall of the housing, and the other one of the paths communicates with the cavity adjacent the first wall. Typically, the ex...

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1. Computing apparatus including:a housing that defines a cavity; multiple computing components within the cavity; a fan within the cavity for cooling the computing components, the fan having an air inlet and an air outlet within the cavity such that air flows from the air inlet through the fan to the air outlet; a vent facility in a first wall of the housing, wherein the vent facility comprises one or more openings to an exterior of the housing to allow air flow between the exterior of the housing and an interior of the housing; and ducting extending between the vent facility and one of the air inlet and the air outlet to define an enclosed path within the cavity between the fan and the vent facility, wherein the other of the air inlet and air outlet is located adjacent the first wall; wherein the fan comprises a centrifugal fan; wherein the enclosed path between the fan and the vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by the ducting to the first wall. 2. The apparatus of claim 1, wherein the vent facility is the only vent facility in the first wall.3. The apparatus of claim 1, further including a second vent facility in a second wall of the housing that communicates with the cavity, wherein the second wall is opposite the first wall.4. The apparatus of claim 3, wherein the first wall is a rear wall of the apparatus, the second wall is a front wall of the apparatus, and the cooling airflow is generally in the direction from the front to the rear of the apparatus.5. The apparatus of claim 4, wherein the ducting extends between the air outlet and the vent facility, thereby directing an air outflow to the rear of the apparatus.6. The apparatus of claim 3, wherein the first wall is a front wall of the apparatus, the second wall is a rear wall of the apparatus, and the cooling airflow is generally in a direction from the front to the rear of the apparatus.7. The apparatus of claim 6, wherein the ducting extends between the air inlet and the vent facility, thereby drawing an air inflow from the front of the apparatus.8. The apparatus of claim 1, wherein a computing component which is a primary heat source within the cavity is positioned in the enclosed path.9. The apparatus of claim 8, wherein the computing component which is the primary heat source is a central processing unit (CPU).10. The apparatus of claim 9, wherein the CPU is attached to a heat sink which is positioned in the enclosed path.11. The apparatus of claim 9, wherein the fan is geometrically located between the CPU and the first wall.12. The apparatus of claim 1, wherein the cavity is generally cuboid in form, and the dimension perpendicular to the first wall represents the longest dimension of the cavity.13. The apparatus of claim 12, wherein the longest dimension is from the front to the back of the apparatus, and the cooling airflow travels generally from the front to the back of the apparatus.14. The apparatus of claim 1, wherein the fan comprises a centrifugal fan.15. The apparatus of claim 1, wherein the fan comprises the sole fan within the cavity.16. The apparatus of claim 1, wherein the computing components are generally attached to a card adjacent to or forming a third wall of the housing perpendicular to the first wall, and wherein the ducting is attached or adjacent to a fourth wall of the housing opposite the third wall.17. The apparatus of claim 1, wherein the enclosed path between the fan and the vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by the ducting to the first wall.18. The apparatus of claim 1, wherein the other of the air inlet and air outlet that is located adjacent the first wall communicates with the cavity via an internal duct.19. The apparatus of claim 1, wherein the apparatus comprises the system unit of a personal computer.20. The apparatus of claim 1, wherein the apparatus comprises a blade for use in a rack-mounted computing system.21. Computing apparatus including:a housing that defines a cavity; multiple computing components within the cavity; a fan within the cavity for generating a cooling airflow for the computing components, the fan having an air inlet and an air outlet within the cavity such that air flows from the air inlet through the fan to the air outlet; a first vent facility in a rear wall of the housing; ducting extending between the first vent facility and the air outlet to define an enclosed path within the cavity between the fan and the first vent facility, wherein the air inlet is located adjacent the rear wall; and a second vent facility in a front wall of the housing that communicates with the cavity, whereby the cooling airflow is generally in the direction from the front to the rear of the apparatus; wherein the fan comprises a centrifugal fan; wherein the enclosed path between the fan and the first vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by the ducting to the first wall. 22. The computing apparatus of claim 21, further comprising a CPU positioned within the enclosed path.23. A blade for use in a rack-mounted server, the blade including:a housing that defines a cavity; multiple computing components within the cavity; a fan within the cavity for generating a cooling airflow for the computing components, the fan having an air inlet and an air outlet within the cavity such that air flows from the air inlet through the fan to the air outlet; a first vent facility in a rear wall of the housing; ducting extending between the first vent facility and the air outlet to define an enclosed path within the cavity between the fan and the first vent facility past a CPU included within the blade, wherein the air inlet is located adjacent the rear wall; and a second vent facility in a front wall of the housing that communicates with the cavity, whereby the cooling airflow is generally in the direction from the front to the rear of the blade; wherein the fan comprises a centrifugal fan; wherein the enclosed path between the fan and the first vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by the ducting to the first wall. 24. A method for cooling computing apparatus, the computer apparatus including a housing that defines a cavity and multiple computing components within the cavity, and a vent facility in a first wall of the housing, wherein the vent facility comprises one or more openings to an exterior of the housing to allow air flow between the exterior of the housing and an interior of the housing, the method comprising:generating with a fan within the cavity an airflow to cool the computing components, the fan having an air inlet and an air outlet within the cavity such that air flows from the air inlet through the fan to the air outlet; and defining an enclosed path within the cavity between the fan and the vent facility by providing ducting extending between the vent facility and one of the air inlet and the air outlet, wherein the other of the air inlet and air outlet is located adjacent the first wall; wherein the fan comprises a centrifugal fan; wherein the enclosed path between the fan and the vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by the ducting to the first wall. 25. The method of claim 24, wherein the vent facility is the only vent facility in the first wall.26. The method of claim 24, further including providing a second vent facility in a second wall of the housing that communicates with the cavity, wherein the second wall is opposite the first wall.27. The method of claim 26, wherein the first wall is a rear wall of the apparatus, the second wall is a front wall of the apparatus, and the cooling airflow is generally in the direction from the front to the rear of the apparatus.28. The method of claim 27, wherein the ducting extends between the air outlet and the vent facility, thereby directing an air outflow to the rear of the apparatus.29. The method of claim 26, wherein the first wall is a front wall of the apparatus, the second wall is a rear wall of the apparatus, and the cooling airflow is generally in the direction from the front to the rear of the apparatus.30. The method of claim 29, wherein the ducting extends between the air inlet and the vent facility, thereby drawing an air inflow from the front of the apparatus.31. The method of claim 24, wherein a computing component which is a primary heat source within the cavity is positioned in the enclosed path.32. The method of claim 31, wherein the computing component which is the primary heat source is a central processing unit (CPU).33. The method of claim 32, wherein the CPU is attached to a heat sink which is positioned in the enclosed path.34. The method of claim 33, wherein the fan is geometrically located between the CPU and the first wall.35. The method of claim 24, wherein the cavity is generally cuboid in form, and a dimension perpendicular to the first wall represents a longest dimension of the cavity.36. The method of claim 35, wherein the longest dimension is from the front to the rear of the apparatus, and the cooling airflow travels generally from the front to the rear of the apparatus.37. The method of claim 24, wherein the fan comprises the sole fan within the cavity.38. The method of claim 24, wherein the computing components are generally attached to a card adjacent to or forming a third wall of the housing perpendicular to the first wall, and wherein the ducting is attached or adjacent to a fourth wall of the housing opposite the third wall.39. The method of claim 24, wherein the other of the air inlet and air outlet that is located adjacent the first wall communicates with the cavity via an internal duct.40. The method of claim 24, wherein the computing apparatus comprises the system unit of a personal computer.41. The method of claim 24, wherein the computing apparatus comprises a blade for use in a rack-mounted computing system.42. A computing apparatus, comprising:a housing that defines a cavity, wherein the housing comprises a vent facility in a first wall of the housing, wherein the vent facility comprises one or more openings to an exterior of the housing to allow air flow between the exterior of the housing and an interior of the housing; a plurality of computing components; a fan for generating an airflow to cool the plurality of computing components wherein the plurality of computing components and the fan are located within the cavity; and wherein the fan includes a first path defining an air inflow and a second path defining an air outflow, wherein one of the first path and second paths is ducted to the vent facility in the first wall of the housing, and the other one of the first path and second paths communicates with the cavity, wherein the one of the first path and second paths that is ducted to the vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by ducting to the first wall. 43. A method of cooling a computing apparatus, comprising:generating an airflow with a fan to cool the computing apparatus, wherein the airflow comprises a first path of air inflow, and a second path of air outflow; ducting one of the first path and second paths to a vent facility in a first wall of a housing; wherein the vent facility comprises one or more openings to an exterior of the housing to allow air flow between the exterior of the housing and an interior of the housing, wherein the other one of the first and second paths communicates with the cavity, wherein the one of the first and second paths that is ducted to the vent facility in the first wall starts from the fan in a general direction away from the first wall, and then is guided back by ducting to the first wall; and wherein the housing includes a cavity, and wherein the cavity includes multiple computing components of the computing apparatus.

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Computing apparatus with cooling fan

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