IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0339737
(2003-01-08)
|
발명자
/ 주소 |
- Arthur, Alan R
- Edmonds, Heather
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출원인 / 주소 |
- Hewlett-Packard Development Company, L.P.
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인용정보 |
피인용 횟수 :
18 인용 특허 :
7 |
초록
▼
A thermally efficient resistive heater assembly for heating a source substance for generation of gas has a chamber for containing the source substance, a thin resistive heating element suspended across an aperture and disposed for immersion in the source substance, and conductive traces electrically
A thermally efficient resistive heater assembly for heating a source substance for generation of gas has a chamber for containing the source substance, a thin resistive heating element suspended across an aperture and disposed for immersion in the source substance, and conductive traces electrically coupled to the thin resistive heating element. The resistive heater assembly may be fabricated by a specially adapted method including providing a first substrate layer, bonding to it a second substrate layer, the second substrate layer bearing the resistive heating element and conductive traces, bonding to that an optional hydrophobic layer if necessary, and bonding to the previous layer a top layer. At least one of the layers may include manifolding for the gas. All or part of the fabrication method may be performed as a reel-to-reel process.
대표청구항
▼
1. A resistive heater assembly for heating a source substance for generation of gas from the source substance, the resistive heater assembly comprising:a) a first substrate layer;b) a second substrate layer, a resistive heating element, and conductive traces electrically coupled to the resistive hea
1. A resistive heater assembly for heating a source substance for generation of gas from the source substance, the resistive heater assembly comprising:a) a first substrate layer;b) a second substrate layer, a resistive heating element, and conductive traces electrically coupled to the resistive heating element, the second substrate layer bearing the resistive heating element and the conductive traces, and the second substrate layer being bonded to the first substrate layer;c) a hydrophobic layer bonded to the second substrate layer; andd) a top layer bonded to the hydrophobic layer,at least one layer of the heater assembly including a manifolding for the gas.2. The resistive heater assembly of claim 1, further comprising a first bonding layer laminated between the second substrate layer and the first substrate layer.3. The resistive heater assembly of claim 2, wherein the first bonding layer comprises a thermosetting resin.4. The resistive heater assembly of claim 2, wherein the first bonding layer comprises a phenolic resin.5. The resistive heater assembly of claim 2, wherein the first bonding layer comprises an epoxy material.6. The resistive heater assembly of claim 2, further comprising a second bonding layer laminated between the second substrate layer and the hydrophobic layer.7. The resistive heater assembly of claim 1, further comprising a second bonding layer laminated between the second substrate layer and the hydrophobic layer.8. The resistive heater assembly of claim 7, wherein the second bonding layer comprises a thermosetting resin.9. The resistive heater assembly of claim 7, wherein the second bonding layer comprises a phenolic resin.10. The resistive heater assembly of claim 7, wherein the first bonding layer comprises an epoxy material.11. The resistive heater assembly of claim 1, wherein the second substrate layer comprises a medial layer having first and second sides, the resistive heating element is on the first side thereof, the conductive traces are on the second side thereof, and openings extend through the medial layer, the conductive traces being electrically coupled to the resistive heating element by conductive material disposed in the openings extending through the medial layer.12. The resistive heater assembly of claim 11, wherein the first side of the medial layer of the second substrate layer is bonded to the first substrate layer.13. The resistive heater assembly of claim 11, wherein the first side of the medial layer of the second substrate layer is bonded to the hydrophobic layer.14. The resistive heater assembly of claim 11, wherein the second side of the medial layer of the second substrate layer is bonded to the first substrate layer.15. The resistive heater assembly of claim 11, wherein the second side of the medial layer of the second substrate layer is bonded to the hydrophobic layer.16. The resistive heater assembly of claim 1, wherein the resistive heating element borne by the second substrate layer is substantially centered within the resistive heater assembly.17. The resistive heater assembly of claim 1, wherein the resistive heating element borne by the second substrate layer further comprises a catalytic layer for catalyzing a gas-generation reaction and a thermally removable coating covering the catalytic layer.18. The resistive heater assembly of claim 17, wherein the catalytic layer comprises a metal selected from the list consisting of ruthenium, platinum, and nickel.19. The resistive heater assembly of claim 17, wherein the thermally removable coating comprises a sublimable substance.20. The resistive heater assembly of claim 17, wherein the thermally removable coating comprises a polymer.21. The resistive heater assembly of claim 17, wherein the thermally removable coating comprises paraffin.22. The resistive heater assembly of claim 1, wherein the resistive heating element borne by the second substrate layer further comprises:a transition metal suitably patterned and adapted to provide resistive heating, a ruthenium plating on the transition metal to provide a catalytic layer, and a polymer coated on the catalytic layer adapted to provide a thermally removable coating.23. The resistive heater assembly of claim 1, wherein the resistive heating element borne by the second substrate layer comprises a thin film patterned in a serpentine pattern.24. The resistive heater assembly of claim 1, wherein the resistive heating element borne by the second substrate layer comprises a substance selected from the list consisting of tantalum-aluminum alloy, nickel-chromium alloy, tungsten-silicon-nitride, copper, aluminum, copper-aluminum, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, nickel, palladium, platinum, silver, gold, silicon, and alloys and mixtures thereof.25. The resistive heater assembly of claim 1, wherein the first substrate layer comprises a substance selected from the list consisting of polyester, polyimide, polyether ether ketone (PEEK), and poly(etherimide) (PEI).26. The resistive heater assembly of claim 1, wherein the second substrate layer comprises a substance selected from the list consisting of polyester, polyimide, polyether ether ketone (PEEK), and poly(etherimide) (PEI).27. The resistive heater assembly of claim 1, wherein the hydrophobic layer comprises a substance selected from the list consisting of polytetrafluoroethylene (PTFE), expanded PTFE, fibrillated PTFE, and microporous PTFE.28. The resistive heater assembly of claim 1, wherein the top layer includes manifolding for the gas.29. The resistive heater assembly of claim 1, wherein the top layer comprises a plurality of sub-layers.30. The resistive heater assembly of claim 1, wherein one sub-layer of the plurality of sub-layers of the top layer includes the manifolding for the gas.31. A resistive heater assembly for heating a source substance for generation of gas from the source substance, the resistive heater assembly comprising:a) a first substrate layer;b) a second substrate layer, a resistive heating element, and conductive traces electrically coupled to the resistive element, the second substrate layer bearing the resistive heating element and the conductive traces, and the second substrate layer being bonded to the first substrate layer;c) a hydrophobic layer bonded to the second substrate layer; andd) a top layer bonded to the hydrophobic layer,at least one layer of the heater assembly including a manifolding for the gas and the resistive heating element borne by the second substrate layer being substantially centered within the resistive heater assembly.
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