Wireless communication devices and methods of forming and operating the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H04Q-005/22
H01L-023/28
H01L-023/34
출원번호
US-0570365
(2000-04-13)
발명자
/ 주소
Dando, Ross S.
출원인 / 주소
Micron Technology, Inc.
대리인 / 주소
Wells St. John, P.S.
인용정보
피인용 횟수 :
5인용 특허 :
39
초록▼
Wireless communication devices and methods of forming and operating the same are provided. The present invention provides a wireless communication device including a substrate having a support surface, wireless communication circuitry upon the support surface of the substrate, at least one antenna e
Wireless communication devices and methods of forming and operating the same are provided. The present invention provides a wireless communication device including a substrate having a support surface, wireless communication circuitry upon the support surface of the substrate, at least one antenna electrically coupled with the wireless communication circuitry, a conductive layer configured to interact with the antenna, and an insulative layer intermediate the conductive layer and the antenna. A method of forming a wireless communication device includes providing a substrate having a support surface, forming an antenna upon the support surface, conductively coupling wireless communication circuitry with the antenna, forming an insulative layer over at least a portion of the antenna, and providing a conductive layer over at least a portion of the insulative layer.
대표청구항▼
1. A radio frequency identification device comprising:a substrate having a support surface;wireless communication circuitry upon the support surface of the substrate;at least one antenna electrically coupled with the wireless communication circuitry;a conductive layer configured to interact with the
1. A radio frequency identification device comprising:a substrate having a support surface;wireless communication circuitry upon the support surface of the substrate;at least one antenna electrically coupled with the wireless communication circuitry;a conductive layer configured to interact with the at least one antenna;an insulative layer intermediate the conductive layer and the at least one antenna; andwherein the at least one antenna and conductive layer include respective peripheral edges and the peripheral edges of the at least one antenna are provided within the confines of the peripheral edges of the conductive layer.2. The device according to claim 1 wherein the wireless communication circuitry is intermediate the at least one antenna and the conductive layer.3. The device according to claim 1 further comprising a housing configured to encapsulate the wireless communication circuitry.4. The device according to claim 3 wherein the housing includes the substrate.5. The device according to claim 1 wherein the insulative layer is over substantially the entire support surface and the conductive layer is over substantially the entire insulative layer.6. The device according to claim 1 further comprising a power source having plural terminals coupled with the wireless communication circuitry.7. The device according to claim 6 further comprising an electrical connection provided through the insulative layer and operable to conductively couple the conductive layer and one of the terminals of the power source.8. The device according to claim 1 wherein the insulative layer forms a first encapsulant layer operable to envelope the wireless communication circuitry, the at least one antenna and the support surface.9. The device according to claim 8 further comprising a second encapsulant layer over the conductive layer.10. The device according to claim 9 wherein the first and second encapsulant layers and the substrate form a substantially solid housing.11. The device according to claim 1 wherein the wireless communication circuitry comprises transponder circuitry configured to transmit an identification signal responsive to receiving a polling signal.12. The device according to claim 1 further comprising a processor operable to process signals received via the at least one antenna.13. The device according to claim 1 wherein the at least one antenna defines a plane, the conductive layer is substantially planar, and the conductive layer is substantially parallel to the plane defined by the at least one antenna.14. The device according to claim 1 wherein the at least one antenna is operable to receive wireless communication signals and the conductive layer is configured to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.15. The device according to claim 1 wherein the conductive layer comprises a ground plane configured to electromagnetically interact with the at least one antenna.16. A remote intelligent communication device comprising:a substrate having a support surface;a conductive trace formed upon the support surface and including at least one antenna configured to at least one of transmit and receive wireless communication signals;transponder circuitry bonded to the support surface and electrically coupled with the conductive trace;a first encapsulant layer encapsulating the transponder circuitry and the at least one antenna with at least a portion of the substrate;a conductive layer positioned upon the first encapsulant layer to interact with the at least one antenna; anda second encapsulant layer over the conductive layer and forming a substantially solid housing with the substrate and the first encapsulant layer.17. The remote intelligent communication device according to claim 16 further comprising a power source coupled with the transponder circuitry.18. The remote intelligent communication device according to claim 16 further comprising an electrical connection through the first encapsulant layer coupling the conductive layer and the conductive trace.19. The remote intelligent communication device according to claim 16 further comprising a processor operable to process at least some of the wireless communication signals.20. The remote intelligent communication device according to claim 16 wherein the transponder circuitry is configured to transmit an identification signal responsive to receiving a polling signal.21. The remote intelligent communication device according to claim 16 wherein the conductive layer is configured to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.22. The remote intelligent communication device according to claim 21 further comprising an electrical connection conductively coupling the conductive layer with at least one terminal of the power source.23. The remote intelligent communication device according to claim 16 wherein the transponder circuitry is intermediate the at least one antenna and the conductive layer.24. The remote intelligent communication device according to claim 16 wherein the first encapsulant layer contacts the transponder circuitry and the at least one antenna.25. A radio frequency identification device configured to receive wireless communication signals comprising:a lower housing;at least one antenna upon the lower housing;transponder circuitry provided upon the lower housing and coupled with the at least one antenna;a power source having plural terminals electrically and conductively bonded with the transponder circuitry;an insulative layer over the at least one antenna; anda conductive layer over the at least one antenna.26. The radio frequency identification device according to claim 25 further comprising an electrical connection conductively coupling the conductive layer with at least one terminal of the power source.27. The radio frequency identification device according to claim 25 further comprising an upper housing portion over the conductive layer.28. The radio frequency identification device according to claim 27 wherein the lower housing, the insulative layer, and the upper housing provide a substantially solid housing.29. The radio frequency identification device according to claim 25 further comprising a processor coupled with the transponder circuitry and operable to process at least some of the wireless communication signals.30. The radio frequency identification device according to claim 25 wherein the transponder circuitry is configured to transmit an identification signal responsive to receiving a polling signal.31. The radio frequency identification device according to claim 25 wherein the conductive layer is positioned to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.32. The radio frequency identification device according to claim 25 wherein the transponder circuitry is intermediate the at least one antenna and the conductive layer.33. A method of operating a wireless communication device comprising:coupling an antenna with wireless communication circuitry intermediate the antenna and a conductive layer;receiving wireless communication signals using the wireless communication circuitry;transmitting wireless communication signals using the wireless communication circuitry; andinteracting the conductive layer with the antenna.34. The method of operating a wireless communication device according to claim 33 further comprising processing some of the wireless communication signals.35. The method of operating a wireless communication device according to claim 33 wherein the interacting comprises:shielding some of the wireless communication signals from the antenna; andreflecting others of the wireless communication signals toward the substrate and the antenna thereover.36. The method of operating a wireless communication device according to claim 33 wherein the transmitting comprises transmitting an identification signal responsive to receiving a polling signal.37. The method of operating a wireless communication device according to claim 33 further comprising:supplying operational power to the wireless communication circuitry using a power source; andelectrically grounding the conductive layer using the power source.38. A method of operating a radio frequency identification device comprising:providing an antenna upon a substrate;coupling transponder circuitry with the antenna;using the antenna and transponder circuitry, at least one of transmitting and receiving wireless communication signals;providing a ground plane with the transponder circuitry intermediate the antenna and the ground plane; andinteracting the ground plane with the antenna comprising:shielding some of the wireless communication signals from the antenna; andreflecting others of the wireless communication signals toward the substrate and the antenna thereover.39. The method of operating a radio frequency identification device according to claim 38 further comprising:supplying operational power to the wireless communication circuitry using a power source; andelectrically grounding the conductive layer using the power source.40. The method of operating a radio frequency identification device according to claim 38 further comprising processing at least some of the wireless communication signals.41. A method of forming a wireless communication device comprising:providing a substrate having a support surface;forming an antenna upon the support surface;conductively coupling wireless communication circuitry with the antenna;forming an insulative layer over at least a portion of the antenna; andproviding a conductive layer over at least a portion of the insulative layer.42. The method of forming a wireless communication device according to claim 41 further comprising electrically grounding the conductive layer.43. The method of forming a wireless communication device according to claim 41 further comprising providing electrical conductivity through the insulative layer.44. The method of forming a wireless communication device according to claim 41 further comprising:providing a power source; andcoupling the conductive layer with a terminal of the power source.45. The method of forming a wireless communication device according to claim 44 wherein the coupling comprises providing a conductive post.46. The method of forming a wireless communication device according to claim 44 wherein the coupling comprises dispensing conductive material.47. The method of forming a wireless communication device according to claim 41 wherein the providing the conductive layer comprises providing the conductive layer over substantially the entire support surface.48. The method of forming a wireless communication device according to claim 41 wherein the providing of the conductive layer includes positioning the conductive layer to interact with the antenna.49. The method of forming a wireless communication device according to claim 41 further comprising removing a portion of the insulative layer providing a substantially planar insulative layer having a predetermined thickness.50. The method of forming a wireless communication device according to claim 41 wherein the forming of the insulative layer comprises encapsulating the antenna, the wireless communication circuitry and at least a portion of the support surface.51. The method of forming a wireless communication device according to claim 41 further comprising encapsulating at least a portion of the conductive layer with an encapsulant.52. The method of forming a wireless communication device according to claim 51 wherein the encapsulant, the substrate, and insulative layer form a substantially solid device.53. The method of forming a wireless communication device according to claim 41 wherein the wireless communication device comprises a remote intelligent communication device.54. The method of forming a wireless communication device according to claim 41 wherein the wireless communication device comprises a radio frequency identification device.55. A method of forming a radio frequency identification device comprising:providing a substrate having a support surface;printing an antenna over the support surface configured to at least one of transmit and receive wireless communication signals;conductively bonding transponder circuitry with the antenna;first encapsulating the antenna and the transponder circuitry forming a first encapsulant layer;providing a conductive layer upon at least a portion of the encapsulant layer; andsecond encapsulating the conductive layer forming a second encapsulant layer.56. The method of forming a radio frequency identification device according to claim 55 further comprising removing some of the first encapsulant layer providing a substantially planar first encapsulant layer having a predetermined thickness.57. The method of forming a radio frequency identification device according to claim 55 further comprising providing the conductive layer over the antenna.58. The method of forming a radio frequency identification device according to claim 55 further comprising coupling a processor with the transponder circuitry.59. The method of forming a radio frequency identification device according to claim 55 further comprising electrically grounding the conductive layer.60. The method of forming a radio frequency identification device according to claim 55 further comprising conductively bonding a power source with the transponder circuitry.61. The method of forming a radio frequency identification device according to claim 55 wherein the first encapsulant layer, the second encapsulant layer, and the substrate form a substantially solid device.62. A method of forming a radio frequency identification device comprising:providing a substrate having a support surface;printing a conductive trace comprising a plurality of terminal connections and first and second antennas upon the support surface, the first antenna being configured to transmit wireless signals and the second antenna being configured to receive wireless signals;conductively bonding a battery with the terminal connections;conductively bonding transponder circuitry with the terminal connections and the first and second antennas;coupling a processor with the transponder circuitry;providing an electrical connection comprising one of dispensing conductive material and providing a conductive post;first encapsulating the first and second antennas, the battery, the transponder circuitry, the processor, the electrical connection, and at least a portion of the support surface, the first encapsulating forming a first encapsulant layer;removing some of the first encapsulant layer providing a substantially planar first encapsulant layer having a predetermined thickness;providing a ground plane upon the first encapsulant layer and over substantially the entire support surface, the providing of the ground plane including positioning the ground plane to interact with the antennas;electrically coupling the ground plane with one of the terminal connections using the electrical connection; andsecond encapsulating the ground plane forming a second encapsulant layer and a substantially solid device with the substrate and the first encapsulant layer.63. A wireless communication device comprising:a housing;an antenna coupled with the housing and configured to at least one of output wireless signals and receive wireless signals;wireless communication circuitry coupled with the housing and the antenna; anda ground plane coupled with the housing and configured to enhance wireless communications via the antenna, the wireless communication circuitry being positioned intermediate the ground plane and the antenna.64. The device according to claim 63 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.65. The device according to claim 63 wherein the antenna, the ground plane, the wireless communication circuitry, and the housing provide a substantially void-free wireless communication device.66. The device according to claim 63 wherein the housing comprises a substrate and at least one encapsulant layer.67. The device according to claim 66 wherein the at least one encapsulant layer contacts at least respective portions of the antenna, the wireless communication circuitry and the ground plane.68. The device according to claim 63 wherein the housing comprises an encapsulant layer intermediate the ground plane and a substrate.69. A wireless communication device comprising:a substrate having a support surface;an antenna elevationally over the support surface and configured to at least one of output wireless signals and receive wireless signals;wireless communication circuitry elevationally over the antenna and coupled with the antenna; anda ground plane elevationally over the wireless communication circuitry and configured to interact with the antenna.70. The device according to claim 69 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.71. The device according to claim 69 further comprising at least one encapsulant layer.72. The device according to claim 71 wherein the antenna, the ground plane, the wireless communication circuitry, and the at least one encapsulant layer provide a substantially void-free wireless communication device.73. The device according to claim 71 wherein the at least one encapsulant layer contacts at least respective portions of the antenna, the wireless communication circuitry and the ground plane.74. A wireless communication device comprising:an antenna configured to at least one of output wireless signals and receive wireless signals;a ground plane configured to enhance wireless communications via the antenna;wireless communication circuitry coupled with the antenna;a housing configured to encapsulate and contact at least respective portions of the antenna, the wireless communication circuitry and the ground plane; andwherein the antenna, the ground plane, the wireless communication circuitry, and the housing provide a substantially void-free wireless communication device.75. The device according to claim 74 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.76. The device according to claim 74 wherein the housing comprises a substrate and at least one encapsulant layer.77. The device according to claim 74 wherein the housing comprises an encapsulant layer intermediate the ground plane and a substrate.78. The device according to claim 74 wherein the wireless communication circuitry is positioned intermediate the antenna and the ground plane.79. A method of forming a wireless communication device comprising:providing an antenna configured to at least one of output wireless signals and receive wireless signals;positioning a ground plane to enhance wireless communications via the antenna;providing wireless communication circuitry intermediate the antenna and the ground plane; andcoupling the wireless communication circuitry with the antenna.80. The method according to claim 79 wherein the providing the wireless communication circuitry comprises providing radio frequency identification device circuitry.81. The method according to claim 79 further comprising encapsulating the antenna, the ground plane and the wireless communication circuitry.82. The method according to claim 81 wherein the encapsulating comprises providing a substantially void-free wireless communication device.83. The method according to claim 81 wherein the encapsulating comprises contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane with at least one encapsulant layer.84. A method of forming a wireless communication device comprising:providing a substrate having a support surface;providing an antenna configured to at least one of output wireless signals and receive wireless signals elevationally over the support surface;positioning wireless communication circuitry elevationally over the antenna;coupling the wireless communication circuitry with the antenna; andpositioning a ground plane elevationally over the wireless communication circuitry to enhance wireless communications via the antenna.85. The method according to claim 84 wherein the providing the wireless communication circuitry comprises providing radio frequency identification device circuitry.86. The method according to claim 84 further comprising encapsulating the antenna, the ground plane and the wireless communication circuitry.87. The method according to claim 86 wherein the encapsulating comprises providing a substantially void-free wireless communication device.88. The method according to claim 86 wherein the encapsulating comprises contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane with at least one encapsulant layer.89. A method of forming a wireless communication device comprising:providing an antenna configured to at least one of output wireless signals and receive wireless signals;coupling wireless communication circuitry with the antenna;providing a ground plane to enhance wireless communications via the antenna;providing a housing encapsulating and contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane; andwherein the providing the ground plane provides the wireless communication circuitry intermediate the antenna and the ground plane.90. The method according to claim 89 wherein the coupling wireless communication circuitry comprises coupling radio frequency identification device circuitry.91. The method according to claim 89 wherein the providing the housing comprises providing a substantially void-free wireless communication device.92. A radio frequency identification device comprising:a substrate having a support surface;wireless communication circuitry upon the support surface of the substrate;at least one antenna electrically coupled with the wireless communication circuitry;a conductive layer configured to interact with the at least one antenna;an insulative layer intermediate the conductive layer and the at least one antenna; andwherein the wireless communication circuitry is intermediate the at least one antenna and the conductive layer.93. A radio frequency identification device comprising:a substrate having a support surface;wireless communication circuitry upon the support surface of the substrate;at least one antenna electrically coupled with the wireless communication circuitry;a conductive layer configured to interact with the at least one antenna;an insulative layer intermediate the conductive layer and the at least one antenna; andwherein the insulative layer is over substantially the entire support surface and the conductive layer is over substantially the entire insulative layer.94. A radio frequency identification device comprising:a substrate having a support surface;wireless communication circuitry upon the support surface of the substrate;at least one antenna electrically coupled with the wireless communication circuitry;a conductive layer configured to interact with the at least one antenna;an insulative layer intermediate the conductive layer and the at least one antenna;a power source having plural terminals coupled with the wireless communication circuitry; andan electrical connection provided through the insulative layer and operable to conductively couple the conductive layer and one of the terminals of the power source.95. A wireless communication device comprising:an antenna configured to at least one of output wireless signals and receive wireless signals;a ground plane configured to enhance wireless communications via the antenna;wireless communication circuitry coupled with the antenna;a housing configured to encapsulate and contact at least respective portions of the antenna, the wireless communication circuitry and the ground plane; andwherein the housing comprises an encapsulant layer intermediate the ground plane and a substrate.96. A wireless communication device comprising:an antenna configured to at least one of output wireless signals and receive wireless signals;a ground plane configured to enhance wireless communications via the antenna;wireless communication circuitry coupled with the antenna;a housing configured to encapsulate and contact at least respective portions of the antenna, the wireless communication circuitry and the ground plane; andwherein the wireless communication circuitry is positioned intermediate the antenna and the ground plane.97. A method of forming a wireless communication device comprising:providing an antenna configured to at least one of output wireless signals and receive wireless signals;coupling wireless communication circuitry with the antenna;providing a ground plane to enhance wireless communications via the antenna;providing a housing encapsulating and contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane; andwherein the providing the housing comprises providing a substantially void-free wireless communication device.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (39)
Krenz Eric L. (Schaumburg IL) Phillips James P. (Lake in the Hills IL) Vannatta Louis J. (Crystal Lake IL), Antenna coupling apparatus for cordless telephone.
Brady Michael J. ; Cofino Thomas A. ; Gambino Richard J. ; Moskowitz Paul A. ; Schrott Alejandro G. ; von Gutfeld Robert J., Combination radio frequency transponder (RF Tag) and magnetic electronic article surveillance (EAS) material.
Shober R. Anthony (Red Bank NJ) Vannucci Giovanni (Middletown Township NJ) Wright Gregory Alan (Colts Neck NJ), Dual mode modulated backscatter system.
MacLellan John Austin (Aberdeen NJ) Shober R. Anthony (Red Bank NJ) Vannucci Giovanni (Middletown NJ) Wright Gregory Alan (Colts Neck NJ), Full duplex modulated backscatter system.
Gloton Jean-Pierre (La Ciotat FRX) Laroche Damien (Chateauneuf le Rouge FRX) Turin Joel (Marseille FRX) Fallah Michel (Carnoux FRX), Integrated circuit micromodule obtained by the continuous assembly of patterned strips.
Khorrami Farshad ; Das Nirod K., Integrated micro-strip antenna apparatus and a system utilizing the same for wireless communications for sensing and act.
Clifton Mark B. (Robbinsville NJ) Flynn Richard M. (Noblesville IN) Verdi Fred W. (Lawrenceville NJ), Method for fabricating thin, strong, and flexible die for smart cards.
Chan Shun S. (Flushing NY) Heinrich Harley K. (Brewster NY) Kandlur Dilip D. (Briarcliff Manor NY) Krishna Arvind (Briarcliff Manor NY), Multiple item radio frequency tag identification protocol.
Thomas Michael D. (Thousand Oaks CA) Wolfson Ronald I. (Los Angeles CA) Glaser Jerome I. (Los Angeles CA) Smalanskas Joseph P. (Westchester CA) Hunter Shane H. (Redondo Beach CA) Tran Allen M. (Torra, Radiator bandwidth enhancement using dielectrics with inverse frequency dependence.
Siwiak Kazimierz (Coral Springs FL) Kuznicki William J. (Coral Springs FL), Radio communication device having a microstrip antenna with integral receiver systems.
Moskowitz Paul A. (Yorktown Heights NY) Brady Michael J. (Brewster NY) Coteus Paul W. (Yorktown Heights NY), Radio frequency circuit and memory in thin flexible package.
Brady Michael John (Brewster NY) Cofino Thomas (Rye NY) Heinrich Harley Kent (Brewster NY) Johnson Glen Walden (Yorktown Heights NY) Moskowitz Paul Andrew (Yorktown Heights NY) Walker George Frederic, Radio frequency identification tag.
Smith Freddie W., Wireless communication and identification packages, communication systems, methods of communicating, and methods of forming a communication device.
Tuttle,Mark E., Communication devices, remote intelligent communication devices, electronic communication devices, methods of forming remote intelligent communication devices and methods of forming a radio frequency.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.