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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Thermal solution for electronic devices

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/704; 165/185; 257/712; 257/715; 257/E23.11; 257/E23.114; 361/700; 361/719
출원번호 US-0722364 (2003-11-25)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Waddey &
인용정보 피인용 횟수 : 40  인용 특허 : 16
초록

A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.

대표
청구항
▼

What is claimed is: 1. A thermal dissipation and shielding system for an electronic device, comprising: an electronic device comprising a first component which comprises a heat source, wherein the first component transmits heat to an external surface of the electronic device; a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and the external surface of the electronic device, wherein ...

이 특허에 인용된 특허 (16)

  1. Suzuki Masahiro,JPX. Cooling system for electronic packages. USP2000086105662.
  2. Mercuri Robert Angelo ; Capp Joseph Paul ; Gough Jeffrey John. Flexible graphite composite. USP1999055902762.
  3. Tzeng Jing-Wen ; Getz ; Jr. George ; Weber Thomas William. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner. USP2001066245400.
  4. Richey ; III Joseph B.. Flexible heat transfer device and method. USP2000106131651.
  5. Norley, Julian; Tzeng, Jing-Wen; Klug, Jeremy. Graphite-based heat sink. USP2003016503626.
  6. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA). Heat sink. USP1995025390734.
  7. Kobayashi Takashi,JPX ; Nonaka Takashi,JPX. Heat sink assembly including flexible heat spreader sheet. USP1999115991155.
  8. Arnold Judson V. ; Peoples James R. ; McKague Elbert L.. High heat density transfer device. USP1998105825624.
  9. Fujiwara, Norio; Fukukawa, Yoshihiro. Information processing apparatus. USP2004086771495.
  10. Greinke Ronald A. (Medina OH) Mercuri Robert A. (Seven Hills OH) Beck Edgar J. (Fairview Park OH). Intercalation of graphite. USP1990014895713.
  11. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX). Mounting for printed circuits forming a heat sink with controlled expansion. USP1989104878152.
  12. Smalc, Martin D.. Radial finned heat sink. USP2003036538892.
  13. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH). Semiconductor cooling apparatus. USP1993065224030.
  14. Fujiwara Norio,JPX ; Akiba Yasuhiro,JPX ; Watanabe Tetsuyuki,JPX ; Nishiki Naomi,JPX. Thermal conductive unit and thermal connection structure using the same. USP2001076257328.
  15. Jing Wen Tzeng. Thermal management system. USP2002116482520.
  16. Bergerson Steven E.. Thermally conductive filled polymer composites for mounting electronic devices and method of application. USP2000076090484.

이 특허를 인용한 특허 피인용횟수: 40

  1. Wayman, Michael J.. Apparatus for spreading heat over a finned surface. USP2011118051896.
  2. Wayman, Michael J.; Nelson, Michael J.. Apparatus for transferring heat in a fin of a heat sink. USP2012088235094.
  3. Hill, Richard F.; Riaz, Shahi. Assemblies and methods for dissipating heat from handheld electronic devices. USP2013078477499.
  4. Hill, Richard F.; Riaz, Shahi. Assemblies and methods for dissipating heat from handheld electronic devices. USP2016029258928.
  5. Hill, Richard F.; Smythe, Robert Michael. Compliant multilayered thermally-conductive interface assemblies. USP2015129222735.
  6. Huang, Kung-Shiuh; Huang, Kuan-Tsae; Wu, June. Configurable heat conducting path for portable electronic device. USP2018039930785.
  7. Park,Jong Hoon. Cooling device for folder type portable wireless terminal. USP2008087417863.
  8. Rugg, William L.. Dissipating heat during device operation. USP2017079715904.
  9. Rugg, William L.. Dissipating heat during device operation. USP2016039282681.
  10. Pierce, Amber M.; Bowers, Morris B.; Cole, Adam R.; Thiruppukuzhi, Srikanth V.. Electronic device assembly with compression gasket. USP2016089411385.
  11. Nguyen, My N.; Brandi, Jason; Barriau, Emilie. Electronic devices assembled with heat absorbing and/or thermally insulating composition. USP2015129223363.
  12. Nguyen, My Nhu; Barriau, Emilie; Renkel, Martin; Holloway, Matthew J.; Brandi, Jason. Electronic devices assembled with thermally insulating layers. USP2015129209105.
  13. Nguyen, My Nhu; Brandi, Jason. Electronic devices assembled with thermally insulating layers. USP2015129209104.
  14. Cola, Baratunde A.; Fisher, Timothy S.. Electrothermal interface material enhancer. USP2012078220530.
  15. Aurongzeb, Deeder M.; Coolidge, Daniel; Thompson, Richard C.. Flexible heat spreader with differential thermal conductivity. USP20181010088878.
  16. Caterina, Thomas; Naylor, David. Grounded modular heated cover. USP2018049945080.
  17. Moore,David A.; Tracy,Mark; Hill,Kerry. Heat spreader with controlled Z-axis conductivity. USP2007067228894.
  18. Tsai, Richard. Heat valve for thermal management in a mobile communications device. USP2012128339787.
  19. Fujiwara,Norio. Heat-radiating structure of electronic apparatus. USP2007107280359.
  20. Naylor, David. Heating unit for direct current applications. USP2016039290890.
  21. Naylor, David; Caterina, Thomas. Heating unit for warming fluid conduits. USP2017019538581.
  22. Caterina, Thomas; Naylor, David. Heating unit for warming pallets. USP2012098258443.
  23. Hill, Richard F.; Smythe, Robert Michael. Memory modules including compliant multilayered thermally-conductive interface assemblies. USP2014098837151.
  24. Reis, Bradley E.; Reynolds, III, Robert Anderson; Petroski, James T.; Xiong, Yin. Method for reducing temperature-caused degradation in the performance of a digital reader. USP2013038405600.
  25. Cola, Baratunde A.; Fisher, Timothy S.. Methods for attaching carbon nanotubes to a carbon substrate. USP2014128919428.
  26. Watanabe, Yousuke. Mobile terminal device and method for radiating heat therefrom. USP2009117616446.
  27. Watanabe,Yousuke. Mobile terminal device and method for radiating heat therefrom. USP2008027330354.
  28. Naylor, David; Caterina, Thomas. Modular heated cover. USP2015028952301.
  29. Naylor, David. Modular radiant heating apparatus. USP2011027880121.
  30. Fisher, Timothy S.; Hodson, Stephen L.; Cola, Baratunde A.; Bhuvana, Thiruvelu; Kulkarni, Giridhar. Palladium thiolate bonding of carbon nanotubes. USP2013098541058.
  31. Caterina, Thomas; Naylor, David. Pallet warmer heating unit. USP2016079392646.
  32. Lee,Yuju. Plasma display device. USP2009027495918.
  33. Mercuri, Robert A.. Production of nano-structures. USP2010077754184.
  34. Mercuri, Robert Angelo. Production of nano-structures. USP2015059034297.
  35. Fujiwara, Kikuo; Tozawa, Masaaki; Shives, Gary D.; Norley, Julian; Reynolds, III, Robert Anderson. Sandwiched thermal solution. USP2010097799428.
  36. Naylor, David; Fillion, Arthur J.; Hall, David L.; Evans, Aaron; Terry, Brad; Roe, Thomas. Systems, methods, and devices for storing, heating, and dispensing fluid. USP2014118878103.
  37. Naylor, David; Fillion, Arthur J.; Hall, David; Evans, Aaron; Terry, Brad; Roe, Thomas. Systems, methods, and devices for storing, heating, and dispensing fluid. USP2014018633425.
  38. Wayne, Ryan J.; Taylor, Jonathan Andrew; Norley, Julian; Reis, Bradley E.; Pollock, Mark; McCallum, Ian Andrew; Weber, Thomas W.; Reynolds, III, Robert A.; Smalc, Martin David; Fishman, Elliot G.. Thermal solution for prismatic lithium ion battery pack. USP2017079716296.
  39. Chen, Ko-Chun; Lin, Chiu-Lang. Use of a graphite heat-dissipation device including a plating metal layer. USP2015089097468.
  40. Chen, Ko-Chun; Lin, Chiu-Lang. Use of a graphite heat-dissipation device including a plating metal layer. USP2015028955580.

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