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Gas distribution showerhead for semiconductor processing

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A01G-027/00
  • B05B-005/00
  • B05B-001/14
  • F23D-011/32
  • F23D-011/00
출원번호 US-0772787 (2004-02-05)
발명자 / 주소
  • Noorbakhsh,Hamid
  • Carducci,James D.
  • Sun,Jennifer Y.
  • Elizaga,Larry D.
출원인 / 주소
  • Applied Materials, Inc.
인용정보 피인용 횟수 : 83  인용 특허 : 18

초록

We have developed a gas distribution showerhead assembly, for use in a semiconductor processing chamber, which can be easily cleaned, with minimal chamber downtime. The gas distribution showerhead assembly includes an electrode having openings therethrough, and a gas distribution plate which include

대표청구항

We claim: 1. A gas distribution showerhead assembly for use within a semiconductor processing chamber, including: an electrode having a plurality of openings therethrough; a gas distribution plate attached to a first, lower major surface of said electrode, wherein said gas distribution plate inclu

이 특허에 인용된 특허 (18)

  1. Nogami Hiroshi,JPX, CVD apparatus and method of using same.
  2. Richard R. Mett ; Hamid Noorbakhsh ; Robert D. Greenway, Chamber having improved gas feed-through and method.
  3. Umotoy Salvador P. ; Lei Lawrence C. ; Nguyen Anh N. ; Chiao Steve H., Dual gas faceplate for a showerhead in a semiconductor wafer processing system.
  4. Katz, Dan; Buchberger, Jr., Douglas A.; Ye, Yan; Hagen, Robert B.; Zhao, Xiaoye; Kumar, Ananda H.; Chiang, Kang-Lie; Noorbakhsh, Hamid; Wang, Shiang-Bau, Gas distribution plate electrode for a plasma reactor.
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  6. Seung Yoon Yang KR; In Jae Park KR; Jong Woo Yoon KR; Chang Jae Kim KR; Tanigawa Eiki JP, Gas injection system for chemical vapor deposition device.
  7. Ballance David S. ; Bierman Benjamin ; Tietz James V., Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween.
  8. Butterbaugh Jeffery W. ; Gray David C. ; Fayfield Robert T. ; Siefering Kevin ; Heitzinger John ; Hiatt Fred C., Method and apparatus for surface conditioning.
  9. Gluschenkov, Oleg; Chakravarti, Ashima B., Method for reducing the microloading effect in a chemical vapor deposition reactor.
  10. Nogami, Hiroshi, Method of cleaning CVD device.
  11. Moslehi Mehrdad M. ; Lee Yong Jin ; Kermani Ahmad, Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment.
  12. Umotoy Salvador P. ; Lei Lawrence C. ; Nguyen Anh N. ; Chiao Steve H., One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system.
  13. Guo Xin Sheng ; Koai Keith ; Chen Ling ; Bhan Mohan K. ; Zheng Bo, Pattern of apertures in a showerhead for chemical vapor deposition.
  14. Hamid Noorbakhsh ; Michael Welch ; Siamak Salimian ; Paul Luscher ; Hongching Shan ; Kaushik Vaidya ; Jim Carducci ; Evans Lee, Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates.
  15. Jae Ho Kim KR; In Chel Shin KR; Sang Joon Park KR; Kwan Goo Rha KR; Sang Ho Kim KR, Showerhead apparatus for radical-assisted deposition.
  16. Williams Norman (Newark CA), Showerhead for uniform distribution of process gas.
  17. Mett, Richard R.; Noorbakhsh, Hamid; Greenway, Robert D., Substrate support with gas feed-through and method.
  18. Shang Quanyuan ; Sun Sheng ; Law Kam S. ; Beer Emanuel, Surface-treated shower head for use in a substrate processing chamber.

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