초록 ▼

A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partia

A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partially overlap on photoresist over a scribe lane between the fields. When the photoresist is developed, the overlap of the first comb and the second comb generates a metal comb. Electrical continuity is checked for the metal tines of the metal comb to determine the misalignment of the fields.

대표청구항 ▼

What is claimed is: 1. A method for electrically determining field alignment, comprising: forming a plurality of test structures on a scribe line between a first field and a second field on a wafer; and detecting electrical continuity in at least one of the test structures, wherein electrical conti

What is claimed is: 1. A method for electrically determining field alignment, comprising: forming a plurality of test structures on a scribe line between a first field and a second field on a wafer; and detecting electrical continuity in at least one of the test structures, wherein electrical continuity of each of the test structures indicates a level of alignment of the fields. 2. The method of claim 1, wherein the test structures are metal tines of metal combs. 3. The method of claim 2, wherein said forming a plurality of test structures comprises: exposing a first scribe pattern from a mask on a resist over the scribe lane, wherein the first scribe pattern comprises a first comb, the first comb comprising a first plurality of tines; stepping the mask from the first field to the second field; exposing a second scribe pattern from the mask on the resist over the scribe lane, wherein the second scribe pattern comprises a second comb, the second comp comprising a second plurality of tines; developing the resist over the scribe lane; and etching the scribe lane to form the metal tines.