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Adaptive sampling method for improved control in semiconductor manufacturing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-019/00
출원번호 US-0075401 (2005-03-08)
발명자 / 주소
  • Pasadyn,Alexander James
  • Toprac,Anthony John
  • Miller,Michael Lee
출원인 / 주소
  • Advanced Micro Devices, Inc.
대리인 / 주소
    Williams, Morgan &
인용정보 피인용 횟수 : 53  인용 특허 : 7

초록

A method is provided, the method comprising sampling at least one parameter characteristic of processing performed on a workpiece in at least one processing step, and modeling the at least one characteristic parameter sampled using an adaptive sampling processing model, treating sampling as an integ

대표청구항

What is claimed: 1. A method comprising: sampling at least one parameter characteristic of processing performed on a workpiece in at least one processing step in accordance with a sampling rate; modeling the at least one characteristic parameter sampled using an adaptive sampling processing model,

이 특허에 인용된 특허 (7)

  1. Bode Christopher A. ; Campbell William Jarrett, Method and apparatus for automated rework within run-to-run control semiconductor manufacturing.
  2. Bonser Douglas ; Toprac Anthony J. ; Purdy Matthew ; Behnke John R. ; Hussey ; Jr. James H., Method and apparatus for control of critical dimension using feedback etch control.
  3. Frederick N. Hause ; Karen L. E. Turnquest, Method and apparatus for improved focus in optical processing.
  4. Chow Wanyee Apple ; Chen Ming C. ; Lin Yung-Tao ; Shiau Ying, Method and apparatus for inspecting manufactured products for defects in response to in-situ monitoring.
  5. Cawlfield David W. (Cleveland TN), Model predictive control apparatus and method.
  6. Wassick John M. ; McCroskey Patrick S. ; McDonough John J. ; Steckler David K., Model predictive controller.
  7. Toprac Anthony John ; Downey Douglas John ; Gupta Subhash, Run-to-run control process for controlling critical dimensions.

이 특허를 인용한 특허 (53)

  1. Lin, Chun-Hsien; Chen, Jui-Long; Chao, Hui-Yun; Mou, Jong-I; Lin, Chin-Hsiang, 2D/3D analysis for abnormal tools and stages diagnosis.
  2. Tsai, Po-Feng; Tsen, Yen-Di; Wang, Jo Fei; Mou, Jong-I, APC model extension using existing APC models.
  3. Molnar, Charles J., Advanced finishing control.
  4. Fan, Junqiang; Stewart, Gregory E., Automatic tuning method for multivariable model predictive controllers.
  5. Fuxman, Adrian Matias; Pachner, Daniel, Condition-based powertrain control system.
  6. Stewart, Greg; Pekar, Jaroslav; Pachner, Daniel, Coordinated engine and emissions control system.
  7. Krapf, Reiner; Braun, Heiko; Mahler, Michael; Hees, Alexander Werner, Device, particularly protective sensor system, for a machine tool.
  8. Sonderman, Thomas J.; Pasadyn, Alexander J.; Cherry, Gregory A., Dynamic adaptive sampling rate for model prediction.
  9. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.
  10. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.
  11. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.
  12. Pachner, Daniel; Pekar, Jaroslav, Engine and aftertreatment optimization system.
  13. Yadav, Puneet; Bailey, III, Andrew D., Expert knowledge methods and systems for data analysis.
  14. Yadav,Puneet; Bailey, III,Andrew D., Expert knowledge methods and systems for data analysis.
  15. Willis,James E.; Funk,Merritt; Lally,Kevin; Pinto,Kevin; Tomoyasu,Masayuki; Peterson,Raymond; Sundararajan,Radha, Fault detection and classification (FDC) using a run-to-run controller.
  16. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Prabhu, Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.
  17. Hasegawa, Masaki; Murakoshi, Hisaya; Makino, Hiroshi, Graphical user interface for use with electron beam wafer inspection.
  18. Pachner, Daniel, Identification approach for internal combustion engine mean value models.
  19. He,Qinghua; Wang,Jin; Bode,Christopher A., Method and apparatus for fast disturbance detection and classification.
  20. Stirton, James Broc; Holfeld, Andre, Method and system for advanced process control using a combination of weighted relative bias values.
  21. Malig, Hans-Juergen; Stirton, James Broc, Method and system for advanced process control using measurement uncertainty as control input.
  22. Zou, Jianping, Method and system for estimating context offsets for run-to-run control in a semiconductor fabrication facility.
  23. Li,Yue; Behm,Gary W.; Iannucci, Jr.,James V.; Stoll,Derek C., Method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process.
  24. Tsen, Andy; Hsu, Chih-Wei; Hung, Ming-Yeon; Fan, Ming-Yu; Fei, Wang Jo; Mou, Jong-I, Method and system for tuning advanced process control parameters.
  25. Maier, Volker, Method for electronically operating two machine tools.
  26. Muenz, Josef, Method of adjusting process variables in a processing flow.
  27. Lin, Chun-Hsien; Wang, Amy; Ko, Francis; Wang, Jean, Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment.
  28. Chandler, Phil; Clark, Daniel O.; Vermeulen, Robbert M.; Jung, Jay J.; Johnson, Roger M.; Loldj, Youssef A.; Smith, James L., Methods and apparatus for assembling and operating electronic device manufacturing systems.
  29. Raoux, Sebastien; Curry, Mark W.; Porshnev, Peter; Fox, Allen, Methods and apparatus for improving operation of an electronic device manufacturing system.
  30. Kirchhof, Darrin Glen, Methods and apparatus for model predictive control in a real time controller.
  31. Curry, Mark W.; Raoux, Sebastien; Porshnev, Peter, Methods and apparatus for pressure control in electronic device manufacturing systems.
  32. Chiu, Ho-Man Rodney; Clark, Daniel O.; Crawford, Shaun W.; Jung, Jay J.; Loldj, Youssef A.; Vermeulen, Robbert M., Methods and apparatus for smart abatement using an improved fuel circuit.
  33. Chiu, Ho-Man Rodney; Clark, Daniel O.; Crawford, Shaun W.; Jung, Jay J.; Loldj, Youssef A.; Vermeulen, Robbert M., Methods for starting and operating a thermal abatement system.
  34. Fuller,James W., Model predictive controller with life extending control.
  35. Pereira, Ana Maria Dias Medureira, Multi-agent system for distributed manufacturing scheduling with Genetic Algorithms and Tabu Search.
  36. Knipfer, Ivory Wellman; Komatsu, Jeffrey George; Lee, Jason Scott; Zemke, Matthew H., Multi-dimensional serial containment process.
  37. Wang, Amy; Yu, Chen-Hua; Wang, Jean; Lo, Henry; Ko, Francis; Lai, Chih-Wei; Zuo, Kewei, Near non-adaptive virtual metrology and chamber control.
  38. Wang, Tzu-Yu; Yu, Chen-Hua; Wang, Chien Rhone; Lo, Henry; Ko, Jung Cheng; Lai, Chih-Wei; Zuo, Kewei, Near non-adaptive virtual metrology and chamber control.
  39. Middlebrooks,Scott A., Observability in metrology measurements.
  40. Ogunnaike,Babatunde A.; Mukati,Kapil, Predictive regulatory controller.
  41. Ogunnaike,Babatunde A.; Mukati,Kapil, Predictive regulatory controller.
  42. Subramaniyan, Arun Karthi; Srivatsa, Shesh Krishna; Beeson, Don; Wang, Liping, Probabilistic method and system for testing a material.
  43. Yong, Poh Boon, Process condition based dynamic defect inspection.
  44. Byrne, Tamara; Eriksson, Lennart; Wold, Svante Bjarne, Process control using process data and yield data.
  45. Bickford, Jeanne P.; Goss, John R.; Habib, Nazmul; McMahon, Robert, Reliability evaluation and system fail warning methods using on chip parametric monitors.
  46. Chiu, Ho-Man Rodney; Clark, Daniel O.; Crawford, Shaun W.; Jung, Jay J.; Loldj, Youssef A.; Vermeulen, Robbert, Safety, monitoring and control features for thermal abatement reactor.
  47. Chung,Jae Woo; Jung,Jun, Semiconductor wafer processing apparatus and method for processing batch of wafers having variable number of wafer lots.
  48. Knipfer, Ivory Wellman; Komatsu, Jeffrey George; Lee, Jason Scott; Zemke, Matthew H., Supply chain multi-dimensional serial containment process.
  49. Mazzarone, Marco; Raviola, Alessandro; Reggio, Elena; Risso, Federico, System and method for controlling a manufacturing process.
  50. Chang, Yung-Cheng, Tool function to improve fab process in semiconductor manufacturing.
  51. Cain,Jason Phillip; Singh,Bhanwar; Emami,Iraj, Transistor gate shape metrology using multiple data sources.
  52. Attarwala,Fakhruddin T, Use of core process models in model predictive controller.
  53. Markham, Thomas R., Vehicle security module system.
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