초록 ▼

The present invention provides low stress non-hermetic conformal coatings for the protection of microelectronic devices, such as a Microelectromechanical system (MEMS) based multichip module from adverse environments. The induced stress from these two coatings due to the thermal cycling and manufact

The present invention provides low stress non-hermetic conformal coatings for the protection of microelectronic devices, such as a Microelectromechanical system (MEMS) based multichip module from adverse environments. The induced stress from these two coatings due to the thermal cycling and manufacture processing will not cause any influence on sensing accuracy of the piezopressure sensor or similar functional MEMS devices. Furthermore, the conformal coatings have the merits of low glass transition temperature, good elongation, low moisture uptake and mobile ion permeation, room temperature curability and good contamination resistance to the jet fume, which promise a high reliability for the aerospace and avionics application. One conformal coating comprises a composition/formulation containing a rubber, siloxane or urethane oligomer modified epoxy and an organic hardener, and optionally an organic diluent and a curing catalyst. Another conformal coating comprises a composition/formulation containing a silicone elastomer or gel and a metal chelate catalyst, and optionally a silica filler, a diluent and an adhesion promoter or coupling agent.

대표청구항 ▼

What is claimed is: 1. A curable epoxy composition for forming a conformal coating, the composition comprising: an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt %; a reactive diluent, wherein the reactive diluent is 9.5 to about 30 wt %; a catalyst; and

What is claimed is: 1. A curable epoxy composition for forming a conformal coating, the composition comprising: an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt %; a reactive diluent, wherein the reactive diluent is 9.5 to about 30 wt %; a catalyst; and a hardener. 2. The conformal coating of claim 1, wherein the epoxy base resin is modified with rubber, siloxane or urethane oligomer. 3. The conformal coating of claim 1, wherein the modified epoxy is selected from the group consisting of flexible aliphatic epoxide, aliphatic diepoxide, aliphatic multiepoxide, and mixtures thereof. 4. The conformal coating of claim 1, wherein the modified epoxy is modified by a flexible organic modifier selected from the group consisting of carboxylic acid terminated butadiene acrylonitrile, polycarboxylic acid terminated butadiene acrylonitrile, epoxide terminated butadiene acryonitrile, siloxane modified epoxy, siloxane modified amine, epoxide polyurethane and mixtures thereof. 5. The conformal coating of claim 1, wherein the hardener is selected from the group consisting of carboxylic acid, carboxylic diacid, carboxylic acid anhydride, and carboxylic acid dianhydride. 6. The conformal coating of claim 1, wherein the organic reactive diluent is selected from the group consisting of aliphatic epoxide, aliphatic alcohol, aliphatic alcohol, and aliphatic dialcohol. 7. The conformal costing of claim 1, wherein the catalyst is selected from the group consisting of tertiary amines, tertiary phosphines, imidazole and its derivatives, imidazolium salts, onium salts and the mixtures thereof. 8. A conformal coating formed by reacting: an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt %; a reactive diluent, wherein the reactive diluent is 9.5 to about 30 wt %; a catalyst; and a hardener. 9. A kit for forming a conformal coating, the kit comprising: an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt %; a reactive diluent, wherein the reactive diluent is 9.5 to about 30 wt %; a catalyst; and a hardener. 10. A method for protecting electronic devices, the method comprising: applying a conformal coating to the device, wherein the conformal coating is produced by reacting an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt %; a reactive diluent, wherein the reactive diluent is about 9.5 to about 30 wt %; a catalyst; and a hardener.