초록 ▼

An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a wat

An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting an even plated appearance and also having a thick gold coating film.

대표청구항 ▼

What is claimed is: 1. An electroless displacement gold plating solution comprising: 1) at least one water-soluble gold compound providing from 5횞10-4 to 5횞10-2 mol/liter of a gold element; 2) 0.01 to 2.0 mol/liter of at least one complexing agent; and 3) at least one water-soluble silver compo

What is claimed is: 1. An electroless displacement gold plating solution comprising: 1) at least one water-soluble gold compound providing from 5횞10-4 to 5횞10-2 mol/liter of a gold element; 2) 0.01 to 2.0 mol/liter of at least one complexing agent; and 3) at least one water-soluble silver compound providing from 1횞10-6 to 1횞10-3 mol/liter of a silver element. 2. The electroless displacement gold plating solution according to claim 1, further comprising a water-soluble metal compound selected from the group consisting of at least one water-soluble thallium compound providing from 5횞10-6 to 2횞10-3 mol/liter of a thallium element, at least one water-soluble lead compound providing from 5횞10-7 to 5횞10-4 mol/liter of a lead element content, at least one water-soluble copper compound providing from 2횞10-6 to 2횞10-3mol/liter of a copper element, at least one water-soluble nickel compound providing from 2횞10-5 to 2횞10-2 mol/liter of a nickel element, and combinations thereof. 3. The electroless displacement gold plating solution according to claim 2, wherein a molar ratio of the silver element to the thallium element is in the range of from 1:2000 to 200:1, a molar ratio of the silver element to the lead element is in the range of from 1:500 to 2000:1, a molar ratio of the silver element to the copper element is in the range of from 1:2000 to 500:1, and a molar ratio of the silver element to the nickel element is in the range of from 1:20000 to 50:1. 4. The electroless displacement gold plating solution of claim 1, wherein the solution has a pH of 10.0 or less. 5. An additive for use in preparing the electroless displacement gold plating solution of claim 1, comprising a water-soluble silver compound, a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound, or a water-soluble nickel compound, or any combination thereof. 6. An additive for use in preparing the electroless displacement gold plating solution of claim 2, comprising a water-soluble silver compound and a water-soluble metal compound, wherein the water-soluble metal compound is selected from the group consisting of a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound, a water-soluble nickel compound, and combinations thereof, and in the additive, a molar ratio of the silver element to the thallium element is in the range of from 1:2000 to 200:1 molar ratio of the silver element to the lead element is in the range of from 1:500 to 2000:1, a molar ratio of the silver element to the copper element is in the range of from 1:2000 to 500:1, and a molar ratio of the silver element to the nickel element is in the range of from 1:20000 to 50:1. 7. The additive for use in preparing the electroless displacement gold plating solution of claim 5, further comprising a complexing agent, a pH stabilizer, a pH adjuster, a wetting agent, or a gold ion stabilizer, or any combination thereof. 8. An electroless displacement gold plating method, comprising treating a metallic substrate with the electroless displacement gold plating solution of claim 1. 9. The electroless displacement gold plating method according to claim 8, wherein the metallic substrate is thin-plated with gold by displacement plating. 10. A metal composite material prepared by the method of claim 8, having a gold coating film on a surface of the metallic substrate. 11. The metal composite material according to claim 10, wherein the gold coating film has a thickness of 0. 40 μm or more. 12. A method for stabilizing an electroless displacement gold plating solution, comprising: adding the additive for use in preparing the electroless displacement gold plating solution of claim 5 to an electroless displacement gold plating solution.