초록 ▼

A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat t

A heat transfer system is presented for managing thermal transients, thus providing engineers greater flexibility in designing thermal solutions for applications subject to transient heat-generation. A heat reservoir device for managing a heat input subject to transient conditions includes a heat transfer subsystem having a first end and a second end, where the first end is thermally coupled to the heat input; a heat storage subsystem coupled to the second end of the heat transfer subsystem, where the heat storage subsystem comprises a phase change material responsive to the transient conditions. The excess heat load during transient operation is temporarily absorbed by the latent heat of fusion when the phase change material changes its phase from solid to liquid. Subsequently, the absorbed heat can be released back to the ambient via a heat rejection subsystem. This allows engineers to design smaller heat sinks capable of accommodating given transient conditions. This results in heat sinks which are lower cost and smaller size, or which reduce the requirement to provide higher airflow, thereby also decreasing cost and noise, and increasing reliability.

대표청구항 ▼

What is claimed is: 1. A heat reservoir device for managing a heat input from a component subject to transient conditions and having space constraints defined by a first volume of available space surrounding said component, said heat reservoir device comprising: a heat transfer subsystem comprising

What is claimed is: 1. A heat reservoir device for managing a heat input from a component subject to transient conditions and having space constraints defined by a first volume of available space surrounding said component, said heat reservoir device comprising: a heat transfer subsystem comprising a heat pipe having a first end thermally coupled to said component and a second end thermally coupled to a heat storage subsystem; a heat rejection subsystem coupled to said heat storage subsystem; wherein said heat storage subsystem is remotely situated from said heat input, outside said first volume of available space, and comprises a phase change material capable of changing phases in response to said transient conditions causing the temperature of said phase change material to rise above its phase change temperature, wherein said heat rejection subsystem and said heat storage system have a combined volume that is greater than said first volume of available space. 2. The heat reservoir device of claim 1, wherein said phase change material comprises a material selected from the group consisting of: a hydrated salt, sodium acetate, magnesium nitrate, paraffin, and water. 3. The heat reservoir device of claim 1, wherein said heat storage subsystem further comprises: a sealed case; a plurality of fins thermally coupled to said heat transfer subsystem and encapsulated by said sealed case, wherein said phase change material is thermally coupled to said plurality of fins. 4. The heat reservoir device of claim 3, wherein said plurality of fins comprises a series of disc-shaped fins axially distributed along and connected to said heat transfer subsystem. 5. The heat reservoir device of claim 3, wherein said plurality of fins comprises a series of radial fins thermally coupled to said heat transfer system. 6. The heat reservoir device of claim 3, wherein said plurality of fins protrude from a base coupled to said heat transfer subsystem.