초록 ▼

The present invention proposes an apparatus for loading and unloading wafers to and from the semiconductor fabrication equipment. The present invention uses two U-shaped port plate supporters of high rigidity to respectively join with drive devices such as lead screws, shaft bearings, and a lead dev

The present invention proposes an apparatus for loading and unloading wafers to and from the semiconductor fabrication equipment. The present invention uses two U-shaped port plate supporters of high rigidity to respectively join with drive devices such as lead screws, shaft bearings, and a lead device, and then join with components such as a port plate, a port door, and a base. The assembly is driven by a motor via timing pulleys, timing belts, idle wheels, a pair of lead screws, shaft bearings, and a lead device. An encoder is matched for feedback control. Thereby, accurate positioning of the main mechanism of the wafer pod responsible for upward and downward movement can be achieved so as to increase the accuracy and reliability of positioning transfer of wafers. Secondarily, the contamination of particles resulted from the motion of the main mechanism can be reduced by using an intake filtering system. Because the present invention adopts a modular design, the drive source of each unit is isolated and the circuit of each unit is hidden so that the whole structure is most compact and the assembling/disassembling and maintenance are easier.

대표청구항 ▼

We claim: 1. An apparatus for loading and unloading wafers to and from fabrication equipment, having a main assembly comprising: a port plate; a base; first and second port plate supporters' each having a top end and a bottom end, the top ends being connected to the port plate and the bottom ends b

We claim: 1. An apparatus for loading and unloading wafers to and from fabrication equipment, having a main assembly comprising: a port plate; a base; first and second port plate supporters' each having a top end and a bottom end, the top ends being connected to the port plate and the bottom ends being connected to the base; a first lead screw and corresponding lead device installed on the first plate supporter; a second lead screw and corresponding lead device installed on the second plate supporter; a port door with two screw nuts installed at opposite sides thereof, the port door being coupled to the first and second lead screws via the two screw nuts; a lifting/lowering drive mechanism installed on the base, comprising a motor, timing pulleys, and timing belts, wherein the lifting/lowering drive mechanism drives the first and second lead screws to move the port door upwards or downwards via the timing pulleys and timing belts through the power generated by the motor; protective covers covering the first and second port plate supporters, repectively; an intake filtering system having a filter installed in the base and a plurality of intake pipes installed at openings of the protective covers to form an air shield to prevent particles from going out and contaminating wafers; and for each of the first and second lead screws, a spring grommet installed between a top end thereof and the port plate and a spring grommet installed between a bottom end thereof and the base for absorbing a pitch error between the screw nut and the corresponding lead screw. 2. The apparatus for loading and unloading wafers of claim 1, wherein the apparatus further comprises a pod hold-down latch mechanism module and a wafer reseat mechanism module installed on the port plate. 3. The apparatus for loading and unloading wafers of claim 1, wherein each of the first and second port plate supporters are made of a U-shaped plates with high rigidity. 4. The apparatus for loading and unloading wafers of claim 1, wherein the apparatus further comprises a pod unlock mechanism module installed on the port door. 5. The apparatus for loading and unloading wafers of claim 1, wherein sides of the port door are secured to drive plates, each of said drive plates having one of the screw nuts thereon to be screwed to one of said lead screws via corresponding screw nuts, two shaft bearings being installed on one of said drive plates, said two shaft bearings being slidably matched on two lead poles to form said lead device. 6. The apparatus for loading and unloading wafers of claim 1, wherein the base has a plurality of positioning holes disposed thereon to be fixed on the fabrication equipment. 7. The apparatus for loading and unloading wafers of claim 1, wherein the lifting/lowering drive mechanism further has idle wheels contacting the timing pulleys.