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특허 상세정보

Glass package that is hermetically sealed with a frit and method of fabrication

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05B-033/00   
미국특허분류(USC) 313/512; 501/015
출원번호 US-0414794 (2003-04-16)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 154  인용 특허 : 41
초록

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to t...

대표
청구항

What is claimed is: 1. A glass package comprising: a first glass plate; a second glass plate; and a frit made from glass that was doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler, wherein said frit was heated by a irradiation source in a manner that caused said frit to melt and form a hermetic seal which connects said first glass plate to said second glass plate. 2. The glass package of claim 1, wherein each of said first and second glass plates absorbs less light from said irradiation source when ...

이 특허에 인용된 특허 (41)

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