[특허]Method and apparatus for microwave interconnection

ITT Manufacturing Enterprises, Inc.

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특허 상세정보

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Method and apparatus for microwave interconnection

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01P-001/00
미국특허분류(USC)	333/260; 333/024.R; 333/247; 333/238
출원번호	US-0712394 (2003-11-14)
발명자 / 주소	Caplan,William L. Hodgman,Nicholas S. Chamberlain,Thomas B. Morningstar,Michael S.
출원인 / 주소	ITT Manufacturing Enterprises, Inc.
대리인 / 주소	Edell, Shapiro &
인용정보	피인용 횟수 : 1 인용 특허 : 23

초록
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Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave module using a feedthrough pin mounted in the module. The feedthrough pin extends from the microwave module interior into a channel defined in the chassis plate and to a microstrip line on the opposite side of the plate. An electrically conductive gasket is placed about the feedthrough pin between the microwave module and chassis plate to reduce signal leakage and enhance ground continuity. An insulating sleeve is installed about the feedthrough pin in the chassis plate channel and provides a nominal clearance (e.g., 0.005 inches) within that channel to allow for manufacturing and assembly tolerances and to enable feedthrough impedance to be substantially insensitive to the position of the feedthrough pin and insulating sleeve within the channel.

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청구항
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What is claimed is: 1. A connector for coupling microwave signals from a microwave module to a signal line placed on a support structure comprising: a signal conductor extending from said microwave module into said support structure and coupled to said signal line to carry microwave signals from said microwave module to said signal line; an electrically conductive gasket placed about said signal conductor between said microwave module and said support structure to reduce signal leakage and form a ground path therebetween; and an insulating sleeve placed about said signal conductor within said support structure to control impedance variation of a microwave signal path with respect to varying positions of said signal conductor and sleeve within that structure, wherein a clearance is formed between a sleeve exterior surface and a support structure internal surface to facilitate said varying positions. 2. The connector of claim 1, wherein said microwave module and said support structure are arranged in a vertical fashion with said signal conductor extending in a substantially vertical direction therebetween. 3. The connector of claim 1, wherein said signal conductor includes a pin. 4. The connector of claim 1, wherein said support structure includes a chassis plate. 5. The connector of claim 1, wherein said gasket is constructed of a pliable metal. 6. The connector of claim 1, wherein said signal conductor is placed within a channel defined within said support structure and said dimensions of said signal conductor and said insulating sleeve provide said clearance relative to said channel that maintains said microwave signal path impedance substantially independent of the position of said insulating sleeve and signal conductor within said channel. 7. The connector of claim 6, wherein said clearance is approximately 0.005 inches. 8. The connector of claim 1, wherein said signal line includes a microstrip transmission line. 9. The connector of claim 1, wherein said signal conductor is coupled to said signal line via a conductive element and said signal line includes at least one capacitive element to compensate for inductance of said conductive element coupling. 10. The connector of claim 1, wherein said microwave module includes a module signal line coupled to said signal conductor to provide microwave signals. 11. The connector of claim 10, wherein said module signal line is positioned substantially perpendicular to said signal conductor. 12. The connector of claim 10, wherein said module signal line is positioned substantially parallel to said signal conductor. 13. The connector of claim 10, wherein said signal conductor is coupled to said module signal line via a conductive element and said module signal line includes at least one capacitive element to compensate for inductance of said conductive element coupling. 14. A connector for coupling microwave signals from a microwave module to a signal line placed on a support structure comprising: a signal conductor extending from said microwave module into said support structure and coupled to said signal line to carry microwave signals from said microwave module to said signal line; an electrically conductive gasket placed about said signal conductor between said microwave module and said support structure to reduce signal leakage and form a ground path therebetween; and an insulating sleeve placed about said signal conductor within said support structure to control impedance of a microwave signal path within that structure; wherein said microwave module includes a module signal line coupled to said signal conductor to provide microwave signals and said module signal line includes a microstrip transmission line. 15. A connector for coupling microwave signals from a microwave module to a signal line placed on a support structure comprising: a signal conductor extending from said microwave module into said support structure and coupled to said signal line to carry microwave signals from said microwave module to said signal line; an electrically conductive gasket placed about said signal conductor between said microwave module and said support structure to reduce signal leakage and form a ground path therebetween; and an insulating sleeve placed about said signal conductor within said support structure to control impedance of a microwave signal path within that structure; wherein said microwave module includes a seal placed about said signal conductor to maintain signals within said microwave module. 16. A method of coupling microwave signals from a microwave module to a signal line placed on a support structure comprising: (a) transporting microwave signals from said microwave module to said support structure via a signal conductor extending from said microwave module into said support structure and coupled to said signal line; (b) forming a ground path and reducing signal leakage between said microwave module and said support structure via an electrically conductive gasket placed about said signal conductor; and (c) controlling impedance variation of a microwave signal path with respect to varying positions of said signal conductor within said support structure via an insulating sleeve placed about said signal conductor within that structure with a clearance gap formed between a sleeve exterior surface and a support structure internal surface to facilitate said varying positions. 17. The method of claim 16, wherein step (a) further includes: (a.1) transporting microwave signals from said microwave module to said support structure, wherein said microwave module and said support structure are arranged in a vertical fashion with said signal conductor extending in a substantially vertical direction therebetween. 18. The method of claim 16, wherein said signal conductor includes a pin. 19. The method of claim 16, wherein said support structure includes a chassis plate. 20. The method of claim 16, wherein said gasket is constructed of a pliable metal. 21. The method of claim 16, wherein said signal conductor is placed within a channel defined within said support structure, and step (c) further includes: (c.1) maintaining said microwave signal path impedance substantially independent of the position of said insulating sleeve and signal conductor within said channel via said clearance gap formed between said signal conductor with said insulating sleeve and said channel. 22. The method of claim 21, wherein said clearance gap is approximately 0.005 inches. 23. The method of claim 16, wherein said signal line includes a microstrip transmission line. 24. The method of claim 16, wherein step (a) further includes: (a.1) coupling said signal conductor to said signal line via a conductive element, wherein said signal line includes at least one capacitive element to compensate for inductance of said conductive element coupling. 25. The method of claim 16, wherein step (a) further includes: (a.1) transferring microwave signals to said signal conductor from a module signal line within said microwave module and coupled to said signal conductor. 26. The method of claim 25, wherein step (a.1) further includes: (a.1.1) transferring microwave signals to said signal conductor from said module signal line placed substantially perpendicular to said signal conductor. 27. The method of claim 25, wherein step (a.1) further includes: (a.1.1) transferring microwave signals to said signal conductor from said module signal line placed substantially parallel to said signal conductor. 28. The method of claim 25, wherein step (a.1) further includes: (a.1.1) coupling said signal conductor to said module signal line via a conductive element, wherein said signal line includes at least one capacitive element to compensate for inductance of said conductive element coupling. 29. A method of coupling microwave signals from a microwave module to a signal line placed on a support structure comprising: (a) transporting microwave signals from said microwave module to said support structure via a signal conductor extending from said microwave module into said support structure and coupled to said signal line, wherein step (a) further includes: (a.1) transferring microwave signals to said signal conductor from a module signal line within said microwave module and coupled to said signal conductor, wherein said module signal line includes a microstrip transmission line; (b) forming a ground path and reducing signal leakage between said microwave module and said support structure via an electrically conductive gasket placed about said signal conductor; and (c) controlling impedance of a microwave signal path within said support structure via an insulating sleeve placed about said signal conductor within that structure. 30. A method of coupling microwave signals from a microwave module to a signal line placed on a support structure comprising: (a) transporting microwave signals from said microwave module to said support structure via a signal conductor extending from said microwave module into said support structure and coupled to said signal line, wherein step (a) further includes: (a.1) maintaining signals within said microwave module via a seal placed about said signal conductor; (b) forming a ground path and reducing signal leakage between said microwave module and said support structure via an electrically conductive gasket placed about said signal conductor; and (c) controlling impedance of a microwave signal path within said support structure via an insulating sleeve placed about said signal conductor within that structure.

이 특허에 인용된 특허 (23)

이 특허를 인용한 특허 피인용횟수: 1

Quan, Clifton; Roberts, David E.; Hashemi-Yeganeh, Shahrokh; Montgomery, Richard A.. Spring loaded microwave interconnector. USP2010047692508.

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Method and apparatus for microwave interconnection

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Method and apparatus for microwave interconnection

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