$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method, system, and medium for handling misrepresentative metrology data within an advanced process control system

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-019/00
출원번호 US-0632107 (2003-08-01)
발명자 / 주소
  • Schwarm,Alexander T.
  • Shanmugasundram,Arulkumar P.
  • Seror,Jacques
  • Kokotov,Yuri
  • Entin,Efim
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Wilmer, Cutler, Pickering, Hale &
인용정보 피인용 횟수 : 26  인용 특허 : 312

초록

A system, method and medium of controlling a semiconductor manufacturing tool using a feedback control mechanism. The feedback control mechanism includes features for receiving data points relating to an output of the tool. The data points include a current data point and at least one previous data

대표청구항

What is claimed is: 1. A method of controlling a semiconductor manufacturing tool using a feedback control mechanism, comprising: (a) receiving a plurality of data points relating to an output of the tool including a current data point and at least one previous data point; (b) determining whether

이 특허에 인용된 특허 (312)

  1. Trombetta Liberatore A. (Hamilton CAX) Patel Dhanraj S. (Mississauga CAX) Darby Dennis A. (Hamilton CAX) Huhtanen Jayne S. (Toronto CAX), Absorbent article having a rewet barrier.
  2. Boiquaye William J. N-O., Adaptive control process and system.
  3. Tan Heng-Wei Osbert ; Vines ; Jr. Donald H., Advanced process control for semiconductor manufacturing.
  4. Irie Nobuyuki (Kawasaki JPX) Takane Eiji (Tokyo JPX) Hirukawa Shigeru (Kashiwa JPX) Iwamoto Yoshichika (Kumagaya JPX) Kaneko Ryoichi (Zushi JPX), Alignment method and alignment apparatus with a statistic calculation using a plurality of weighted coordinate positions.
  5. Klimasauskas Casimir C., Analyzer for modeling and optimizing maintenance operations.
  6. William P. Ladd, Apparatus and method for controlling distribution of product in manufacturing process.
  7. Eastburn Lindsey ; Mass Leon, Apparatus and method for controlling high throughput sputtering.
  8. Sullivan Michael F. (Dallas TX) Hirsch Judith S. (Plano TX) Butler Stephanie W. (Plano TX) Tovell Nicholas J. (Plano TX) Stefani Jerry A. (Richardson TX) Mozumder Purnendu K. (Dallas TX) Wild Ulrich , Apparatus and method for model based process control.
  9. Sullivan Michael Francis ; Hirsch Judith Susan ; Butler Stephanie Watts ; Tovell Nicholas John ; Stefani Jerry Alan ; Mozumder Purnendu K. ; Wild Ulrich H. ; Wang Chun-Jen Jason ; Hartzell Robert A., Apparatus and method for model based process control.
  10. John M. Boyd ; Katrina Mikhaylich ; Mike Ravkin, Apparatus and method for qualifying a chemical mechanical planarization process.
  11. Phan Khoi A. ; Bains Gurjeet S. ; Steele David A. ; Orth Jonathan A. ; Subramanian Ramkumar, Apparatus and method for reducing defects in a semiconductor lithographic process.
  12. Parker Norman W. (Fairfield CA) Tolles Robert D. (Santa Clara CA) Lee Harry Q. (Mountain View CA), Apparatus and method for simulating and optimizing a chemical mechanical polishing system.
  13. Mashruwala Rajesh U. (Palo Alto CA) Hess Richard L. (Palo Alto CA) Verplank William L. (Menlo Park CA), Apparatus and method for viewing relationships in a factory management system.
  14. Lopatin Sergey D. ; Cheung Robin W., Apparatus and method of encapsulated copper (Cu) Interconnect formation.
  15. Friedman Daniel J., Apparatus for carrying semiconductor devices.
  16. Sato Shuzo,JPX ; Otorii Hiizu,JPX ; Suematsu Nobuo,JPX, Apparatus for correcting and holding front surface of sheet.
  17. Cheung Robin ; Sinha Ashok ; Tepman Avi ; Carl Dan, Apparatus for electro-chemical deposition with thermal anneal chamber.
  18. Moslehi Mehrdad M., Apparatus for semiconductor device fabrication diagnosis and prognosis.
  19. Wolf Julie M. ; Lanier Charles D. ; Helm Bryan L., Application management system.
  20. Kittler Richard Charles ; Ling Zhi-Min ; Pak James Minsu ; Lin Yung-Tao ; Shiau Ying, Arrangement and method for detecting sequential processing effects in manufacturing.
  21. Lin Yung-Tao ; Ling Zhi-Min ; Pak James ; Shiau Ying, Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences withi.
  22. James A. Cunningham, Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects.
  23. Gustin Robin Haley ; Livingston Troy W. ; Park Namsoo, Automated banking system for dispensing money orders, wire transfer and bill payment.
  24. Tobin ; Jr. Kenneth W. ; Gleason Shaun S. ; Karnowski Thomas P. ; Sari-Sarraf Hamed, Automated defect spatial signature analysis for semiconductor manufacturing process.
  25. Iturralde Armando (San Antonio TX), Automatic film deposition control method and system.
  26. Anderson Paul (Green Lane PA), Automatic identification system for self tuning process controller.
  27. Harada Eiji,JPX, Automatic programming method and device for multi-system machine tool.
  28. Steffan Paul J. ; Chen Ming Chun, Automatic recipe adjust and download based on process control window.
  29. O\Donoghue Geoffrey P. (Andover MA) Cheek Gary C. (Wilmington MA), Bitstream defect analysis method for integrated circuits.
  30. Dvir Eran,ILX, Buffer system for a wafer handling system.
  31. Roy E. Mallory ; Richard B. Carter, Capacitive displacement sensor for measuring thin targets.
  32. Chen Hung ; Zuniga Steven, Carrier head with a flexible membrane for chemical mechanical polishing.
  33. Yokoyama Hiroshi,JPX ; Mizota Yukio,JPX, Casting control support system for die casting machines.
  34. Rosenthal Peter A. ; Solomon Peter R. ; Bonanno Anthony S. ; Eikleberry William J., Cell control method and apparatus.
  35. Yu Chris C. (Boise ID) Sandhu Gurtej S. (Boise ID), Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection.
  36. Richard J. Lebel ; Rock Nadeau ; Martin P. O'Boyle ; Paul H. Smith, Jr. ; Theodore G. van Kessel ; Hemantha K. Wickramasinghe, Chemical mechanical polishing in-situ end point system.
  37. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
  38. Bach Mark A. ; Charlet Kyle Jeffrey ; Ho Shyh-Mei Fang ; McBride Kevin M. ; Rowe-Anderson Huey Moncrief ; Sander Thomas Beavers ; Vogel Thomas Arthur, Command line interface for creating business objects for accessing a hierarchical database.
  39. Cornwell Peter J. (Wotton-Under-Edge GBX), Communications adaptor for automated factory system.
  40. Buckley B. Shawn ; Chen Jihong,CNXITX 430074 ; Yang Dao Shan,CNX ; Zhou Hui Cheng,CNXITX 430074, Computer aided inspection machine.
  41. Lemelson Jerome, Computer controlled vapor deposition processes.
  42. Hirsch Judith S. (Plano TX) Wild Ulrich H. (Dallas TX), Computer-aided manufacturing support method and system for specifying relationships and dependencies between process typ.
  43. Drummond Shattuck Reed ; Peter Earnshaw Heymann ; Steven Mark Mushero ; Kevin Benard Jones ; Jeffrey Todd Oberlander ; Dan Banay, Computer-based communication system and method using metadata defining a control-structure.
  44. Turnbull Robert S. (Sunnyvale CA), Computer-based method and system for product development.
  45. Kobayashi Mamoru (Hadano JPX) Sasaki Hideaki (Hadano JPX) Kato Kazuo (Yamato JPX) Kojima Akio (Hadano JPX) Ninomiya Sigeru (Tokyo JPX) Tsuji Yoshihisa (Hadano JPX), Computer-integrated manufacturing system and method.
  46. Saxena Sharad ; Mozumder Purnendu K. ; Shinn Gregory B. ; Taylor Kelly J., Controlling process modules using site models and monitor wafer control.
  47. Inoue Katsuhiro,JPX, Conveyance system in a semiconductor manufacturing process and method for processing semiconductor wafer therein.
  48. Chen, Ling; Ganguli, Seshadri; Marcadal, Christophe; Cao, Wei; Mosely, Roderick C.; Chang, Mei, Copper interconnect barrier layer structure and formation method.
  49. Baker Michael K. (Los Gatos CA) Lane Leslie A. (Sunnyvale CA) Perloff David S. (Sunnyvale CA) Freedland Alexander (Campbell CA), Data analysis system and method for industrial process control systems.
  50. La Tho Le ; Shiau Ying, Defect management system for productivity and yield improvement.
  51. Matsushita Hiroshi,JPX ; Tsuchiya Norihiko,JPX ; Toyomaru Youko,JPX, Defect-position identifying method for semiconductor substrate.
  52. Evren Eryurek ; Jogesh Warrior, Device in a process system for detecting events.
  53. Hofmann Jim, Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
  54. Greg Goodwin ; Anastasia Lynn Oshelski, Die-based in-fab process monitoring and analysis system for semiconductor processing.
  55. Allen Robert F. ; Jordan Ricardo T., Distributed control system for a semiconductor wafer processing machine.
  56. Zhao Bin ; Vasudev Prahalad K. ; Horwath Ronald S. ; Seidel Thomas E. ; Zeitzoff Peter M., Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer.
  57. Wetzel Jeffrey Thomas, Dual in-laid integrated circuit structure with selectively positioned low-K dielectric isolation and method of formation.
  58. Meijer Peter B. L. (Eindhoven NLX), Dynamic neural net.
  59. Morshedi Abdol M. (Houston TX) Cutler Charles R. (Houston TX) Fitzpatrick Thomas J. (Katy TX) Skrovanek Thomas A. (Houston TX), Dynamic process control.
  60. Sonderman, Thomas J.; Pasadyn, Alexander J.; Bode, Christopher A., Dynamic process state adjustment of a processing tool to reduce non-uniformity.
  61. Wang Qingsu ; Zvonar John ; Simpson Mike, E10 reporting tool.
  62. Gerasimov Viktor G. (ulitsa Energeticheskaya ; 8 ; korpus 1 ; kv. 144 Moscow SUX) Kljuev Vladimir V. (ulitsa Volgina ; 13 ; kv. 69 Moscow SUX) Kuznetsov Viktor B. (Novogireevskaya ulitsa ; 14 ; korpu, Eddy current device for automatically testing the quality of elongated electrically conductive objects by non-destructiv.
  63. Nagano, Osamu; Yamazaki, Yuichiro; Miyoshi, Motosuke; Kaneko, Hisashi; Matsuda, Tetsuo, Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium.
  64. Felix Mednikov DE; Roland Mandl DE; Mark Netschaevsky RU, Eddy current sensor for analyzing a test object and method of operating same.
  65. Chern Engmin J. (West Chester OH), Eddy current surface mapping system for flaw detection.
  66. Brian P. Conchieri ; Steven M. Ruegsegger ; John J. Ellis-Monaghan, Effective channel length control using ion implant feed forward.
  67. Cresswell Michael W. (Frederick MD) Linholm Loren W. (Ijamsville MD) Allen Richard A. (Germantown MD) Teague E. Clayton (Gaithersburg MD) Penzes William B. (New Carrollton MD), Electrical test structure and method for measuring the relative locations of conducting features on an insulating substr.
  68. Penzes William B. ; Allen Richard A. ; Cresswell Michael W. ; Linholm Loren W. ; Teague E. Clayton, Electrical test structure and method for measuring the relative locations of conductive features on an insulating substr.
  69. Li Leping ; Gilhooly James Albert ; Morgan ; III Clifford Owen ; Wei Cong, Endpoint detection by chemical reaction and reagent.
  70. Gonzales David B. ; Bartlett Aaron T., Endpoint stabilization for polishing process.
  71. Gonzales, David B.; Bartlett, Aaron T., Endpoint stabilization for polishing process.
  72. Fehskens Leonard G. ; Sylor Mark W. ; Chapman Kenneth W. ; Schuchard Robert C. ; Goldfarb Stanley I. ; O'Brien Linsey B. ; Rosenbaum Richard L. ; Kohls Ruth E. J. ; Namoglu Sheryl F. ; Seger Mark J., Entity management system.
  73. Kennedy Brian M., Extensible model network representation system for process planning.
  74. Krivokapic, Zoran; Heavlin, William D., Feed-forward control of TCI doping for improving mass-production-wise, statistical distribution of critical performance parameters in semiconductor devices.
  75. Yang Kai, Feedback loop for selective conditioning of chemical mechanical polishing pad.
  76. Conrad, Edward W.; Smyth, John S.; Whiting, Charles A.; Ziemer, David A., Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings.
  77. Nulman Jaim (Palo Alto CA), Film sheet resistance measurement.
  78. Nulman Jaim (Palo Alto CA), Formation of titanium nitride on semiconductor wafer by reaction of titanium with nitrogen-bearing gas in an integrated.
  79. Moyne James R. (Ypsilanti MI), Generic cell controlling method and apparatus for computer integrated manufacturing system.
  80. Chi, Yuehshian T.; Hawkins, Parris C. M.; Jin, Qiaolin, Generic interface builder.
  81. Coelho Robert A. ; Bertone James, Graphic user interface for managing a server system.
  82. Osterheld, Thomas H., Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile.
  83. Habib Dennis M. ; Engelberg Mindy J. ; McNutt Kathryn A. ; Kinser Colby E. ; Lynch ; II Charles E. ; Williams Chauncey L., Help system with semitransparent window for disabling controls.
  84. Li Leping ; Barbee Steven George ; Halperin Arnold ; Heinz Tony Frederick, In-situ monitoring and control of conductive films by detecting changes in induced eddy currents.
  85. Skalski Clement A. (Avon CT), Industrial contactless position sensor.
  86. Entwistle Brian (Preston GB2) Roberts Peter (Preston GB2) Rogerson John M. (Preston GB2), Industrial processing and manufacturing systems.
  87. Samaha Moustafa,DEX, Information system for production control.
  88. Schlagheck Jerry ; Beaudry Pierre,CAX, Infrared screening and inspection system.
  89. Sharpe ; Jr. Richard R. ; Tielens Craig R. ; Westbrock Jon D., Integrated communication network for use in a field device management system.
  90. Bo Su, Integrated critical dimension control for semiconductor device manufacturing.
  91. Bo Su, Integrated critical dimension control for semiconductor device manufacturing.
  92. Hu Ding-Dar,TWX ; Liu Chwen-Ming,TWX ; Huang Chih-Ming,TWX ; Chen Li-Chun,TWX, Integrated defect yield management and query system.
  93. Yun Jong-hyun,KRX, Integrated management of semiconductor process data.
  94. Lee Mark S. (Windsor Locks CT) McQuaid Cameron M. (Middlefield MA) Urban Stephen R. (West Hartford CT) Seccombe ; Jr. Donald A. (Cheshire CT) Leo ; Jr. Robert T. (Manchester CT) Coon Edward H. (Winfi, Integrated manufacturing system.
  95. Lopatin, Sergey; Wang, Fei; Schonauer, Diana; Avanzino, Steven C., Interconnect structure formed in porous dielectric material with minimized degradation and electromigration.
  96. Sharpe ; Jr. Richard R. ; Bruck Robert ; Wagenknecht Richard ; Westbrock Jon D. ; Tielens Craig R. ; Kieley James W., Interface controls for use in a field device management system.
  97. Lale Peter G. (Harpenden GBX) Hocking Donald H. (St. Albans GBX), Lift off compensation of eddy current crack detection system by controlling damping resistance of oscillator.
  98. Scheid Glen W. ; Riley Terrence J. ; Wang Qingsu ; Miller Michael ; Qin Si-Zhao J., Lot-to-lot rapid thermal processing (RTP) chamber preheat optimization.
  99. Cho, Dae-Sik; Chae, Hee-Sun; Kim, Seok-Hyun; Tong, Seung-Hoon; Yoon, Tae-Yang; Kwak, Doh-Soon; Kang, Hee-Se; Park, Yll-Seug; Oh, Jae-Seok, Lots dispatching method for variably arranging processing equipment and/or processing conditions in a succeeding process according to the results of a preceding process and apparatus for the same.
  100. Dmochowski Michael Joseph, Manufacturing and engineering data base.
  101. Jang Young-Chul,KRX ; Shim Bo-Yeon,KRX ; Ahn Chung-Sam,KRX, Manufacturing method of a semiconductor integrated circuit.
  102. Fischer Frederic P. (Williamsville NY) Lee Patrick S. K. (Poughkeepsie NY) Logue Raymond C. (Somers NY) Parks Thomas W. (Ithaca NY), Measurement of fiber diameters with high precision.
  103. Lu Chun-Hung,TWX ; Li Mei-Yen,TWX, Method and apparatus for CMP end point detection using confocal optics.
  104. Ozaki Hiroji,JPX, Method and apparatus for analyzing a fabrication line.
  105. Hagi Toshio,JPX ; Nakata Kazuki,JPX, Method and apparatus for analyzing failure of semiconductor wafer.
  106. Bode Christopher A. ; Campbell William Jarrett, Method and apparatus for automated rework within run-to-run control semiconductor manufacturing.
  107. William Jarrett Campbell ; Anthony J. Toprac ; Christopher A. Bone, Method and apparatus for automatic routing for reentrant process.
  108. Campbell, William Jarrett; Toprac, Anthony J.; Bone, Christopher A., Method and apparatus for automatic routing for reentrant processes.
  109. Anthony J. Toprac ; Derick J. Wristers ; Jon D. Cheek, Method and apparatus for characterizing semiconductor device performance variations based on independent critical dimension measurements.
  110. Bonser Douglas ; Toprac Anthony J. ; Purdy Matthew ; Behnke John R. ; Hussey ; Jr. James H., Method and apparatus for control of critical dimension using feedback etch control.
  111. Tobin, James F.; Weise, Greg, Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus.
  112. Campbell W. Jarrett ; Lansford Jeremy ; Raeder Christopher H., Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing.
  113. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
  114. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
  115. Caffey Thurlow W. H., Method and apparatus for detecting external cracks from within a metal tube.
  116. Sandhu Gurtej Singh, Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.
  117. Sandhu Gurtej Singh, Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.
  118. Sandhu Gurtej Singh, Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.
  119. Sandhu Gurtej Singh (Boise ID), Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers.
  120. Pasadyn, Alexander J.; Sonderman, Thomas J., Method and apparatus for determining output characteristics using tool state data.
  121. Alexander J. Pasadyn ; Anthony J. Toprac, Method and apparatus for dynamic sampling of a production line.
  122. Toprac Anthony John ; Coss ; Jr. Elfido, Method and apparatus for embedded process control framework in tool systems.
  123. Coss, Jr., Elfido; Wang, Qingsu; Riley, Terrence J., Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework.
  124. Sonderman, Thomas; Coss, Jr., Elfido; Wang, Qingsu, Method and apparatus for fault detection of a processing tool in an advanced process control (APC) framework.
  125. Wright, Marilyn I.; Lensing, Kevin R.; Stirton, James Broc, Method and apparatus for identifying misregistration in a complimentary phase shift mask process.
  126. Elfido Coss, Jr. ; Thomas Sonderman ; Robert W. Anderson, Method and apparatus for implementing corrected species by monitoring specific state parameters.
  127. Pecen Jiri ; Fielden John ; Chadda Saket ; LaComb ; Jr. Lloyd J. ; Jairath Rahul ; Krusell Wilbur C., Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing.
  128. Lee Shih-Jong J. ; Kuan Chih-Chau L., Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification.
  129. Maruyama Shigenobu,JPX ; Hongo Mikio,JPX ; Todoroki Satoru,JPX ; Okunaka Masaaki,JPX ; Matsuzaki Hideo,JPX ; Ninomiya Takanori,JPX ; Yoshimura Kazushi,JPX ; Ito Fumikazu,JPX, Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof.
  130. Miller, Michael Lee, Method and apparatus for integrating near real-time fault detection in an APC framework.
  131. Miller, Michael Lee; Wang, Qingsu; Coss, Jr., Elfido, Method and apparatus for integration of real-time tool data and in-line metrology for fault detection in an advanced process control (APC) framework.
  132. Into Stephen W. (Billerica MA), Method and apparatus for measuring registration between layers of a semiconductor wafer.
  133. Hochbein David E. ; Kerney Craig J., Method and apparatus for measuring the thickness of an article at a plurality of points.
  134. Anthony J. Toprac, Method and apparatus for monitoring material removal tool performance using endpoint time removal rate determination.
  135. Cruse James P., Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system.
  136. Nulman Jaim, Method and apparatus for monitoring the deposition rate of films during physical vapor deposition.
  137. Bollinger Lynn D. (Ridgefield CT), Method and apparatus for moving a material removal tool with low tool accelerations.
  138. Anthony J. Toprac, Method and apparatus for optimal wafer-by-wafer processing.
  139. Pasadyn, Alexander J.; Raeder, Christopher H.; Toprac, Anthony J., Method and apparatus for post-polish thickness and uniformity control.
  140. Maung Sonny (Plano TX) Butler Stephanie W. (Plano TX) Henck Steven A. (Plano TX), Method and apparatus for process endpoint prediction based on actual thickness measurements.
  141. Anthony J. Toprac ; Paul Ackmann ; Stuart E. Brown, Method and apparatus for programmed latency for improving wafer-to-wafer uniformity.
  142. Josephine M. Cheng ; Jyh-Herng Chow ; Jian Xu, Method and apparatus for querying structured documents using a database extender.
  143. Reitman Edward A. (Madison NJ) Ibbotson Dale E. (Bridgewater NJ) Lee Tseng-Chung (New York NY), Method and apparatus for real time monitoring of wafer attributes in a plasma etch process.
  144. Kaneko Mutsuo (Tokyo JPX) Nishimura Yumi (Tokyo JPX) Igarashi Noriko (Tokyo JPX) Sakai Minako (Tokyo JPX) Motoki Akihiro (Tokyo JPX), Method and apparatus for recording electrocardiogram information.
  145. Kin-Sang Lam ; Sey-Ping Sun, Method and apparatus for reducing wafer to wafer deposition variation.
  146. Anthony J. Toprac ; Christopher A. Bode ; Richard D. Edwards, Method and apparatus for run-to-run controlling of overlay registration.
  147. William Jarrett Campbell, Method and apparatus for running metrology standard wafer routes for cross-fab metrology calibration.
  148. Venkatesh Srilakshmi ; Jevtic Dusan, Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot.
  149. Sandhu Gurtej Singh ; Doan Trung Tri, Method and apparatus for selectively conditioning a polished pad used in planarizng substrates.
  150. Moslehi Mehrdad M. (Dallas TX), Method and apparatus for semiconductor device fabrication diagnosis and prognosis.
  151. Judell Neil H. (Plainfield NJ) Poduje Noel S. (Needham Heights MA), Method and apparatus for separating fixture-induced error from measured object characteristics and for compensating the.
  152. Boston Joseph F. ; Boys Ian,GBX, Method and apparatus for simulating and optimizing a plant model.
  153. Hurwitt Steven D. (Park Ridge NJ) Wagner Israel (Monsey NY) Hieronymi Robert (Rock Cavern NY) Van Nutt Charles (Monroe NY), Method and apparatus for sputter coating stepped wafers.
  154. Miller, Michael Lee; Bushman, Scott G., Method and apparatus for the integration of sensor data from a process tool in an advanced process control (APC) framework.
  155. Michael L. Miller ; Thomas J. Sonderman, Method and apparatus for using equipment state data for run-to-run control of manufacturing tools.
  156. Sonderman, Thomas J.; Pasadyn, Alexander J.; Bode, Christopher A., Method and apparatus for utilizing integrated metrology data as feed-forward data.
  157. Gombar Vijay K., Method and apparatus for validation of model-based predictions.
  158. Nguyen Trang Diem, Method and apparatus for wafer disposition based on systematic error modeling.
  159. Van Boxem Gerardus J. C.,NLX, Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturi.
  160. Berezin Alan ; Quintanilla Reuben, Method and system for automated die yield prediction in semiconductor manufacturing.
  161. Consolatti Scott Michael ; Harris Michael David ; Jones Carol Ann, Method and system for customizing a palette using any java class.
  162. Berezin Alan (Austin TX) Quintanilla Reuben (Austin TX), Method and system for declustering semiconductor defect data.
  163. Kahn Randolph W. ; Prosack Hank G. ; Vickers Kenneth G., Method and system for enhancing the identification of causes of variations in the performance of manufactured articles.
  164. Mutschler ; III Eugene Otto, Method and system for generating a compact document type definition for data interchange among software tools.
  165. Zhang Liming, Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process.
  166. Yuji Takagi JP; Hideaki Doi JP; Makoto Ono JP, Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices.
  167. Runnels Scott R., Method and system for modeling, predicting and optimizing chemical mechanical polishing pad wear and extending pad life.
  168. Tran, Minh Quoc, Method and system for polishing a semiconductor wafer.
  169. Philippe Coronel FR; Jean Canteloup FR; Renzo Maccagnan FR; Jean-Phillippe Vassilakis FR, Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision.
  170. Joseph C. Davis ; Karthik Vasanth ; Sharad Saxena ; Purnendu K. Mozumder ; Suraj Rao ; Chenjing L. Fernando ; Richard G. Burch, Method and system for using response-surface methodologies to determine optimal tuning parameters for complex simulators.
  171. Yang Jiunn-Der,TWX ; Yeh Renn-Shyan,TWX ; Chang Chao-Hsin,TWX ; Chang Wen-Chen,TWX, Method and system for yield loss analysis by yield management system.
  172. Hu, Tien-Chen; Twu, Jin-Churng; Lu, Chen-Fa, Method for a copper CMP endpoint detection system.
  173. Atchison Nick ; Ross Ron, Method for analyzing probe yield sensitivities to IC design.
  174. Gupta Subhash (Dallas TX) Sidhu Sanjiv S. (Dallas TX) Vlach Frank (Plano TX), Method for calendaring future events in real-time.
  175. Campbell William Jarrett ; Lansford Jeremy, Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad.
  176. Yi Min-Ho,KRX, Method for controlling a semiconductor manufacturing process by failure analysis feedback.
  177. Kim Sung-geun,KRX ; Kim Tae-hyung,KRX, Method for controlling components of semiconductor fabricating equipment arranged in a processing line.
  178. Mozumder Purnendu Kanti (Plano TX) Barna Gabe G. (Richardson TX), Method for controlling semiconductor wafer processing.
  179. Jun Yong-min,KRX, Method for controlling thicknesses of layers formed by deposition equipment for fabricating semiconductor devices.
  180. Lim Yong-il,KRX, Method for controlling unit process conditions of semiconductor fabricating equipment arranged in a processing line.
  181. Kelkar Amit S., Method for depositing a selected thickness of an interlevel dielectric material to achieve optimum global planarity on a semiconductor wafer.
  182. Breiner Lyle ; Thakur Randhir P. S., Method for efficient manufacturing of integrated circuits.
  183. Hui Wang, Method for electropolishing metal on semiconductor devices.
  184. Kurtzberg Jerome M. ; Levanoni Menachem, Method for feedforward corrections for off-specification conditions.
  185. Campbell William J. ; Fulford H. Jim ; Raeder Christopher H. ; Christian Craig W. ; Sonderman Thomas, Method for filling trenches.
  186. Matsuda Tetsuo,JPX ; Iijima Tadashi,JPX ; Kaneko Hisashi,JPX, Method for forming barrier layer for copper metallization.
  187. Goldman, Arnold J.; Hartman, Jehuda; Fisher, Joseph; Sarel, Shlomo, Method for global automated process control.
  188. Christopher A. Bode ; Anthony J. Toprac, Method for identifying and controlling impact of ambient conditions on photolithography processes.
  189. Leu, Jihperng; Wu, Chih-I; Zhou, Ying; Kloster, Grant M., Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics.
  190. Shuo-Yen Tai TW; Ming-Cheng Yang TW; Jiun-Fang Wang TW; Champion Yi TW, Method for integration optimization by chemical mechanical planarization end-pointing technique.
  191. Geoffrey M. Jacquez, Method for measuring a degree of association for dimensionally referenced data.
  192. Charpentier Jacques (Moirans FRX), Method for measuring the thickness and temperature of a moving metal sheet by means of eddy currents.
  193. Piche Stephen ; Havener John P. ; Semrad Donald, Method for on-line optimization of a plant.
  194. Sudhindra N. Mishra, Method for platform and protocol independent communication between client-server pairs.
  195. Wijaranakula Witawat (Vancouver WA) Archer Sandra A. (Portland OR) Gupta Dinesh C. (Vancouver WA), Method for producing semiconductor wafers with low light scattering anomalies.
  196. Miller Michael Lee ; Campbell William Jarrett, Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication.
  197. Liu Chung-Shi,TWX ; Yu Chen-Hua,TWX ; Bao Tien-I,TWX ; Jang Syun-Ming,TWX, Method for selective growth of Cu3Ge or Cu5Si for passivation of damascene copper structures and device manufactured thereby.
  198. Meikle Scott G. (Boise ID) Marty Lucky F. (Scottsdale AZ), Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers.
  199. Krivokapic Zoran (Santa Clara CA) Heavlin William D. (San Francisco CA) Kyser David F. (San Jose CA), Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-p.
  200. Bomans Muriel (Boulogne FRX) Pierre Francine (Paris FRX) Robin Hugues (Bouguenais FRX), Method for structuring information used in an industrial process and its application to aircraft piloting assistance.
  201. Atchison Nick ; Ross Ron, Method for the calculation of wafer probe yield limits from in-line defect monitor data.
  202. Miller Gabriel Lorimer (Westfield NJ) Robinson David Arthur Hall (Murray Hill NJ) Wiley John Duncan (Stuttgart DT), Method for the noncontacting measurement of the electrical conductivity of a lamella.
  203. Kim Sang-yong,KRX, Method for transferring wafer cassettes after checking whether process equipment is in a suitable mode.
  204. Ping-Yi Chang TW, Method of CMP endpoint detection.
  205. Wisspeintner Karl (Ortenburg DEX) Mandl Roland (Ortenburg DEX), Method of calibrating a thickness measuring device and device for measuring or monitoring the thickness of layers, tapes.
  206. Kwon Dae-hong,KRX, Method of controlling semiconductor fabricating equipment to process wafers of a single lot individually.
  207. Yau Wai-Fan ; Cheung David ; Jeng Shin-Puu ; Liu Kuowei ; Yu Yung-Cheng, Method of depositing a low k dielectric with organo silane.
  208. Talbot Christopher G. ; Lo Chiwoei Wayne, Method of detecting defects in patterned substrates.
  209. Saxena Sharad (Richardson TX), Method of diagnosing malfunctions in semiconductor manufacturing equipment.
  210. Sergey D. Lopatin ; Robin W. Cheung, Method of encapsulated copper (Cu) interconnect formation.
  211. Shengnian Song ; Bradley Davis JP; Sey-Ping Sun, Method of fabricating conductor structures with metal comb bridging avoidance.
  212. Satoh Hidetoshi,JPX ; Nakayama Yoshinori ; Okumura Masahide,JPX ; Ohta Hiroya,JPX ; Saitou Norio,JPX, Method of fabricating semiconductor circuit devices utilizing multiple exposures.
  213. Tounai Keiichiro (Tokyo JPX), Method of fabricating semiconductor device including step of forming superposition error measuring patterns.
  214. Agarwal, Vishnu Kumar, Method of forming an encapsulated conductive pillar.
  215. Weling Milind (San Jose CA) Gabriel Calvin T. (Cupertino CA), Method of inspecting planarity of wafer surface after etchback step in integrated circuit fabrication.
  216. Kenneth C. Johnson ; Fred E. Stanke, Method of measuring meso-scale structures on wafers.
  217. Fulford ; Jr. H. Jim ; Wristers Derick, Method of processing a semiconductor wafer for controlling drive current.
  218. Lopatin, Sergey; King, Paul L.; Bernard, Joffre F., Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed.
  219. Lopatin, Sergey; Nickel, Alexander H., Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed.
  220. Lopatin, Sergey; Nickel, Alexander H., Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed.
  221. Bothra Subhas ; Weling Milind G., Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection.
  222. Tsu Shih TW; Ying-Ho Chen TW; Jih-Churng Twu TW, Method to prevent copper CMP dishing.
  223. Tsu Shih TW, Method to reduce capacitance for copper interconnect structures.
  224. Sahota Kashmir S. (Fremont CA) Avanzino Steven C. (Cupertino CA), Methodology for developing product-specific interlayer dielectric polish processes.
  225. Renteln Peter Henry (Sunnyvale CA), Methods and apparatus for control of polishing pad conditioning for wafer planarization.
  226. Hui Wang, Methods and apparatus for electropolishing metal interconnections on semiconductor devices.
  227. Bothra Subhas, Methods and apparatus for polishing wafers.
  228. Geller Scott D. ; Heyda Michael S. ; Nees Robert, Methods and systems for user interfaces and constraint handling configurations software.
  229. Bartels Anthony L. ; Allen Robert F. ; Holzapfel Paul ; Lin Warren, Methods for the in-process detection of workpieces with a monochromatic light source.
  230. Parikh Suketu A., Misalignment tolerant techniques for dual damascene fabrication.
  231. Iino Yutaka (Kawasaki JPX) Ohya Junko (Kawasaki JPX), Model predictive control apparatus.
  232. Cawlfield David W. (Cleveland TN), Model predictive control apparatus and method.
  233. Mellen-Garnett Katrina A. ; Gupta Prashant, Modular application collaboration including filtering at the source and proxy execution of compensating transactions to conserve server resources.
  234. Danielson Tim (Monument CO), Multi-Parameter eddy current measuring system with parameter compensation technical field.
  235. Somekh, Sasson; Grunes, Howard E., Multi-tool control system, method and medium.
  236. Mozumder Purnendu K. (Plano TX) Saxena Sharad (Dallas TX) Pu William W. (Plano TX), Multi-variable statistical process controller for discrete manufacturing.
  237. Sepulveda Marcos ; Ruhl Roland, Multidimensional uncertainty analysis.
  238. Flora John H. (Lynchburg VA) Gruber Henry T. (Columbus OH), Multiple frequency digital eddy current inspection system.
  239. Kim Do-hyeong,KRX ; Kim Tae-ryong,KRX ; Choi Byeung-wook,KRX ; Jung Kwang-jin,KRX, Multiple reaction chamber system having wafer recognition system and method for processing wafer using same.
  240. Wang Chien-Rhone (Milpitas CA), Multistep sputtering process for forming aluminum layer over stepped semiconductor wafer.
  241. Pan Yang (Singaporee SGX), New chemical mechanical planarization (CMP) end point detection apparatus.
  242. Urbanek Karel (Atherton CA) Kren George J. (Los Altos CA) Wheeler William R. (Saratoga CA), Non-contacting resistivity instrument with structurally related conductance and distance measuring transducers.
  243. Goiffon David A. ; Hartmann Gerald E. ; Johnson David R., Object management system supporting the use of application domain knowledge mapped to technology domain knowledge.
  244. Tantry Subhash B. (Palo Alto CA) Mashruwala Rajesh U. (Palo Alto CA) Lozier Barry A. (Sunnyvale CA) Hess Richard L. (Palo Alto CA), Object-oriented architecture for factory floor management.
  245. Brewer Tony Mahlon ; Watson Thomas Lee ; Chastain David Michael, Parallel processing computer system having shared coherent memory and interconnections utilizing separate undirectional.
  246. Chan Lap ; Yap Kuan Pei,MYX ; Tee Kheng Chok,MYX ; Ip Flora S.,SGX ; Loh Wye Boon,MYX, Passivation of copper interconnect surfaces with a passivating metal layer.
  247. Robert H. Havemann ; Qi-Zhong Hong ; Girish Dixit, Passivation of inlaid metallization.
  248. Yoon Euisik (Sunnyvale CA) Allison ; Jr. Robert W. (San Jose CA) Kovacs Ronald P. (Mountain View CA), Photolithography control system and method using latent image measurements.
  249. Yoon Euisik (Sunnyvale CA) Allison ; Jr. Robert W. (San Jose CA) Kovacs Ronald P. (Mountain View CA), Photolithography control system and method using latent image measurements.
  250. Britt Herbert I. (Cambridge MA) Joshi Amol P. (Marlboro MA) Mahalec Vladimir (Sudbury MA) Piela Peter C. (Brighton MA) Venkataraman Swaminathan (Waltham MA), Plant simulation and optimization software apparatus and method using dual execution models.
  251. Tanaka, Junichi; Kitsunai, Hiroyuki; Nishio, Ryoji; Kanno, Seiichiro; Yamamoto, Hideyuki, Plasma processing apparatus and method.
  252. Kamono Takashi,JPX ; Nishimura Matsuomi,JPX ; Takahashi Kazuo,JPX ; Ikeda Osamu,JPX ; Ohta Satoshi,JPX, Polishing apparatus and method.
  253. Ghoshal Uttam Shyamalindu, Practical air dielectric interconnections by post-processing standard CMOS wafers.
  254. Axelby George S. (North Linthicum MD) Geldiay Vedat (Silver Spring MD) Moulds ; III Clinton W. (Millersville MD), Predictive model reference adaptive controller.
  255. Lane Leslie A. (Santa Clara CA) Lybeck Lynn V. (Moss Beach CA) Perloff David S. (Sunnyvale CA) Kumagi Shoji (Santa Clara CA), Process control interface system for managing measurement data.
  256. Funk Merritt L. ; Peters Lori A., Process control system using feed forward control threads based on material groups.
  257. Anthony J. Toprac, Process control with control signal derived from metrology of a repetitive critical dimension feature of a test structure on the work piece.
  258. Saxena Sharad ; Unruh Amy J. ; Mozumder Purnendu K. ; Burch Richard G., Process flow design at the module effects level through the use of acceptability regions.
  259. Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method.
  260. Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method with automatic transducer zero calibration.
  261. Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method with automatic transducer zero calibration.
  262. Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hays Gregory L. (Fayetteville TN), Process gas distribution system and method with gas cabinet exhaust flow control.
  263. Sierk Dennis A. (Huntsville AL) DuRoss Ronald R. (Huntsville AL) Geist Stephen G. (Union Grove AL) Hayes Gregory L. (Fayetteville TN), Process gas distribution system and method with supervisory control.
  264. Li Hung-Yeh,TWX, Process monitoring system for real time statistical process control.
  265. Hyodo Toshihiro,JPX, Process simulation apparatus and method for selecting an optimum simulation model for a semiconductor manufacturing pr.
  266. Schacham-Diamand Yosef ; Dubin Valery M. ; Ting Chiu H. ; Zhao Bin ; Vasudev Prahalad K. ; Desilva Melvin, Protected encapsulation of catalytic layer for electroless copper interconnect.
  267. Chalmers Scott A. ; Geels Randall S., Rapid and accurate end point detection in a noisy environment.
  268. Atherton Robert W. (1694 Miller Ave. Los Altos CA 94022), Real world modeling and control process.
  269. Takahashi, Kazue; Tsumaki, Nobuo; Yamamoto, Hideyuki, Remote diagnostic system and method for semiconductor manufacturing equipment.
  270. Ting Chiu H. ; Holtkamp William H. ; Ko Wen C., Rotating anode for a wafer processing chamber.
  271. Toprac Anthony John ; Downey Douglas John ; Gupta Subhash, Run-to-run control process for controlling critical dimensions.
  272. Stoddard, Kevin D.; Schulze, Bradley D.; Tsakalis, Konstantinos, Run-to-run controller for use in microelectronic fabrication.
  273. Zhao Bin (Austin TX) Vasudev Prahalad K. (Austin TX) Dubin Valery M. (Cupertino CA) Shacham-Diamand Yosef (Ithaca NY) Ting Chiu H. (Saratoga CA), Selective electroless copper deposited interconnect plugs for ULSI applications.
  274. Liao Kuan-Yang,TWX, Self-aligned metal nitride for copper passivation.
  275. Shue Shau-Lin,TWX, Self-passivation procedure for a copper damascene structure.
  276. Sergey D. Lopatin ; Carl J. Galewski, Semiconductor catalytic layer and atomic layer deposition thereof.
  277. Lopatin, Sergey; Nickel, Alexander H., Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper.
  278. Ishihara Kazuko,JPX ; Ishikawa Seiji,JPX ; Sakata Masao,JPX ; Miyazaki Isao,JPX ; Miyamoto Yoshiyuki,JPX ; Nakazato Jun,JPX, Semiconductor failure analysis system.
  279. Takano, Shin, Semiconductor manufacturing apparatus and device manufacturing method.
  280. Kawazome Takeshi,JPX, Semiconductor process system, its control method, computer readable memory, and device manufacturing method.
  281. Fairbairn, Kevin P.; Su, Bo, Semiconductor processing module with integrated feedback/feed forward metrology.
  282. Nulman Jaim, Semiconductor processing techniques.
  283. Fukuda Etsuo,JPX ; Okutani Hidehiro,JPX, Semiconductor product manufacturing execution system and semiconductor product manufacturing method.
  284. Fukuda Etsuo (Tokyo JPX) Tazawa Masayoshi (Tokyo JPX) Miura Kazuyuki (Tokyo JPX) Takano Tomiko (Tokyo JPX) Satoguchi Yuichi (Tokyo JPX) Ozaki Yuichiro (Tokyo JPX), Semiconductor production system.
  285. Corliss Daniel A. (Leominster MA), Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection.
  286. Mastrangelo Carlos H. (Ann Arbor MI), Silicon-on-insulator capacitive surface micromachined absolute pressure sensor.
  287. Hardikar Manoj ; Zhou Steve ; Shiflett Richard ; Kulkarni Ashok, Software system and method for graphically building customized recipe flowcharts.
  288. Bilder Wayne H. (Northampton PA) Granata Richard D. (Bethlehem PA) Leidheiser ; Jr. Henry (Venice FL), Structural crack monitoring technique.
  289. Hamada Tetsuya,JPX ; Inoue Hidekazu,JPX, Substrate processing management system with recipe copying functions.
  290. Anthony J. Toprac ; Michael L. Miller ; Thomas Sonderman, Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication.
  291. Chari Srikumar N., Synchronous communication interface.
  292. Mozumder Purnendu K. (Plano TX) Barna Gabe G. (Richardson both of TX), System and method for controlling semiconductor wafer processing.
  293. Campbell William Jarrett ; Mullins James Anthony ; Toprac Anthony John, System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control.
  294. Swenson Keith D. (San Jose CA) Maxwell Robin J. (San Jose CA), System and method for modeling, analyzing and executing work process plans.
  295. Wang Qingsu ; Barnett Gerald ; Greig R. Michael ; Cheng Yi, System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication p.
  296. Fuduka Etsuo (Tokyo JPX) Tazawa Masayoshi (Tokyo JPX) Miura Kazuyki (Tokyo JPX) Takano Tomiko (Tokyo JPX) Satoguchi Yuichi (Tokyo JPX) Ozaki Yuichiro (Tokyo JPX), System for automatically producing different semiconductor products in different quantities through a plurality of proce.
  297. Rostami Fariborz ; Clark James Harald ; Michael David J. ; Wilson David J., System for finding the orientation of a wafer.
  298. Chen Vincent Ming Chun, System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback.
  299. Shiba Masataka,JPX ; Watanabe Kenji,JPX ; Hamada Toshimitsu,JPX ; Ishikawa Seiji,JPX ; Go Naoki,JPX ; Yachi Toshiaki,JPX ; Watanabe Tetsuya,JPX ; Jingu Takahiro,JPX, System for quality control where inspection frequency of inspection apparatus is reset to minimize expected total loss based on derived frequency function and loss value.
  300. Schwenke Marvin J. ; Staron Raymond J. ; Sinclair James A. ; Franklin Paul F. ; Hoskins Josiah C., System, method and article of manufacture for displaying an animated, realtime updated control sequence chart.
  301. Eric Michael Jacobson ; Paul Faust, Test instrumentation I/O communication interface and method.
  302. Jun Kyoung-Shik,KRX ; Jang Young-Chul,KRX ; Cho Bong-Su,KRX, Thickness control method in fabrication of thin-film layers in semiconductor devices.
  303. Jang Syun-Ming,TWX, Top metal and passivation procedures for copper damascene structures.
  304. Dubin Valery M. (Cupertino CA) Schacham-Diamand Yosi (Ithaca NY) Zhao Bin (Irvine CA) Vasudev Prahalad K. (Austin TX) Ting Chiu H. (Saratoga CA), Use of cobalt tungsten phosphide as a barrier material for copper metallization.
  305. Goodwin, Thomas J.; Emami, Iraj; May, Charles E., Use of contamination-free manufacturing data in fault detection and classification as well as in run-to-run control.
  306. Mozumder Purnendu K. (Plano TX) Saxena Sharad (Dallas TX), Use of spatial models for simultaneous control of various non-uniformity metrics.
  307. Pence Donald Dean ; Raley Jay Francis, Variegated manufacturing process test method and apparatus.
  308. Abbe Robert C. (Newton MA) Poduje Noel S. (Needham Heights MA) Goodall Randal K. (North Chelmsford MA) Domenicali Peter (Montpelier VT), Wafer handling and processing system.
  309. Song Chee Jung,KRX, Wafer map conversion method.
  310. Inaba Takao,JPX ; Numoto Minoru,JPX ; Sakai Kenji,JPX ; Satoh Manabu,JPX, Wafer polishing apparatus.
  311. Herner, Scott Brad; Hernandez, Manuel Anselmo, Wafer pretreatment to decrease rate of silicon dioxide deposition on silicon nitride compared to silicon substrate.
  312. Cooper Dwight H. (Sunnyvale CA), .

이 특허를 인용한 특허 (26)

  1. Tseng, Lee-Te; Ou, Chih-Hsien; Lin, Kun-Hsiang; Chen, Yi-Hann; Chen, Ming-Te, Adjusting intensity of laser beam during laser operation on a semiconductor device.
  2. Hartman, Jehuda; Brill, Eyal; Kokolov, Yuri, Apparatus and method for the analysis of a process having parameter-based faults.
  3. Li, Juntao; Wang, Junli; Yang, Chih-Chao, Contact having self-aligned air gap spacers.
  4. Brown, Nathan R., Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods.
  5. Yang, Chih-Chao; Edelstein, Daniel C.; Molis, Steven E., Enhanced diffusion barrier for interconnect structures.
  6. Yang, Chih-Chao; Edelstein, Daniel C.; Molis, Steven E., Enhanced diffusion barrier for interconnect structures.
  7. Kim, Hong Soon; Hoffman, James; Park, Beom Soo, Flexible process condition monitoring.
  8. Yang, Chih-Chao, Geometry control in advanced interconnect structures.
  9. Clevenger, Lawrence A.; Quon, Roger A.; Spooner, Terry A.; Wang, Wei; Yang, Chih-Chao, Interconnect structure.
  10. Yang, Chih-Chao, Interconnect structure and fabrication thereof.
  11. Simon, Andrew H.; Yang, Chih-Chao, Interconnect structure and method of forming.
  12. Yeh,Shuh Chwen; Lin,Chun Hsien, Method and system for filtering statistical process data to enhance process performance.
  13. Cohen, Guy; Klein, Dana; Izikson, Pavel, Method and system for providing process tool correctables.
  14. Cheng,Chang Yung; Fu,Hsueh Shih; Wang,Ying Lang; Cheng,Fan Tien, Method and system for virtual metrology in semiconductor manufacturing.
  15. Burda, Richard Gerard; Degbotse, Alfred; Denton, Brian Trevor; Fordyce, Kenneth Jeffrey; Milne, Robert John, Method of release and product flow management for a manufacturing facility.
  16. Brak, Maarten; van Kesteren, Tom A., Scheduler for processing system.
  17. Hongkham, Steve S.; Englhardt, Eric A.; Rice, Michael R.; Armer, Helen R.; Wang, Chongyang Chris, Scheduling method for processing equipment.
  18. Hongkham, Steve S.; Englhardt, Eric A.; Rice, Michael R.; Armer, Helen R.; Wang, Chongyang Chris, Scheduling method for processing equipment.
  19. Yang, Chih-Chao, Self-formed liner for interconnect structures.
  20. Asai, Kazuhide, Statistical analysis method and substrate process system.
  21. Edelstein, Daniel C.; Li, Baozhen; Yang, Chih-Chao, Structure and process for W contacts.
  22. Clevenger, Lawrence A.; Quon, Roger A.; Spooner, Terry A.; Wang, Wei; Yang, Chih-Chao, Surface nitridation in metal interconnects.
  23. Clevenger, Lawrence A.; Quon, Roger A.; Spooner, Terry A.; Wang, Wei; Yang, Chih-Chao, Surface nitridation in metal interconnects.
  24. Scholte-Wassink, Hartmut, System and method for controlling a machine.
  25. Brown,Nathan R., Systems including differential pressure application apparatus.
  26. Markle,Richard J.; Sonderman,Thomas J., Total tool control for semiconductor manufacturing.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트