Film structures and methods of making film structures
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-031/00
B32B-031/14
B32B-031/30
출원번호
US-0016544
(2001-12-11)
발명자
/ 주소
Ausen,Ronald Wayne
Damodaran,Sundaravel
Han,Hak Rhim
Hegdahl,David Wayne
출원인 / 주소
3M Innovative Properties Company
인용정보
피인용 횟수 :
14인용 특허 :
25
초록▼
A method of making a three-dimensional film structure having controllable contact properties comprises making separable surface elements on a top portion of a film structure and stretching the film structure to separate the separable surface elements, thereby obtaining a desired surface structure wh
A method of making a three-dimensional film structure having controllable contact properties comprises making separable surface elements on a top portion of a film structure and stretching the film structure to separate the separable surface elements, thereby obtaining a desired surface structure which delivers a certain contact property such as a pressure sensitive adhesive property. The separable surface elements are provided using a cut film surface, a stemmed film, or a layer of particles.
대표청구항▼
What is claimed is: 1. A method of forming and applying a film structure having controllable surface contact properties comprising: providing a multilayer film structure which has first and second major surfaces and which includes an operating agent therein, the operating agent being spaced from th
What is claimed is: 1. A method of forming and applying a film structure having controllable surface contact properties comprising: providing a multilayer film structure which has first and second major surfaces and which includes an operating agent therein, the operating agent being spaced from the first major surface of the fun structure by a top portion of the film structure, the top portion being defined by predetermined separable surface elements, and the first major surface of the film structure being defined by a plane across separable surface elements; wherein the film structure includes a top film layer, wherein the top film layer includes the separable surface elements formed by at least partially cutting the top film layer inelastically stretching the multilayer film structure to separate the separable surface elements across the first major surface of the film structure and to increase the exposure of the operating agent through spacings between adjacent separated separable surface elements; applying the first major surface of the film structure to a surface of a substrate; and applying pressure to the second major surface of the film such that the operating agent contacts the structure surface of the substrate. 2. The method of claim 1, wherein the top portion of the multilayer film structure comprises a layer of particles. each particle defining one of the separable surface elements. 3. The method of claim 1, wherein the film assembly includes a plurality of stems extending from a continuous portion of the film structure, each stem comprising one of the separable surface elements. 4. A method of forming a film structure comprising: extruding a planar film structure which has a first major surface, a second major surface, and a top portion formed by extrusion under the first major surface; cutting the extruded top portion of the film structure such that the top portion defines a plurality of separable surface elements where the second major surface is uncut; and stretching the film structure in the plain of the film at a stretch ratio of at least 1:1.05 to separate the separable surface elements across the first major surface of the film structure and to increase the exposure of an intermediate surface of the film structure through spacings between adjacent separated separable surface elements wherein when the stretch force is removed, the separated surface elements do not rejoin to their original position before stretching of the film structure and where the separated surface elements are on a continuous film structure formed by the film structure having the uncut second major surface. 5. The method of claim 4, wherein the exposed portions of the intermediate surface form a plurality of recesses, each recess having a recess face spaced from the first major surface and exposed through one of the spacings between adjacent and separated surface elements which separated surface elements are formed as islands by multiple sets of cuts at angles to each other. 6. The method of claim 4, wherein the film structure further includes an operating agent which at least partially defines the intermediate surface of the film structure. 7. The method of claim 6, wherein the operating agent is in a layer form adjacent to and beneath the top layer and wherein when the first major surface of the stretched film structure is applied to a surface of a substrate, the operating agent exhibits noticeably greater contact with the surface of the substrate when pressure is applied on the second major surface of the stretched film structure toward the surface of the substrate. 8. The method of claim 7, wherein the cutting step includes: completely cutting through the top film layer and partially cutting through the operating agent layer. 9. The method of claim 6, wherein the operating agent comprises an adhesive. 10. The method of claim 9, the providing step includes: coextruding the adhesive and a masking material, wherein the masking material is the top portion of the film structure. 11. The method of claim 7, wherein the pressure is a finger or hand pressure. 12. The method of claim 4, wherein the cutting step includes: completely cutting through the top layer. 13. The method of claim 4, wherein the cuffing step includes: cutting in more than one direction. 14. The method of claim 4, wherein the separable surface elements have at least a density of 100 elements per square inch before stretching. 15. The method of claim 14, wherein the separable surface elements have at least a density of 2500 elements per square inch before stretching. 16. The method of claim 15, wherein the separable surface elements have at least a density of 10,000 elements per square inch before stretching. 17. The method of claim 4, wherein the film structure is multilayered. 18. The method of claim 17, wherein the multilayer film structure is formed by coextrusion. 19. The method of claim 4, wherein the stretching step includes biaxially stretching the film structure. 20. The method of claim 4, wherein the stretching step includes simultaneously biaxially stretching the film structure. 21. The method of claim 4, wherein the stretching is inelastic stretching.
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이 특허에 인용된 특허 (25)
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