IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0972163
(2001-10-04)
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발명자
/ 주소 |
- Albert,Donald F.
- Andrews,Greg R.
- Bruno,Joseph W.
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출원인 / 주소 |
- American Aerogel Corporation
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
4 인용 특허 :
47 |
초록
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Organic, small pore area materials ("SPMs") are provided comprising open cell foams in unlimited sizes and shapes. These SPMs exhibit minimal shrinkage and cracking. Processes for preparing SPMs are also provided that do not require supercritical extraction. These processes comprise sol-gel polymeri
Organic, small pore area materials ("SPMs") are provided comprising open cell foams in unlimited sizes and shapes. These SPMs exhibit minimal shrinkage and cracking. Processes for preparing SPMs are also provided that do not require supercritical extraction. These processes comprise sol-gel polymerization of a hydroxylated aromatic in the presence of at least one suitable electrophilic linking agent and at least one suitable solvent capable of strengthening the sol-gel. Also disclosed are the carbonized derivatives of the organic SPMs.
대표청구항
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We claim: 1. An organic small pore area material comprising acetic acid, wherein the acetic acid is incorporated into the small pore area material structure. 2. An organic small pore area material comprising a hydroxylated aromatic; a solvent comprising a carboxylic acid; and an electrophilic lin
We claim: 1. An organic small pore area material comprising acetic acid, wherein the acetic acid is incorporated into the small pore area material structure. 2. An organic small pore area material comprising a hydroxylated aromatic; a solvent comprising a carboxylic acid; and an electrophilic linking agent. 3. The small pore area material of claim 2, wherein the solvent is capable of making covalent modifications within the small pore area material. 4. The small pore area material of claim 3, wherein said carboxylic acid is selected from the group consisting of acetic acid, formic acid, propionic acid, butyric acid, pentanoic acid, and isomers thereof. 5. The small pore area material of claim 4, wherein said carboxylic acid is acetic acid. 6. The small pore area material of claim 2, wherein said hydroxylated aromatic is a hydroxylated benzene compound. 7. The small pore area material of claim 2, wherein said hydroxylated aromatic comprises a phenolic-novolak resin. 8. The small pore area material of claim 2, wherein said electrophilic linking agent comprises an aldehyde. 9. The small pore area material of claim 2, wherein said electrophilic linking agent comprises furfural. 10. The small pore area material of claim 2, wherein said electrophilic linking agent comprises alcohol. 11. The small pore area material of claim 10, wherein said alcohol is furfuryl alcohol. 12. The small pore area material of claim 2, wherein said small pore area material is prepared during a sol-gel polymerization process. 13. The small pore area material of claim 2, wherein said hydroxylated aromatic is selected from the group consisting of phenol, resorcinol, catechol, hydroquinone, phloroglucinol and liquid phenolic resins. 14. The small pore area material of claim 2, wherein said electrophilic linking agent comprises formaldehyde. 15. An organic low density microcellular material comprising a hydroxylated aromatic; a solvent comprising a carboxylic acid; and an electrophilic linking agent. 16. The low density microcellular material of claim 15, wherein the solvent is capable of making covalent modifications within the small pore area material. 17. The low density microcellular material of claim 15, wherein said carboxylic acid is selected from the group consisting of acetic acid, formic acid, propionic acid, butyric acid, pentanoic acid, and isomers thereof. 18. The low density microcellular material of claim 17, wherein said carboxylic acid is acetic acid. 19. The low density microcellular material of claim 15, wherein said hydroxylated aromatic is a hydroxylated benzene compound. 20. The low density microcellular material of claim 15, wherein said hydroxylated aromatic comprises a phenolic-novolak resin. 21. The low density microcellular material of claim 15, wherein said electrophilic linking agent comprises an aldehyde. 22. The low density microcellular material of claim 15, wherein said electrophilic linking agent comprises furfural. 23. The low density microcellular material of claim 15, wherein said electrophilic linking agent comprises alcohol. 24. The low density microcellular material of claim 23, wherein said alcohol is furfuryl alcohol. 25. The low density microcellular material of claim 15, wherein said low density microcellular material is in the form of a complex prepared during a sol-gel polymerization process. 26. The low density microcellular material of claim 15, wherein said hydroxylated aromatic is selected from the group consisting of phenol, resorcinol, catechol, hydroquinone, phloroglucinol and liquid phenolic resins. 27. The low density microcellular material of claim 15, wherein said electrophilic linking agent comprises formaldehyde. 28. The low density microcellular material of claim 15, further comprising an agent selected from the group consisting of metal powders, metal oxides, metal salts, silica, alumina, aluminosilicates, carbon black, novoloid fibers and fire resistant additives. 29. An organic, small pore area material comprising a monolithic aerogel prepared using a non-critical drying process, wherein its smallest dimension is greater than about 3 inches; the average pore diameter is between about 55 nm and about 25 μm; and said aerogel is substantially free of cracks. 30. The organic, small pore area material of claim 29 in which the material is substantially dried in less than about 24 hours. 31. The organic, small pore area material of claim 29 wherein the material is formed in situ in less than about 24 hours. 32. The small pore area material according to claim 31, wherein the material is prepared using a non-critical drying process. 33. The small pore area material according to claim 31, wherein said material is a low density microcellular material. 34. The organic, small pore area material of claim 29 having a thermal conductivity less than about 0.0135 W/(m쨌K) at a pressure of up to about 10 Torr. 35. The small pore area material according to claim 34, wherein the thermal conductivity is less than about 0.008 W/(m쨌K) at a pressure of up to about 10 Torr. 36. The small pore area material according to claim 34, wherein said material is a low density microcellular material. 37. The low density microcellular material according to claim 36, wherein the thermal conductivity is less than about 0.008 W/(m쨌K) at a pressure of up to about 10 Torr. 38. The organic, small pore area material of claim 29 having a thermal conductivity less than about 0.009 W/(m쨌K) at a pressure of up to about 1 Torr. 39. The small pore area material according to claim 38, wherein the thermal conductivity is less than about 0.007 W/(m쨌K) at a pressure of up to about 1 Torr. 40. The small pore area material according to claim 38, wherein said material is a low density microcellular material. 41. The low density microcellular material according to claim 40, wherein the thermal conductivity is less than about 0.007 W/(m쨌K) at a pressure of up to about 1 Torr. 42. The organic, small pore area material of claim 29 having a thermal conductivity less than about 0.005 W/(m쨌K) at a pressure of up to about 0.1 Torr. 43. The small pore area material according to claim 42, wherein the thermal conductivity is less than about 0.0035 W/(m쨌K) at a pressure of up to about 0.1 Torr. 44. The small pore area material according to claim 42, wherein said material is a low density microcellular material. 45. The low density microcellular material according to claim 44, wherein the thermal conductivity is less than about 0.0035 W/(m쨌K) at a pressure of up to about 0.1 Torr. 46. The organic, small pore area material of claim 29, having a surface area greater than about 100 m2/g. 47. The organic, small pore area material of claim 29, having a surface area greater than about 50 m2/g. 48. The organic, small pore area material of claim 29, having a surface area greater than about 10 m2/g. 49. The organic, small pore area material of claim 29 having a density less than about 300 kg/m3. 50. The organic, small pore area material of claim 49 wherein the material is formed in situ. 51. The small pore area material according to claim 50, wherein said material is a low density microcellular material. 52. The organic, small pore area material of claim 29, having a surface area greater than about 200 m2/g. 53. The organic, small pore area material of claim 52 wherein the material is formed in situ. 54. The small pore area material according to claim 53, wherein said material is a low density microcellular material. 55. The small pore area material according to any one of claims 31, 50 or 53, wherein the material comprises: (a) greater than about 80% open pores; and (b) a density less than about 300 kg/m3. 56. An organic, small pore area material comprising a monolithic aerogel, wherein its smallest dimension is greater than about 3 inches; the average pore diameter is between about 55 nm and about 25 μm; and said aerogel is substantially free of cracks. 57. The organic, small pore area material of claim 56 comprising: (a) greater than about 90% open pores; and (b) a density less than about 300 kg/m3. 58. The organic, small pore area material of claim 56 comprising: (a) about 100% open pores; and (b) a density less than about 300 kg/m3. 59. The organic, small pore area material of claim 56 comprising: (a) greater than about 95% open pores; (b) a density less than about 200 kg/m3; and (c) an average pore area less than about 200 μm2. 60. The small pore area material according to any one of claims 29, 30, 49, 52 or 56, wherein the aerogel shrinks less than about 25% (by volume). 61. The small pore area material according to any one of claims 29, 30, 49, 52 or 56, wherein the aerogel does not shrink substantially. 62. The small pore area material according to any one of claims 29, 30, 49, 52 or 56, wherein the average pore area is less than about 200 μm2. 63. The small pore area material according to any one of claims 29, 30, 49, 52 or 56, wherein the average pore area is less than about 100 μm2. 64. The small pore area material according to any one of claim 29, 30, 49, 52 or 56, wherein the average pore area is less than about 50 μm2. 65. The small pore area material according to any one of claims 29, 30, 49, 52 or 56, wherein the average pore area is less than about 0.8 μm2. 66. The small pore area material according to any one of claims 29, 30, 49, 52 or 56, wherein the average pore area is less than about 2000 nm2. 67. A carbonized form of the low density microcellular material according to anyone of claims 29, 30, 49, 52 or 56. 68. A carbonized form of the small pore area material according to any one of claims 29, 30, 49, 52 or 56. 69. The small pore area material according to any one of claims 1, 29, 56 or 2, further comprising an agent selected from the group consisting of metal powders, metal oxides, metal salts, silica, alumina, aluminosilicates, carbon black, novoloid fibers and fire resistant additives. 70. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein the density is less than about 275 kg/m3. 71. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein the density is less than about 250 kg/m3. 72. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein the density is less than about 150 kg/m3. 73. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein the density is less than about 100 kg/m3. 74. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein said small pore area material has a thermal conductivity less than about 0.0135 W/(m쨌K) at a pressure of up to about 10 Torr, and said material has a monolithic form and is formed using a non-critical drying process. 75. The small pore area material according to claim 74, wherein the thermal conductivity is less than about 0.008 W/(m쨌K) at a pressure of up to about 10 Torr. 76. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein said small pore area material has a thermal conductivity less than about 0.009 W/(m쨌K) at a pressure of up to about 1 Torr, and said material has a monolithic form and is formed using a non-critical drying process. 77. The small pore area material according to claim 76, wherein the thermal conductivity is less than about 0.007 W/(m쨌K) at a pressure of up to about 1 Torr. 78. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, wherein said small pore area material has a thermal conductivity less than about 0.005 W/(m쨌K) at a pressure of up to about 0.1 Torr, and said material has a monolithic form and is formed using a non-critical drying process. 79. The small pore area material according to claim 78, wherein the thermal conductivity is less than about 0.0035 W/(m쨌K) at a pressure of up to about 0.1 Torr. 80. The small pore area material according to any one of claims 29-31, 49, 50, 52, 53 or 56, comprising acetic acid, wherein the acetic acid is incorporated into the small pore area material structure. 81. The small pore area material of any one of claims 29- 31, 49, 50, 52, 53 or 56, wherein said material is produced in a method that uses a surfactant. 82. The organic, small pore area material of claim 56 comprising: (a) greater than about 80% open pores; and (b) a density less than about 300 kg/m3. 83. The small pore area material according to claim 82, wherein said material is a low density microcellular material. 84. The low density microcellular material according to any one of claims 51, 54 or 83, wherein the material is prepared using a non-critical drying process. 85. The low density microcellular material according to any one of claims 51, 54 or 83, wherein the material comprises: (a) greater than about 80% open pores; and (b) a density less than about 300 kg/m3. 86. The low density microcellular material according to any one of claims 51, 54 or 83, wherein the density is less than about 275 kg/m3. 87. The low density microcellular material according to any one of claims 51, 54 or 83, wherein the density is less than about 250 kg/m3. 88. The low density microcellular material according to any one of claims 51, 54 or 83, wherein the density is less than about 150 kg/m3. 89. The low density microcellular material according to any one of claims 51, 54 or 83, wherein the density is less than about 100 kg/m3. 90. The low density microcellular material according to any one of claims 51, 54 or 83, wherein said low density microcellular material has a thermal conductivity less than about 0.0135 W/(m쨌K) at a pressure of up to about 10 Torr, and said material has a monolithic form and (is formed using a non-critical drying process. 91. The low density microcellular material according to claim 90, wherein the thermal conductivity is less than about 0.008 W/(m쨌K) at a pressure of up to about 10 Torr. 92. The low density microcellular material according to any one of claims 51, 54 or 83, wherein said low density microcellular material has a thermal conductivity less than about 0.009 W/(m쨌K) at a pressure of up to about 1 Torr, and said material has a monolithic form and is formed using a non-critical drying process. 93. The low density microcellular material according to claim 92, wherein the thermal conductivity is less than about 0.007 W/(m쨌K) at a pressure of up to about 1 Torr. 94. The low density microcellular material according to any one of claims 51, 54 or 83, wherein said low density microcellular material has a thermal conductivity less than about 0.005 W/(m쨌K) at a pressure of up to about 0.1 Torr, and said material has a monolithic form and is formed using a non-critical drying process. 95. The low density microcellular material according to claim 94, wherein the thermal conductivity is less than about 0.0035 W/(m쨌K) at a pressure of up to about 0.1 Torr. 96. The low density microcellular material according to any one of claims 51, 54 or 83, comprising acetic acid. 97. The low density microcellular material of any one of claims 51, 54 or 83, wherein said material is produced in a method that uses a surfactant.
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