Self-supporting reactive hot-melt adhesive element
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-018/80
C08G-018/00
출원번호
US-0071042
(2002-02-08)
우선권정보
DE-101 06 630(2001-02-12)
발명자
/ 주소
Guse,Dieter
Hippold,Theodor
Terfloth,Christian
출원인 / 주소
Jowat Lobers und Frank GmbH &
Co. KG
대리인 / 주소
Cohen Pontani Lieberman &
인용정보
피인용 횟수 :
4인용 특허 :
11
초록▼
A self-supporting reactive hot-melt adhesive element of a reactive one-component hot-melt adhesive which is solid at room-temperature. The adhesive element comprises at least one isocyanate being solid or liquid at room-temperature; and at least one isocyanate-reactive polymer and/or resin being so
A self-supporting reactive hot-melt adhesive element of a reactive one-component hot-melt adhesive which is solid at room-temperature. The adhesive element comprises at least one isocyanate being solid or liquid at room-temperature; and at least one isocyanate-reactive polymer and/or resin being solid at room-temperature. Also disclosed is a process of producing said adhesive element as well as its application and use, in particular in a hot-melt adhesive bonding process.
대표청구항▼
We claim: 1. A self-supporting reactive hot-melt adhesive element comprising: a reactive one-component hot-melt adhesive which is solid at room-temperature, wherein said reactive one-component hot-melt adhesive comprises: (i) 0.5 to 30% w/w relative to the reactive hot-melt adhesive element of at l
We claim: 1. A self-supporting reactive hot-melt adhesive element comprising: a reactive one-component hot-melt adhesive which is solid at room-temperature, wherein said reactive one-component hot-melt adhesive comprises: (i) 0.5 to 30% w/w relative to the reactive hot-melt adhesive element of at least one free non-blocked isocyanate which is solid or liquid at room-temperature, said at least one isocyanate being selected from the group consisting of: (a) unsymmetrically substituted aliphatic and aromatic di-and polyisocyanates comprising isocyanate functions of different reactivity, and (b) a mixture of at least two isocyanates selected from the group consisting of aliphatic and aromatic di-and polyisocyanates which are solid or liquid at room temperature wherein at least one of said di-and polyisocyanates of said mixture is an unsymmetrically substituted di-or polyisocyanate comprising isocyanate functions of different reactivity; (ii) 20 to 90% w/w relative to the reactive hot-melt adhesive element of at least one isocyanate-reactive polymer and/or resin which is solid at room-temperature; and (iii) at least one non-isocyanate-reactive polymer, wax and/or resin wherein the maximum amount of said at least one non-isocyanate reactive polymer, wax and/or resin is 60% w/w relative to the reactive hot-melt adhesive element; wherein the content of free NCO-groups in said reactive hot-melt adhesive element is at least 0.5% w/w relative to the reactive hot-melt adhesive element; wherein said at least one non-isocyanate-reactive polymer, wax, and/or resin combines with said at least one isocyanate-reactive polymer and/or resin to form a matrix into which said at least one isocyanate is incorporated in homogenous distribution; and wherein the cross-linking of said self-supporting reactive hot-melt adhesive element takes place at temperatures of from 60째 C. to 160째 C. 2. The reactive hot-melt adhesive element of claim 1, wherein the content of free NCO-groups in said reactive hot-melt adhesive element is at least 1% w/w, relative to the reactive hot-melt adhesive element. 3. The reactive hot-melt adhesive element of claim 1, wherein said least one isocyanate is a mixture of 4,4'-diisocyanatodiphenylmethane and 2,4'-diisocyanatodiphenylmethane, having a content of 2,4'-diisocyanatodiphenylmethane exceeding 20% w/w, relative to the isocyanate mixture. 4. The reactive hot-melt adhesive element of claim 1, wherein said least one isocyanate-reactive polymer and/or resin comprises at least two isocyanate-reactive groups or isocyanate-reactive hydrogen atoms per molecule. 5. The reactive hot-melt adhesive element of claim 1, wherein said least one isocyanate-reactive polymer and/or resin has an average molecular weight exceeding 8,000 g/mol, and/or said least one isocyanate-reactive polymer and/or resin is selected from the group consisting of isocyanate-reactive polymers and copolymers. 6. The reactive hot-melt adhesive element of claim 1, further comprising at least one catalyst, in amounts of from 0.01 to 5% w/w relative to the reactive hot-melt adhesive element, said catalyst being homogenously distributed over said least one isocyanate-reactive polymer anchor resin matrix and embedded herein, said catalyst being selected from the group consisting of organic tin compounds; organic iron, lead, cobalt, bismuth, antimony and zinc compounds and mixtures of these compounds; and catalysts based on amines. 7. The reactive hot-melt adhesive element of claim 1, wherein said non-isocyanate-reactive polymer, wax and/or resin is selected from the group consisting of: (i) aliphatic, cyclic or cycloaliphatic hydrocarbon resins, terpene phenol resins, cumarone indene resins, a-methylstyrene resins, polymerized liquid resin esters and ketonaldehyde resins, with low acid values of less than 1 mg KOH/g; (ii) ethylene/vinyl acetate polymers and copolymers, with vinyl acetate contents of between 12 and 40% w/w and/or with melt indices (MIFIs, DIN53735) of 8 to 800; (iii) polyolefins, with average molecular weights of 5,000 to 25,000 g/mol, and/or with ring and ball softening ranges of between 80 and 170째 C.; (iv) (meth)acrylates; and (v) polyolefin waxes; and mixtures of these compounds. 8. The reactive hot-melt adhesive element of claim 1, further comprising at least one isocyanate-reactive mono-functional additive, in an amount of from 0 to 20% w/w relative to the reactive hot-melt adhesive element, said least one mono-functional additive being selected from the group consisting of mono-functional amines, alcohols, mercaptans and mono-functional additives which comprise an isocyanate-reactive functional group. 9. The reactive hot-melt adhesive element of claim 1, wherein the individual constituents or contents are embedded and homogenously distributed in each other. 10. The reactive hot-melt adhesive element of claim 1, wherein said adhesive element is non-sticky or non-adhesive at room-temperature and becomes sticky or adhesive at temperatures above room-temperature, and begins to cross-link at temperatures of from 60째 C. to 160째 C., and wherein the duration of cross-linking is less than 10 minutes. 11. The reactive hot-melt adhesive element of claim 1, wherein when the cross-linking process has been initiated via heating to a temperature of from 100째 C. to to 160째 C., followed by immediate cooling to room-temperature, the duration of cross-linking is for about 5 to 8 days at room-temperature. 12. The reactive hot-melt adhesive element of claim 1, wherein said adhesive element cross-links during exposure to heat and moisture. 13. The reactive hot-melt adhesive element of claim 1, having a layer thickness of 10 μm to 1,000 μm. 14. The reactive hot-melt adhesive element of claim 1, in the form of a foil, film, strip or reactive adhesive tape, which may optionally be wound into a roll and/or stored in a cassette. 15. The reactive hot-melt adhesive element of claim 1, further comprising: up to 25% w/w of at least one additive for improving heat conductivity and/or sensitivity to radiation induction; said amounts being based on the reactive hot-melt adhesive element. 16. A process for manufacturing the reactive hot-melt adhesive element of claim 1, said process comprising: a) mixing the individual constituents or contents, without a reaction between the individual constituents or contents taking place in the case of a solid isocyanate; b) optionally, cooling or permitting to cool the resulting mixture or mass until said mixture or mass cools and/or hardens; c) processing the mixture or mass to a film, optionally with heating to above room-temperature, but without a reaction between the individual constituents or contents taking place; d) optionally, cooling or permitting the film to cool to room-temperature; and e) optionally, further processing the film, into foils, or smaller pieces etc. and/or winding into rolls. 17. An adhesive bonding process for the permanent bonding of substrates to be joined, comprising: a) providing a first and a second substrate to be bonded; b) applying the reactive hot-melt adhesive element of claim 1 to at least a region of the first substrate, during exposure to heat and/or pressure, optionally while melting the reactive constituents and thereby initiating the cross-linking process; c) joining said first and second substrates while contacting said second substrate with at least the region of the first substrate provided with the reactive hot-melt adhesive element; d) pressing together said two substrates, while initiating the cross-linking process, during exposure to heat and/or moisture; and thereafter; e) hardening or curing, optionally during exposure to pressure and/or heat and/or moisture. 18. An adhesive bonding process for the permanent bonding of substrates to be joined, comprising: a) providing a first and a second substrate to be bonded and the reactive hot-melt adhesive element according to claim 1; b) joining said first and second substrate with said reactive hot-melt adhesive element being positioned between said first and second substrates; c) pressing together said first and second substrates joined together in step b), during exposure to heat and/or moisture, while melting the reactive constituents and thereby initiating the cross-linking process; and thereafter d) hardening or curing, optionally during exposure to pressure and/or heat and/or moisture. 19. A self-supporting reactive hot-melt adhesive element, comprising: a reactive one-component hot-melt adhesive which is solid at room-temperature, wherein said reactive one-component hot-melt adhesive comprises: (i) 0.5 to 30% w/w relative to the reactive hot-melt adhesive element of a mixture of at least two free non-blocked aliphatic and/or aromatic di-and/or polyisocyanates which are solid or liquid at room-temperature wherein at least one of said di-and/or polyisocyanates in said mixture is an unsymmetrically substituted di-and/or polyisocyanate comprising isocyanate functions of different reactivity, wherein said isocyanate mixture comprises a mixture of 4,4'-diisocyanatodiphenylmethane and 2,4'-diisocynatodiphenylmethane, the content of 2,4'-diisocyanatodiphenylmethane exceeding 20% w/w, relative to the isocyanate mixture; (ii) 20 to 90% w/w relative to the reactive hot-melt adhesive element of at least one isocyanate-reactive polymer and/or resin which is solid at room-temperature; and (iii) at least one non-isocyanate-reactive polymer, wax and/or resin wherein the maximum amount of said non-isocyanate-reactive polymer, wax and/or resin is 60% w/w relative to the reactive hot-melt adhesive element; wherein the content of free NCO-groups in said reactive hot-melt adhesive element is at least 0.5% w/w relative to the reactive hot-melt adhesive element; and wherein said at least one non-isocyanate-reactive polymer, wax and/or resin combines with said at least one isocyanate-reactive polymer and/or resin to form a matrix into which said at least one isocyanate is incorporated in homogenous distribution. 20. A process for manufacturing the reactive hot-melt adhesive element of claim 19, said process comprising: a) mixing the individual constituents or contents, without a reaction between the individual constituents or contents taking place in the case of a solid isocyanate; b) optionally, cooling or permitting to cool the resulting mixture or mass until said mixture or mass cools and/or hardens; c) processing the mixture or mass to a film, optionally with heating to above room-temperature, but without a reaction between the individual constituents or contents taking place; d) optionally, cooling or permitting the film to cool to room-temperature; and e) optionally, further processing the film, into foils, or smaller pieces etc. and/or winding into rolls. 21. An adhesive bonding process for the permanent bonding of substrates to be joined, comprising: a) providing a first and a second substrate to be bonded; b) applying the reactive hot-melt adhesive element of claim 19 to at least a region of the first substrate, during exposure to heat and/or pressure, optionally while melting the reactive constituents and thereby initiating the cross-linking process; c) joining said first and second substrates while contacting said second substrate with at least the region of the first substrate provided with the reactive hot-melt adhesive element; d) pressing together said two substrates, while initiating the cross-linking process, during exposure to heat and/or moisture; and thereafter; e) hardening or curing, optionally during exposure to pressure and/or heat and/or moisture. 22. An adhesive bonding process for the permanent bonding of substrates to be joined, comprising: a) providing a first and a second substrate to be bonded and the reactive hot-melt adhesive element according to claim 19; b) joining said first and second substrate with said reactive hot-melt adhesive element being positioned between said first and second substrates; c) pressing together said first and second substrates joined together in step b), during exposure to heat and/or moisture, while melting the reactive constituents and thereby initiating the cross-linking process; and then d) hardening or curing, optionally during exposure to pressure and/or heat and/or moisture.
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이 특허에 인용된 특허 (11)
Ernst Schutz DE, Adhesive tape pack for further processing, for example in book-or binding technology.
Pinfold Raymond N. F. (Frisby-on-the-Wreake EN) Carpenter Austin T. (Leicester EN) Hall John R. (Old Dalby EN) Hardy Alan (Leicester EN) Johl Jogindar (Leicester EN), Heat-softenable polyesterurethane adhesive.
Thomas Abend CH, Method for producing and using storage-stable, latent-reactive layers or powders of surface-deactivated, solid polyisocyanates and dispersion polymers with functional groups.
Zöllner, Stephan; Hansen, Sven; Brandes, Kay; Speer, Jorg, Method of producing a self-adhesive tape having a layer of photoinitiator-free pressure-sensitive acrylate hotmelt adhesive.
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