초록 ▼

A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute inform

A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A combination of first attribute information and second attribute information is analyzed to determine an inspection attribute of the conductor at the conductor location. Attribute information may relate to one or more of: reflectance, fluorescence or height.

대표청구항 ▼

What is claimed: 1. An electrical circuit inspection apparatus comprising: a first inspection functionality operative to obtain first attribute information with respect to a first attribute associated with a conductor location on an electrical circuit; a second inspection functionality operative to

What is claimed: 1. An electrical circuit inspection apparatus comprising: a first inspection functionality operative to obtain first attribute information with respect to a first attribute associated with a conductor location on an electrical circuit; a second inspection functionality operative to obtain second attribute information with respect to a second attribute associated with said conductor location on said electrical circuit, said second attribute being different from said first attribute; and a conductor attribute analyzer receiving said first attribute information and said second attribute information and providing a defect indication for a conductor location whereat a defect is indicated in said first attribute information and additionally indicated in said second attribute information. 2. The electrical circuit inspection apparatus according to claim 1, wherein said first inspection functionality senses reflectivity at said conductor location as a basis for said first attribute information. 3. The electrical circuit inspection apparatus according to 2, wherein said second inspection functionality senses luminescence at said conductor location as a basis for said second attribute information. 4. The electrical circuit inspection apparatus according to claim 1, wherein said second inspection functionality senses luminescence at said conductor location as a basis for said second attribute information. 5. An electrical circuit inspection method comprising: obtaining first attribute information for a first attribute associated with a conductor at a plurality of conductor locations on an electrical circuit; obtaining second attribute information for a second attribute associated with a conductor at said plurality of locations, said second attribute being different than said first attribute; and determining a conductor defect at one or more of said conductor locations, said determining comprising: identifying a first conductor structure from said first attribute information; additionally identifying a second conductor structure from said second attribute information; and outputting a defect indication for locations whereat said first conductor structure and said second conductor structure are indicative of a defect. 6. The electrical circuit inspection method according to claim 5, wherein said obtaining of said first attribute information comprises sensing a reflectivity value. 7. The electrical circuit inspection method to 6, wherein said providing of said second attribute information comprises sensing a luminescence value. 8. The electrical circuit inspection method according to claim 5, wherein said obtaining of said second attribute information comprises sensing a luminescence value. 9. The electrical circuit inspection method according to claim 5, and wherein said obtaining of said second attribute information comprises sensing a height value. 10. The electrical circuit inspection method according to claim 9, wherein said obtaining of said second attribute information further comprises sensing said height value based on a topographical profile. 11. The electrical circuit inspection method according claim 5, further comprising employing said inspection attribute to determine a defect in a process used to fabricate said electrical circuit. 12. The electrical circuit inspection method according to claim 5, further comprising making a production determination based on said inspection attribute. 13. The electrical circuit inspection method according to claim 12, wherein said production determination is one of: approving said electrical circuit; discarding said electrical circuit; and repairing said electrical circuit. 14. The electrical circuit inspection method according to claim 5, wherein said first conductor structure corresponds to a different part of a conductor than said second conductor structure. 15. The electrical circuit inspection method according to claim 5, wherein said first conductor structure corresponds to the same part of a conductor as said second conductor structure.