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Heat pipe evaporator with porous valve 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-015/00
출원번호 US-0930018 (2004-08-30)
발명자 / 주소
  • Thayer,John Gilbert
  • Ernst,Donald M.
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 29  인용 특허 : 46

초록

An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is covered with

대표청구항

What is claimed is: 1. An evaporator comprising: an enclosure having a fluid inlet manifold and a vapor outlet manifold; at least one blind passageway that opens into a portion of said vapor outlet manifold and is centrally defined within a capillary wick; an internal fin structure disposed adjacen

이 특허에 인용된 특허 (46)

  1. Firtion Victor A. (Secaucus NJ) Herriott Donald R. (Morris Township ; Morris County NJ) Poulsen Martin E. (New Providence NJ) Rongved Leif (Convent Station NJ) Saunders Thomas E. (Basking Ridge NJ), Apparatus and method for holding and planarizing thin workpieces.
  2. Firtion Victor A. (Secaucus NJ) Herriott Donald R. (Morris Township ; Morris County NJ) Poulsen Martin E. (New Providence NJ) Rongved Leif (Summit NJ) Saunders Thomas E. (Basking Ridge NJ), Apparatus and method for holding and planarizing thin workpieces.
  3. Steger Robert ; Taoka James ; Shmunis Gregory, Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body.
  4. Wheeler William R. (Saratoga CA) Lee Steven R. (Mountain View CA), Apparatus for heating and cooling articles.
  5. Swanson Theodore D. ; Wren ; deceased Paul, Capillary pumped loop body heat exchanger.
  6. Donde Arik ; Maydan Dan ; Steger Robert J. ; Weldon Edwin C. ; Lue Brian ; Dyer Timothy, Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck.
  7. Selbrede Steven C. (San Jose CA), Differential pressure CVD chuck.
  8. Abrami Anthony J. (Poughkeepsie) Bullard Stuart H. (Pleasant Valley) del Puerto Santiago E. (Wappingers Falls) Gaschke Paul M. (Pleasantville) LaForce Mark R. (Pleasant Valley) Roggemann Paul J. (Hop, Dry interface thermal chuck temperature control system for semiconductor wafer testing.
  9. Miyata Eiji (Fuchu JPX) Sugiyama Masahiko (Nirasaki JPX) Kohno Masahiko (Yamanashi JPX) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
  10. Di Milia, Vincent; Maldonado, Juan R.; Speidell, James L.; Warlaumont, John M., Electrostatic or vacuum pinchuck formed with microcircuit lithography.
  11. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporator employing a liquid superheat tolerant wick.
  12. Willemsen Henricus P. (Aarle-Rixtel NLX) Dirix Carolina A. M. C. (Westervoort NLX) Te Boekhorst Theodorus G. J. (Zevenaar NLX), Heat exchanging member.
  13. Miyazawa Toshio,JPX ; Hatta Masataka,JPX ; Akiyama Masahiko,JPX, Inspecting method and apparatus for semiconductor integrated circuit.
  14. Akira Yao JP; Hiroaki Ishikawa JP; Tetsurou Ogushi JP; Eiichi Ozaki JP, Loop type heat pipe.
  15. Moslehi Mehrdad M. (Dallas TX) Najm Habib N. (Dallas TX) Paranjpe Ajit P. (Dallas TX) Davis Cecil J. (Greenville TX), Method and apparatus for low-temperature semiconductor processing.
  16. Robert A. Weaver ; Paul R. McHugh ; Gregory J. Wilson, Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature.
  17. Suzuki Katsumi (Tokyo JPX), Method for developing a resist pattern.
  18. Shichida Hiroyuki (Kudamatsu JPX) Tamura Naoyuki (Kudamatsu JPX) Makino Akitaka (Kudamatsu JPX), Method of and apparatus for securing and cooling/heating a wafer.
  19. Okamoto Shin,JPX ; Inazawa Kouichiro,JPX ; Furuya Sachiko,JPX ; Koizumi Maki,JPX, Method of etching a substrate.
  20. Eager George (Cambridge MA) Schey Thomas J. (Woonsocket RI) Selverstone Peter (Cambridge MA), Mixing valve air source.
  21. Gluck Donald F. ; Gerhart Charlotte, Multifunctional capillary system for loop heat pipe statement of government interest.
  22. Arami Junichi,JPX ; Ishikawa Kenji,JPX ; Kitamura Masayuki,JPX, One-by-one type heat-processing apparatus.
  23. Muka Richard S. (Topsfield MA), Passive gas substrate thermal conditioning apparatus and method.
  24. Mohn Jon ; Tsui Joshua Chiu-Wing ; Collins Kenneth S., Plasma guard for chamber equipped with electrostatic chuck.
  25. Chapman Robert A., Plasma reactor with magnet for protecting an electroacoustic chuck from the plasma.
  26. Edamura Manabu,JPX ; Nishio Ryoji,JPX ; Yoshioka Ken,JPX ; Kanai Saburo,JPX, Plasma treatment device.
  27. Garner, Scott D., Porous vapor valve for improved loop thermosiphon performance.
  28. Schwindt Randy (Portland OR), Probe station having conductive coating added to thermal chuck insulator.
  29. Kuzay Tuncer M. (Naperville IL), Process of making cryogenically cooled high thermal performance crystal optics.
  30. Weislogel Mark M. (23133 Switzer Rd. Brookpark OH 44142), Pulse thermal energy transport/storage system.
  31. Kinoshita Yoshimi (Amagasaki JPX) Kanda Tomoyuki (Amagasaki JPX) Kitano Katsuhisa (Amagasaki JPX) Yoshida Kazuo (Amagasaki JPX) Ohnishi Hiroshi (Amagasaki JPX) Yamanishi Kenichiro (Amagasaki JPX) Sas, Semiconductor producing apparatus comprising wafer vacuum chucking device.
  32. Lutz, Robert C.; Dickson, Lloyd B.; Eddington, Ralph James, Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control.
  33. Ishikawa Kenji (Sagamihara JPX) Komino Mitsuaki (Tokyo JPX) Mitui Tadashi (Yamanashi JPX) Iwata Teruo (Nirasaki JPX) Arai Izumi (Yokohama JPX) Tahara Yoshifumi (Tokyo JPX), Stage having electrostatic chuck and plasma processing apparatus using same.
  34. Saeki Hiroaki (Yamanashi JPX) Asakawa Teruo (Yamanashi JPX) Masuoka Noboru (Yamanashi JPX) Kondo Masaki (Yamanashi JPX), Stage having electrostatic chuck and plasma processing apparatus using same.
  35. Okamura Nobuyuki (Kawasaki JPX), Substrate heating mechanism.
  36. Imai Yuji,JPX, Substrate holding apparatus.
  37. Masakazu Sugaya JP; Fumio Murai JP; Yutaka Kaneko JP; Masafumi Kanetomo JP; Shigeki Hirasawa JP; Tomoji Watanabe JP; Tatuharu Yamamoto JP; Katsuhiro Kuroda JP, Substrate temperature control system and method for controlling temperature of substrate.
  38. Hatta Masataka,JPX, Temperature control apparatus for sample susceptor.
  39. Costello, Simon; Pham, Tuyen Paul, Temperature-controlled semiconductor wafer chuck system.
  40. Strodtbeck Timothy A. ; Molebash John S. ; Hayes Bruce L. ; Smith Rex A. ; Davis Shawn D., Thermal conditioning apparatus.
  41. Benjamin Neil ; Hylbert Jon ; Mangano Stefano, Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and.
  42. Dhindsa Rajinder ; Franchuk Steven ; Manzanilla Carlos ; Tokunaga Ken E., Wafer electrical discharge control by wafer lifter system.
  43. Poluzzi Henry Benjamin (Poughkeepsie NY) Roberti Anthony M. (Austin TX) Romich Wilfried Robert (Wappingers Falls NY), Wafer handler.
  44. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR), Wafer probe station for low-current measurements.
  45. Harwood Warren K. ; Tervo Paul A. ; Koxxy Martin J., Wafer probe station having environment control enclosure.
  46. Getchel Paul A. ; Cole ; Sr. Kenneth M. ; Lyden Henry A., Workpiece chuck.

이 특허를 인용한 특허 (29)

  1. Chainer, Timothy J.; Parida, Pritish R.; Silberman, Joel A., Active control for two-phase cooling.
  2. Chainer, Timothy J.; Parida, Pritish R.; Silberman, Joel A., Active control for two-phase cooling.
  3. Lu, Minhua; Mok, Lawrence S., Cooling of substrate using interposer channels.
  4. Shih,Jung Sung; Wu,Wei Fang; Huang,Yu Hung; Chen,Chin Ming, Heat dissipation module.
  5. Gradinger, Thomas; Agostini, Bruno; Merk, Marcel, Heat exchanger for traction converters.
  6. Huang, Bin-Juine; Wang, Chih-Hung; Huang, Huan-Hsiang; Yeh, Yu-Yuan, Heat pipe cooling system and thermal connector thereof.
  7. Liao,Wen Chih, Heat sink modules for light and thin electronic equipment.
  8. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, Integrated thermal systems.
  9. Wang, De-Yu; Xu, Chao; Hu, Jiang-Jun, Loop heat pipe.
  10. Ichkhan, Joseph; Schroeder, John; Rockwell, David A., Method and apparatus for cooling a fiber laser or amplifier.
  11. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  12. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  13. Berukhim, David; Leishman, Andrew; Avanessian, Vahe, Plate-fin heat exchanger with a porous blocker bar.
  14. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes.
  15. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, Semiconductor-based porous structure enabled by capillary force.
  16. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, System and method of a heat transfer system with an evaporator and a condenser.
  17. Zhang, Chunbo; Gu, Yuandong; Kristoffersen, Martin; Kulacki, Francis A.; Krafthefer, Brian C., System and method that dissipate heat from an electronic device.
  18. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  19. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  20. Hoang, Triem T., Temperature actuated capillary valve for loop heat pipe system.
  21. Hoang, Triem T., Temperature actuated capillary valve for loop heat pipe system.
  22. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  23. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  24. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  25. Shuja, Ahmed, Two-phase cooling for light-emitting devices.
  26. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  27. Dupont, Vincent, Two-phase heat transfer device.
  28. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Wicking and coupling element(s) facilitating evaporative cooling of component(s).
  29. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Wicking and coupling element(s) facilitating evaporative cooling of component(s).
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