$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Sintered grooved wick with particle web

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0128454 (2005-05-13)
발명자 / 주소
  • Garner,Scott D.
  • Lindemuth,James E.
  • Toth,Jerome E.
  • Rosenfeld,John H.
  • Minnerly,Kenneth G.
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 11  인용 특허 : 87

초록

A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed

대표청구항

What is claimed is: 1. A grooved sintered wick for a heat pipe comprising a plurality of individual particles which together yield an average particle diameter, and including at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said

이 특허에 인용된 특허 (87)

  1. Beisecker Mark B. (Brookline MA), Automatic temperature control system with manual off override for a catalytically heated curling device.
  2. Nowak Bernard E. (Westlake OH) Reardon Joseph P. (Fairview Park OH), Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein.
  3. Nowak Bernard E. (Westlake OH) Reardon Joseph P. (Fairview Park OH), Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein.
  4. Dinh Khanh (Alachua FL), Booster heat pipe for air-conditioning systems.
  5. Bonnema James V. (Peabody MA), Catalytic support for a curling device.
  6. Seidenberg Benjamin (Baltimore MD) Swanson Theodore D. (Columbia MD), Ceramic heat pipe wick.
  7. Girrens Troy M. ; Fessenden Robert Gordon ; Ruch Dianne K. ; Douglas Thomas P. ; Guse Timothy J. ; Colwell Billy R. ; Faulkner Sidney T., Circuit board assembly with IC device mounted thereto.
  8. Hobson Alex R. ; McCollam F. Michael J.,GBX ; Powell Beth P., Cleaning assembly for critical image surfaces in printer devices and method of using same.
  9. Tanaka Hiroshi,JPX ; Kobayashi Kazuo,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Matsumoto Tatsuhito,JPX, Cooling apparatus by boiling and cooling refrigerant.
  10. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
  11. Conte Alfred S. (Hollister CA), Cooling multi-chip modules using embedded heat pipes.
  12. Mink Ronald W. ; Goldstein Andrew S., Device for collection and assay of oral fluids.
  13. Desage Robert (Verneuil FRX), Device for the rapid vaporization of a liquid.
  14. Dietzsch Claudius R. (Stein am Rhein CHX), Device for transferring heat energy by capillary forces.
  15. Tittert, Curt, Electrical ignition system for a catalytically heated curling device.
  16. Meyer ; IV George A. (Conestoga PA) Garner Scott D. (Lititz PA), Electrically insulated envelope heat pipe.
  17. Ouchi Katsunori (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Naganuma Yoshio (Hitachi JPX) Sato Koji (Hitachi JPX) Kaji Ryuichi (Kitaibaraki JPX), Electronic equipment and computer with heat pipe.
  18. Murphy John E. (Los Angeles CA) Gardner William T. (Los Angeles CA), Electronic module with self-activated heat pipe.
  19. Grote Michael G. (St. Louis MO) Stark John A. (Florissant MO) Tefft ; III Edward C. (St. Louis MO), Enhanced evaporator surface.
  20. Gernert Nelson J. (Elizabethtown PA) Ernst Donald M. (Leola PA) Shaubach Robert M. (Lititz PA), External artery heat pipe.
  21. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  22. Masaaki Yamamoto JP; Jun Niekawa JP; Yuichi Kimura JP; Kenichi Namba JP, Flat type heat pipe.
  23. Marcus Bruce D. (Los Angeles CA) Fleischman George L. (Inglewood CA), Flat-plate heat pipe.
  24. Cullimore Brent A. (Littleton CO) Egan Curtis W. (Littleton CO) Clark David L. (Highland Ranch CO), Flowrate controller for hybrid capillary/mechanical two-phase thermal loops.
  25. Rice Edwin E. (Ann Arbor MI) Norris Hugh R. (Howell MI), Friction control for bearing surface of roller.
  26. Rabe Peter (Muhlheim (Main) DT), Gas lighter burner.
  27. Chandrakant D. Patel ; Marvin S. Keshner, Heat dissipating chassis member.
  28. Eastman George Y. (Lancaster PA), Heat pipe.
  29. Cirrito Vincent (Massapequa Park NY) Koubek Kevin J. (South Setauket NY) Quadrini John A. (Northport NY), Heat pipe cooled electronic circuit card.
  30. Basiulis Algerd (Redondo Beach CA), Heat pipe cooling module for high power circuit boards.
  31. Meyer ; IV George A. (Conestoga PA) Coleman Robert F. (Lancaster PA), Heat pipe cooling plate.
  32. Lewis, Wallace J.; Bolser, David R., Heat pipe fabrication.
  33. Del Bagno Anthony C. (12 Cedar St. Newton NJ 07860) Giordano Richard R. (12 Cedar St. Newton NJ 07860) Rose Frederick (12 Cedar St. Newton NJ 07860), Heat pipe having multiple integral wick structures.
  34. Xie Hong, Heat pipe lid for electronic packages.
  35. Brown Richard F. (Hauppauge NY) Cordes Bruce (Rockville Centre NY) Edelstein Fred (Hauppauge NY) Kosson Robert L. (Massapequa NY), Heat pipe manifold with screen-lined insert.
  36. Haslett Robert A. (Dix Hills NY), Heat pipe panel and method of fabrication.
  37. Nelson ; Lloyd A. ; Sekhon ; Kalwant S., Heat pipe thermal mounting plate for cooling electronic circuit cards.
  38. Murase Takashi (Yokohama JPX) Tanaka Suemi (Nishinomiya JPX), Heat pipe type cooling apparatus for semiconductor.
  39. Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX), Heat pipe type radiation for electronic apparatus.
  40. Adkins Douglas Ray ; Shen David S. ; Tuck Melanie R. ; Palmer David W. ; Grafe V. Gerald, Heat pipe with embedded wick structure.
  41. Adkins Douglas Ray ; Shen David S. ; Tuck Melanie R. ; Palmer David W. ; Grafe V. Gerald, Heat pipe with embedded wick structure.
  42. Benson David A. ; Robino Charles V. ; Palmer David W. ; Kravitz Stanley H., Heat pipe with improved wick structures.
  43. Lijoi Bruno (Farmingdale NY) Cirrito Vincent (Massapequa Park NY) Edelstein Fred (Hauppauge NY), Heat-pipe cooled electronic circuit card.
  44. Rosenfeld John H. (Lancaster PA) Keller Robert F. (Lancaster PA), High permeability heat pipe wick structure.
  45. Furnival Courtney (Temecula CA), High power semiconductor device module with low thermal resistance and simplified manufacturing.
  46. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger, and clamping plate.
  47. Dussinger Peter M. ; Myers Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  48. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit heat sink with rotatable heat pipe.
  49. Sayka Anthony (San Antonio TX) Siddiqui Mohammad A. (San Antonio TX), Integrated circuit package including a heat pipe.
  50. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
  51. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
  52. Sievers Robert K. ; Hunt Thomas K. ; Hendricks Terry J., Internal self heat piping AMTEC cell.
  53. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  54. Guadagnin Laurent J. (Annecy FRX) Grossiord Claude R. (Annecy FRX) Jensen John A. (Annecy DC FRX) Kawam Antoine (Washington DC) Mouchet Jacques M. (Annecy-le-Vieux FRX) Royer Michel E. (la Balme de S, Liquefied gas apparatus.
  55. Edward J. Kroliczek ; Kimberly R. Wrenn ; David A. Wolf, Sr., Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction.
  56. Andres Helmut (Kiel DEX) Fichtner Karl-Heinz (Strande DEX) Fisher Hans-Siegfried (Kiel DEX), Lubricant recirculation system for the bearing of a rotating shaft.
  57. Leonard John F. (Beavercreek OH) Hager Brian G. (Kettering OH), Method for making an anisotropic heat pipe and wick.
  58. Akutsu Shoji,JPX, Method of checking whether noncondensable gases remain in heat pipe and process for producing heat pipe.
  59. Leonard John F. (Beavercreek OH) Beam Jerry E. (Beavercreek OH), Method of manufacturing heat pipe wicks.
  60. Leonard John F. (Beavercreek OH) Beam Jerry E. (Beavercreek OH), Method of manufacturing heat pipe wicks and arteries.
  61. Leonard, John F., Method of wet coating a ceramic substrate with a liquid suspension of metallic particles and binder applying similar dry metallic particles onto the wet surface, then drying and heat treating the art.
  62. Ponnappan Rengasamy ; Leland John E., Micro channel heat pipe having wire cloth wick and method of fabrication.
  63. Sindorf John F. (Pewaukee WI), Nickel-hydrogen battery with oxygen and electrolyte management features.
  64. Thompson Hugh A. (Fairfield OH) Krautter Edward H. (Cincinnati OH), Open capillary channel structures, improved process for making capillary channel structures, and extrusion die for use t.
  65. Liu Chunyan, Overheat regulating system for vehicle passenger compartment.
  66. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Ueki Tatsuhiko,JPX ; Sasaki Ken,JPX, Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe.
  67. Seidenberg Benjamin (Baltimore MD), Polymeric heat pipe wick.
  68. Seydel Scott O. (80 Broad St. ; NW. Atlanta GA 30303) Letbetter William D. (80 Broad St. ; NW. Atlanta GA 30303) Cutts William H. (P.O. Box 748 Clemson SC 29631), Porous warp sizing apparatus.
  69. Thompson Hugh A. (Fairfield OH) Kraut6ter Edward H. (Cincinnati OH), Process for making capillary channel structures and extrusion die for use therein.
  70. Saxena Vinit (Pleasanton CA) Andresen Brian D. (Pleasanton CA), Radial thin layer chromatography.
  71. Liao Qiang,HKX ; Zhao Tianshou,HKX ; Cheng Ping,HKX, Rapid vapor generator.
  72. Hickel Gerhard (Goissumstadt Klee DEX), Rotary ignition system for a catalytically heated curling device.
  73. Tittert Curt (Dreieich-Gtzenhain DEX), Rotary ignition system for a catalytically heated curling device.
  74. Edwards Thomas C. (1426 Gleneagles Way Rockledge FL 32955), Rotary vane machines with anti-friction positive bi-axial vane motion controls.
  75. Eastman George Y. (Lancaster PA), Sintered grooved wicks.
  76. Kirlin Peter S. ; Binder Robin L. ; Gardiner Robin A. ; Van Buskirk Peter ; Stauf Gregory ; Zhang Jiming, Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same.
  77. Tanzer Herbert J. (Topanga CA), Space vehicle thermal rejection system.
  78. Tokuno Kenichi,JPX ; Morisaki Ikushi,JPX ; Doya Akihiro,JPX ; Bonkohara Manabu,JPX ; Senba Naoji,JPX ; Shimada Yuuzou,JPX ; Utumi Kazuaki,JPX, Stack module.
  79. Akachi Hisateru (Kanagawa JPX), Structure of a heat pipe.
  80. Akachi Hisateru (Sagamihara JPX), Structure of micro-heat pipe.
  81. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  82. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  83. Thomas Daniel Lee, Thin planar heat spreader.
  84. Thomas Daniel Lee, Thin, planar heat spreader.
  85. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.
  86. Duncan David B. (Livermore CA), Wick for metal vapor laser.
  87. Grote Michael G. (Maryland Heights MO), Wick-fin heat pipe.

이 특허를 인용한 특허 (11)

  1. Weyant, Jens E.; Dechristopher, Michael; Anderson, William G., Constant conductance heat pipe assembly for high heat flux.
  2. Kim, Jung Kyun; Kim, Sung Ki; Kim, Sru; Cho, Jin Hyun, Display apparatus.
  3. Chauhan, Shakti Singh; Weaver, Jr., Stanton Earl; Deng, Tao; Eastman, Christopher Michael; Zhang, Wenwu, Heat exchange assembly and methods of assembling same.
  4. Ahrens,Michael E., Optical transponder with active heat transfer.
  5. Wits, Wessel Willems; Mannak, Jan Hendrik; Legtenberg, Rob, Planar heat pipe for cooling.
  6. Lee, Ke-Chin, Sintered heat pipe.
  7. Wolfe, Mark; Partridge, Julian, System, apparatus and method for cooling electronic components.
  8. Faneuf,Barrett; Aldridge,Tomm, Systems to cool multiple electrical components.
  9. Hoang, Triem T., Temperature actuated capillary valve for loop heat pipe system.
  10. Wilson, James S., Thermal management system and method for thin membrane type antennas.
  11. Zhang, Sheng-Chao; Zhou, Zhi-Yong, Vapor chamber and method for manufacturing the same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트