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A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability. The semiconductor device

A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability. The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

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What is claimed is: 1. A semiconductor device for fingerprint recognition, comprising: a semiconductor chip having a fingerprint recognition area for performing fingerprint recognition, a substrate having an opening that corresponds to said fingerprint recognition area, said semiconductor chip bein

What is claimed is: 1. A semiconductor device for fingerprint recognition, comprising: a semiconductor chip having a fingerprint recognition area for performing fingerprint recognition, a substrate having an opening that corresponds to said fingerprint recognition area, said semiconductor chip being flip chip bonded to a surface of said substrate such that said fingerprint recognition area corresponds to said opening, and an under-fill material provided between said semiconductor chip and said substrate except for a position where said opening is formed, wherein said surface of said substrate carries thereon plural external connection terminals constituted by a solder ball, such that said solder ball has a height as measured from said surface larger than a height of said semiconductor chip as measured from said surface. 2. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said substrate comprises a glass epoxy base material. 3. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said substrate comprises a polyimide resin base material. 4. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said substrate is a flexible substrate. 5. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said substrate is a TAB substrate. 6. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said substrate comprises an external connection terminal constituted by a solder ball. 7. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said substrate comprises an external connection terminal constituted by a connector. 8. The semiconductor device for fingerprint recognition as claimed in claim 1, wherein said semiconductor chip performs fingerprint recognition using the electrostatic-capacity principle, and by a finger sweeping across said fingerprint recognition area.