$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for temperature gradient control in an electronic system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-013/12
  • F28F-013/00
출원번호 US-0660733 (2000-09-13)
발명자 / 주소
  • Wilson,James S.
  • Fletcher,Timothy C.
  • Braiser,Lucian A.
  • Mason,James S.
출원인 / 주소
  • Raytheon Company
대리인 / 주소
    Baker Botts L.L.P.
인용정보 피인용 횟수 : 11  인용 특허 : 33

초록

An apparatus includes a plurality of Transmit/Receive (T/R) modules (20) coupled with a slat assembly (34). The slat assembly includes a fluid passageway (54). A plurality of turbulence inducing structures (62, 162, 262, 104, 204, 304, 462) are disposed within the fluid passageway. In one embodiment

대표청구항

What is claimed is: 1. An apparatus, comprising: a thermally conductive part having a fluid passageway formed therein, the fluid passageway having a fluid entrance and a fluid exit; turbulence inducing structure disposed along said passageway in a manner selected to achieve, in response to fluid f

이 특허에 인용된 특허 (33)

  1. Furukawa Masahiro (Ohra-gun JPX) Kaneko Toshiyuki (Ohta JPX) Kanuma Hitoshi (Ohra-gun JPX), Absorption type refrigerating machine.
  2. Tsuji Kenichi,JPX ; Kikuchi Yoshihito,JPX ; Mizuguchi Naoto,JPX, Advanced liquid cooling apparatus.
  3. Staehlin John H. (Lutherville MD) Shum Lanson Y. (Highland MD) Parry David W. (Ellicott City MD) Gabranski Frank B. (Linthicum MD) Comstock Douglas K. (Glen Burnie MD) Zirkle Albert F. (Columbia MD) , Back-to-back ridged branch manifold structure for a radar frequency antenna.
  4. Clyde Robert A. (P.O. Box 430820 South Miami FL 33143), Ceramic sponge heat-exchanger member.
  5. Hou Kai, Cold plate having uniform pressure drop and uniform flow rate.
  6. Staskus Michael P. ; Haden James M., Cooler for removing heat from a heated region.
  7. Block Harry (Erlangen DEX) Wiesenbacher Rudolf (Erlangen DEX), Cooling capsule for disc-shaped semiconductor components.
  8. Ludwig Richard M. ; Davis Richard J., Dimpled heat exchange tube.
  9. Albrecht Helmut (4954 Nettleton Rd. Medina OH 44256), Fireplace heat exchanger.
  10. Altoz Frank E. (Catonsville MD), Flexible diaphragm cooling device for microwave antennas.
  11. Drefahl Klaus (Hanau DEX) Gilles Helmut (Frankfurt am Main DEX), Gas cooler with multiply deformed lead tubes.
  12. Romero Guillermo L. ; Lee Tien-Yu T., Heat dissipation apparatus and method.
  13. Randlett Myron R. ; Webb Ralph L. ; Chamra Louay M., Heat exchange tube with embossed enhancement.
  14. Nakado, Koji; Inoue, Masashi, Heat exchanger and dimple tube used in the same, the tube having larger opposed protrusions closest to each end of tube.
  15. Perkins ; Calvin C., Heat exchanger structure for electronic apparatus.
  16. Wargo Alec, Heat sink device for power semiconductors.
  17. Ooba Kazuhiko (Tokyo JPX) Yoshisue Tatsuo (Tokyo JPX) Nishizawa Takeshi (Tokyo JPX) Isobe Gou (Tokyo JPX), Heat transfer tube for absorption refrigerating machine.
  18. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Intersecting flow network for a cold plate cooling system.
  19. Lavochkin Ronald B., Liquid cooled heat sink for cooling electronic components.
  20. Pellant Michal (Prague CSX) Zuna Jaroslav (Prague CSX) Novak Petr (Prague CSX) Zavazal Zdenek (Prague CSX) Kratina Jindrich (Prague CSX) Reichel Pavel (Prague CSX) Kafunek Pavel (Prague CSX), Liquid cooler for semiconductor power elements.
  21. Fitzgerald Patrick J. ; Buczek Steven G. ; Rupp Frederick C. ; Christopher Grace M., Liquid spray cooled module.
  22. Brian Alan Pluymers ; Robert Michael Reese, Low-temperature-difference TR module mounting, and antenna array using such mounting.
  23. Romero Guillermo L. (Phoenix AZ) Anderson Samuel J. (Tempe AZ) Pinder Brent W. (Tempe AZ), Metal matrix composite power dissipation apparatus.
  24. Ketonen Veli-Pekka ; Laureanti Steven J., Method and system for efficiently removing heat generated from an electronic device.
  25. Kimura Yuichi,JPX ; Yamamoto Masaaki,JPX ; Tanaka Suemi,JPX, Method for manufacturing cooling unit comprising heat pipes and cooling unit.
  26. Geyh Edward A. ; Zagrodnick Robert P. ; Rhein James E., Phased array antenna.
  27. Schubert Klaus,DEX ; Bier Wilhelm,DEX ; Linder Gerd,DEX ; Herrmann Erhard,DEX ; Koglin Bernd,DEX ; Menzel Thomas,DEX ; Maul Christine,DEX, Process for carrying out chemical reactions using a microlaminar mixer.
  28. Wunning Joachim,DEX, Recuperator and recuperator burner.
  29. Lu Lin-Tao (Fort Smith AR) Shenasa Ali (Fort Smith AR) Jakobs Diane M. (Alma AR) Stokes Gallen W. (Fort Smith AR), Serpentined tubular heat exchanger apparatus for a fuel-fired forced air heating furnace.
  30. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
  31. Iversen Arthur H. (15315 Sobey Rd. Saratoga CA 95070), Thermal management of power conditioning systems.
  32. Galyon George Tipton ; Kemink Randall Gail ; Schmidt Roger Ray, Tube in plate heat sink.
  33. Hougland Jerry M. (Oakdale CA) Hay Lloyd F. (Oakdale CA), Turbulating heat exchange tube and system.

이 특허를 인용한 특허 (11)

  1. Coteus, Paul W.; Hall, Shawn A.; Schultz, Mark D.; Takken, Todd E.; Tian, Shurong, Burst resistant thin wall heat sink.
  2. Marroquin, Christopher M.; O'Connell, Kevin M.; Schultz, Mark D.; Tian, Shurong, Cold plate.
  3. Marroquin, Christopher M.; O'Connell, Kevin M.; Schultz, Mark D.; Tian, Shurong, Cold plate.
  4. Altman, David H.; Ellsworth, Joseph R.; Null, Michael E., Distributed transmit/receive integrated microwave module chip level cooling system.
  5. Coteus, Paul W.; Hall, Shawn A.; Schultz, Mark D.; Takken, Todd E.; Tian, Shurong, Flexible cold plate with enhanced flexibility.
  6. Blanc, Jean-Pierre; Goering, Alain, Fluid circulation conduit.
  7. Yamada, Sayaka; Higashi, Yasuo; Nishimura, Makoto; Yoshida, Tatsuo; Noishiki, Koji, Heat exchanger.
  8. Kim, Gerald Ho, Silicon-based thermal energy transfer device and apparatus.
  9. Weber, Richard M.; Allen, Brandon H.; Weissmann, Daniel J.; Wyatt, William G., System and method for cooling structures having both an active state and an inactive state.
  10. Chen, Kevin W.; Harokopus, William P.; Cunningham, Patrick W., Thermal dissipation mechanism for an antenna.
  11. Wilson, James S., Thermal management system and method for thin membrane type antennas.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로