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Forced fluid heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-003/12
  • F28F-003/00
출원번호 US-0739759 (2003-12-18)
발명자 / 주소
  • Wilson,Michael J.
  • Wert,Kevin L.
  • Wattelet,Jonathan
  • DeKeuster,Richard
  • Lightner,Donald
출원인 / 주소
  • Modine Manufacturing Co.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 23  인용 특허 : 61

초록

A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bore

대표청구항

What is claimed is: 1. A heat exchanger for cooling a heat generating device comprising: a housing including a lid, a peripheral wall formed of a discrete member separate from said lid, and a bottom wall formed of a discrete member separate from said lid, arranged so as to define an enclosure, wher

이 특허에 인용된 특허 (61)

  1. McGovern Thomas (San Diego CA) Whitesides Robert B. (Murrysville PA), Air heat exchanger.
  2. Salmonson Richard B., Air or liquid cooled computer module cold plate.
  3. Zhou Shaojun James ; Keyvan Mahnaz Rezaie ; Seminara Gary ; Pickup Helen, Alumina-based hydrophilic antimicrobial coating.
  4. Marsala, Joseph, Cold plate utilizing fin with evaporating refrigerant.
  5. Lovgren Eric P. (Hurley NY) Rearick Donald P. (Shokan NY) Wells Clifford B. (Hyde Park NY), Composite liquid cooled plate for electronic equipment.
  6. Ashiwake Noriyuki,JPX ; Otaguro Toshio,JPX ; Nishihara Atsuo,JPX ; Honma Mitsuru,JPX, Electronic apparatus.
  7. Bakhru, Nanik; Grill, Alfred; Hopper, Gregory S.; Marotta, Egidio; Meyerson, Bernard S.; Patel, Vishnubhai V., Erosion/corrosion resistant diaphragm.
  8. Porter Warren W. (Escondido CA) Wall ; III Charles B. (Irmo SC), Focused CPU air cooling system including high efficiency heat exchanger.
  9. Romero Guillermo L. ; Lee Tien-Yu T., Heat dissipation apparatus and method.
  10. Pearl Steven R. ; Christy Charles D.,FRX, Heat exchange apparatus.
  11. Rhodes Eugene E. (Belleville MI), Heat exchange device.
  12. Kurematsu Masayuki,JPX, Heat exchanger.
  13. Takahashi Kenzo (Kawanishi JPX) Kumazaki Nobuo (Nakatsugawa JPX) Yokoya Hisao (Tajimi JPX) Nakamura Hironobu (Nakatsugawa JPX) Kachi Tadakatsu (Nakatsugawa JPX), Heat exchanger.
  14. Urch John Francis,AUX, Heat exchanger.
  15. Beasley Marvin D. (Mount Vernon IL) Blystone Wayne G. (Mount Vernon IL) Lemmon Gerald W. (Mount Vernon IL), Heat exchanger fin element with folded over side edges.
  16. Matthews James A. (Milpitas CA), Heat exchanger for solid-state electronic devices.
  17. Matthews James A. (Milpitas CA), Heat exchanger for solid-state electronic devices.
  18. Rjey Alexandre (Garches FRX), Heat exchanger with staggered perforated plates.
  19. Willemsen Henricus P. (Aarle-Rixtel NLX) Dirix Carolina A. M. C. (Westervoort NLX) Te Boekhorst Theodorus G. J. (Zevenaar NLX), Heat exchanging member.
  20. Kitagawa Hiroji,JPX, Heat radiative electronic component.
  21. Joyce Roger L. (New Brighton MN) Westby Ron (Anoka MN), Heat transfer cell and manufacturing apparatus.
  22. Okada Ryoji (Shimoinayoshi JPX) Sato Motohiro (Minori JPX) Yamada Toshihiro (Tomobe JPX) Kuwabara Heikichi (Minori JPX), Heat transfer member.
  23. Carroll Charles B. (Trenton NJ) Lai Ching-Yue (Lawrenceville NJ), High intensity heat exchanger system.
  24. Ognibene, Edward J.; Holmansky, Evgeny N.; Johnson, Douglas L.; Donegan, Kevin J., High performance cold plate for electronic cooling.
  25. Arldt Brian D. (Austin TX) Bruhn Peter H. (Georgetown TX) Buller M. Lawrence (Austin TX) Ledermann Peter G. (Pleasantville NY) Linam Stephen D. (Round Rock TX) McNelis Barbara J. (Austin TX) Mok Lawr, Integrated circuit package with improved cooling means.
  26. Allam Rodney J. (Guildford GB2) Bassett John D. (Surrey PA GB2) Abrardo Joseph M. (Schnecksville PA) Da Prato Philip L. (Whitehouse NJ), Integrated plate-fin heat exchange reformation.
  27. Henderson James R. (Charlotte NC), Jacketed pipe assembly formed of corrugated metal tubes.
  28. Weber ; Jr. Gerard V., Latent thermal vaporization reduction.
  29. Calaman, Douglas P.; Connors, Mathew J., Liquid cooled heat exchanger with enhanced flow.
  30. Lavochkin Ronald B., Liquid cooled heat sink for cooling electronic components.
  31. Frey Toni ; Stuck Alexander,CHX ; Zehringer Raymond,CHX, Liquid cooling device for a high-power semiconductor module.
  32. Cochimin Jimmy ; Halsey Richard J., Liquid pumping system with cooled control module.
  33. Visser Roy Alan, Liquid-cooled baffle series/parallel heat sink.
  34. Negishi, Takeshi; Nagase, Toshiyuki; Nagatomo, Yoshiyuki; Shimamura, Shoichi; Tokiwa, Asao, Liquid-cooled heat sink and manufacturing method thereof.
  35. Douglas P. Calaman ; Mathew J. Connors, Liquid-cooled heat sink with thermal jacket.
  36. Douglas P. Calaman ; Mathew J. Connors, Liquid-cooled heat sink with thermal jacket.
  37. Todorof William J. (1001 W. 17th St. Costa Mesa CA 92627) Murphy Mark (34061 Aurelio St. Dana Point CA 92629), Liquid-cooled sealed enclosure for concentrator solar cell and secondary lens.
  38. Romero Guillermo L. (Phoenix AZ) Anderson Samuel J. (Tempe AZ) Pinder Brent W. (Tempe AZ), Metal matrix composite power dissipation apparatus.
  39. Lapeyre James M. (New Orleans LA), Method for making an improved heat exchanger.
  40. Granetzke, Dennis C., Method of making a lanced and offset fin.
  41. Hayner Paul F. (52 Sentry La. Merrimack NH 03054), Method of manufacturing a fluid flow restrictor.
  42. Norback ; Per S., Method of manufacturing a heat exchanger body for recuperative exchangers.
  43. Azar Kaveh (Westwood MA) Caron Richard E. (Salem NH), Narrow channel finned heat sinking for cooling high power electronic components.
  44. Barker ; III Charles R. (Harvard MA) Casabona Richard J. (Stow MA) Fenwick David M. (Chelmsford MA), Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips.
  45. Sabin Dominique (Herbeville FRX) De Costa Carlos (Paris FRX), Plate bundle for a heat exchanger.
  46. Kontu Mauri,FIX, Plate heat exchanger and method for its manufacture.
  47. Blomgren Ralf,SEX, Plate heat exchanger with connection pipes lined with bellows.
  48. Rosenfeld John H. (Lancaster PA), Porous layer heat exchanger.
  49. Fukutake Sunao (Okayama JPX) Ohashi Kazuhiko (Okayama JPX) Urakami Akira (Okayama JPX), Printed circuit board with a coverlay film.
  50. Torigoe Eiichi (Kariya JPX) Shimoya Masahiro (Kariya JPX), Refrigerant evaporator, improved for uniform temperature of air blown out therefrom.
  51. Nakajima Hirofumi,JPX, Semiconductor device capable of accomplishing a high moisture proof.
  52. Hirakawa Satoshi (Fukuoka JPX) Takao Haruo (Fukuoka JPX), Semiconductor device with first and second sealing resins.
  53. Hisao Aoki (Tamamura JPX), Serpentine heat exchanging apparatus having corrugated fin units.
  54. Poole Lee H. (34 North St. Washingtonville NY 10992), Solar heating device.
  55. Erickson Donald C. (1704 S. Harbor La. Annapolis MD 21401), Sorber with multiple cocurrent pressure equalized upflows.
  56. Mok Lawrence S. (Yorktown Heights NY), Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surfa.
  57. Ma Qing ; Mu Chun ; Fujimoto Harry ; Carruthers John ; Li Jian ; Pan Chuanbin, Structures and processes for fabricating moisture resistant chip-on-flex packages.
  58. Douglas P. Calaman, Thermal jacket for reducing condensation and method for making same.
  59. Scherbaum Friedrich (Erlangen DT), Thyristor cooling arrangement.
  60. Mohinder Singh Bhatti ; Russell S. Johnson ; Shrikant M. Joshi, Ultra high fin density heat sink for electronics cooling.
  61. Peze Andr (352 Alle Chatelard 42155 Saint Leger sur Roanne FRX), Welded plate fin heat exchanger and heat exchanger plate fin manufacturing process.

이 특허를 인용한 특허 (23)

  1. Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.
  2. Baba, Youichiro; Nakamura, Hideo, Condenser for power module and power module.
  3. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  4. Byers, Charles C.; Scofield, William H., Cooling manifold.
  5. Downing, Robert Scott, Evaporative compact high intensity cooler.
  6. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  7. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  8. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  9. Olesen, Klaus Kristen, Flow distributing unit and cooling unit.
  10. Peugh, Darrel E.; Myers, Bruce A.; Oberlin, Gary E., Fluid cooled electronic assembly.
  11. Engelhardt, Martin; Hirsch, Stefan; Ludwig, Lars; Moldovan, Florin, Heat exchanger and method for manufacturing a heat exchanger.
  12. Campagna, Michael Joseph; Callas, James John, Heat exchanger using graphite foam.
  13. Takagi, Kunihiko; Egawa, Akira, Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment.
  14. Schon, Steven G., Heat pipes incorporating microchannel heat exchangers.
  15. Chiba, Hiroshi; Ogushi, Tetsuro; Yamada, Akira; Yamabuchi, Hiroshi, Heat sink.
  16. Chiba,Hiroshi; Ogushi,Tetsuro; Yamada,Akira; Yamabuchi,Hiroshi, Heat sink.
  17. Madison, Jr., Carl T.; Kostraba, Jr., John R., Molded heat sink and method of making same.
  18. Agostini, Bruno, Multi-row thermosyphon heat exchanger.
  19. Berukhim, David; Leishman, Andrew; Avanessian, Vahe, Plate-fin heat exchanger with a porous blocker bar.
  20. Chen, Huang-Han, Solar power system.
  21. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  22. Agostini, Bruno, Twisted tube thermosyphon.
  23. Chen, Huang-Han, Water dispenser.
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