초록 ▼

A heat dissipation device includes a first heat sink ( 10) mounted on one side of a video graphics adapter (VGA) card ( 70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the

A heat dissipation device includes a first heat sink ( 10) mounted on one side of a video graphics adapter (VGA) card ( 70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50') thermally connected to the first heat sink, a second heat pipe (60, 60') discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member ( 80, 80') connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

대표청구항 ▼

What is claimed is: 1. A heat dissipation device assembly comprising: a circuit board with an electronic component mounted thereon; a first heat dissipation unit provided on one side of the board in thermal contact with the electronic component; a second heat dissipation unit provided on an opposi

What is claimed is: 1. A heat dissipation device assembly comprising: a circuit board with an electronic component mounted thereon; a first heat dissipation unit provided on one side of the board in thermal contact with the electronic component; a second heat dissipation unit provided on an opposite side of the board; a first heat pipe connected to and thermally contacting the first heat dissipation unit; a second heat pipe discrete from the first heat pipe connected to and thermally contacting the second heat dissipation unit; and a connecting member connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe. 2. The heat dissipation device assembly as claimed in claim 1, wherein the first heat pipe and the second heat pipe are isolated from and without flow communication with each other. 3. The heat dissipation device assembly as claimed in claim 2, wherein the first heat dissipation unit comprises a block contacting the electronic component and a heat sink secured on the block, the first heat pipe being secured to the heat sink and thermally contacting the block. 4. The heat dissipation device assembly as claimed in claim 3, wherein the first heat pipe has U-shaped end portion beyond the first heat sink, and the second heat pipe is linear-shaped. 5. The heat dissipation device assembly as claimed in claim 4, wherein the connecting member securely encloses adjacent two ends of the first and second heat pipes to cause the first and second heat pipes to cooperatively form a U profile. 6. The heat dissipation device assembly as claimed in claim 2, wherein the first and second heat pipes each has a generally L-shaped profile, and comprises a linear portion received in one of the first and second heat sinks, and a bent portion extending beyond said one of the first and second heat sinks. 7. The heat dissipation device assembly as claimed in claim 6, wherein the connecting member defines a pair of spaces receiving the bent portions therein respectively. 8. The heat dissipation device assembly as claimed in claim 6, wherein the connecting member comprises discrete first and second parts, each of the first and second parts defining a pair of slots and each of the spaces being fromed by one slot of the first part cooperativing with one slot of the second part. 9. A heat dissipation device for a circuit board comprising: a first heat dissipation unit adapted for being attached to one side of the circuit board; a first heat pipe thermally connected with the first dissipation unit; a second heat pipe discrete and isolated from the first heat pipe; a connecting member connecting the first heat pipe with the second heat pipe for transferring heat from the first heat pipe to the second heat pipe; and a second heat dissipation unit for cooling the second heat pipe. 10. The heat dissipation device as claimed in claim 9, wherein the first heat dissipation unit comprises a block contacting the electronic component and a first heat sink secured on the block, the first heat pipe being secured to the heat sink and thermally contacting the block. 11. The heat dissipation device as claimed in claim 10, wherein the second heat dissipation unit comprises a second heat sink adapted for being attached to an opposite side of the circuit board. 12. The heat dissipation device as claimed in claim 11, wherein the connecting member securely encloses adjacent two ends of the first and second heat pipes to cause the first and second heat pipes to cooperatively form a U profile. 13. The heat dissipation device as claimed in claim 10, wherein the heat pipes are L-shaped, and the connecting member encloses adjacent ends of the heat pipes.