Thin-walled honeycomb structure and method for reinforcing the same
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
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출원번호 |
US-0624591
(2003-07-23)
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우선권정보 |
JP-10-171108(1998-06-18) |
발명자
/ 주소 |
- Ichikawa,Yukihito
- Ikeshima,Koichi
|
출원인 / 주소 |
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
1 인용 특허 :
9 |
초록
▼
A thin-walled honeycomb structure includes: a circumferential wall, numerous partition walls disposed inside the circumferential wall, and numerous cell passages defined by the partition walls. A circumferential portion of the honeycomb structure is reinforced wholly or in a part within a certain di
A thin-walled honeycomb structure includes: a circumferential wall, numerous partition walls disposed inside the circumferential wall, and numerous cell passages defined by the partition walls. A circumferential portion of the honeycomb structure is reinforced wholly or in a part within a certain distance from an extremity surface of the honeycomb structure by a reinforcing material that dissipates or evaporates at a high temperature, and a method for producing the same.
대표청구항
▼
What is claimed is: 1. A method for reinforcing a thin-walled honeycomb structure comprising: providing a honeycomb structure having a circumferential wall, partition walls disposed inside the circumferential wall, and cell passages defined by the partition walls; and coating the circumferential wa
What is claimed is: 1. A method for reinforcing a thin-walled honeycomb structure comprising: providing a honeycomb structure having a circumferential wall, partition walls disposed inside the circumferential wall, and cell passages defined by the partition walls; and coating the circumferential wall of the honeycomb structure with a high molecular weight organic reinforcing material in a narrow band at the edge portions of the honeycomb structure only, wherein the organic reinforcing material dissipates at a high temperature, thereby protecting the edge portions of the honeycomb structure from damage before the structure is subjected to a baking treatment. 2. A method for reinforcing a thin-walled honeycomb structure according to claim 1 , wherein a high molecular weight organic material is filled in cell passages at a vicinity of a circumferential portion including a foremost outer circumferential portion of the honeycomb structure to coat an inner surface of said cell passages; or a high molecular weight organic material is filled into the cell passages, and then the material is cured. 3. A method for reinforcing a thin-walled honeycomb structure according to claim 2, wherein said high molecular weight organic reinforcing material is a photo-curing photo-reactive material. 4. A method for reinforcing a thin-walled honeycomb structure according to claim 2, wherein at least the circumferential portion of the honeycomb structure is reinforced with the high molecular weight organic material after an injection molding, or after a drying before a firing but after injection-molding. 5. A method for reinforcing a thin-walled honeycomb structure according to claim 1, wherein said high molecular weight organic reinforcing material is a photo-curing photo-reactive material. 6. A method for reinforcing a thin-walled honeycomb structure according to claim 5, wherein at least the circumferential portion of the extremity surface of the honeycomb structure is reinforced with the high molecular weight organic material after an injection molding, or after a drying before a firing but after injection-molding. 7. A method for reinforcing a thin-walled honeycomb structure according to claim 1, wherein at least the circumferential portion of the honeycomb structure is reinforced with the high molecular weight organic material after an injection molding, or after a drying before a firing but after injection-molding. 8. A method for reinforcing a thin-walled honeycomb structure according to claim 1, wherein the reinforcing material is selected from the group consisting of thermosetting resins, elastic resins, ultra-violet curing resins, rubber materials, and sensitive pressure-sensitive adhesives. 9. A method for reinforcing a thin-walled honeycomb structure, comprising: providing a honeycomb structure having a circumferential wall, partition walls located inside the circumferential wall, and cell passages defined by the partition walls; impregnating and coating a circumferential portion of the honeycomb structure with a high molecular weight organic reinforcing material in a narrow band at the edge portions of the honeycomb structure only; and curing the high molecular weight organic material, wherein the organic reinforcing material dissipates at a high temperature, thereby protecting the edge portions of the honeycomb structure from damage before the structure is subjected to a baking treatment. 10. A method for reinforcing a thin-walled honeycomb structure according to claim 9, wherein said high molecular weight organic reinforcing material is a photo-curing photo-reactive material. 11. A method for reinforcing a thin-walled honeycomb structure according to claim 9, wherein at least the circumferential portion of the honeycomb structure is reinforced with the high molecular weight organic material after an injection molding, or after a drying before a firing but after injection-molding. 12. A method for reinforcing a thin-walled honeycomb structure according to claim 9, wherein the reinforcing material is selected from the group consisting of thermosetting resins, elastic resins, ultra-violet curing resins, rubber materials, and pressure-sensitive adhesives.
이 특허에 인용된 특허 (9)
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Ogawa Yutaka (Nagoya JPX) Asami Seiichi (Okazaki JPX), Ceramic honeycomb structural bodies.
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Okumura Kazunari (Kariya JPX) Yamamoto Shinichi (Takahama JPX) Suzuki Zituo (Aichi JPX), Ceramic honeycomb structure.
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Gadkaree Kishor P. ; Johnson Timothy V., Device for removal of contaminants from fluid streams.
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Rawal Suraj Prakash, High thermal conductivity plugs for structural panels.
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Custer Milton F. ; Ng Hoover Larry, Method for making ceramic honeycomb.
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Schmidt Felix (Rheinfelden DEX) Mergner Bernd (Rheinfelden DEX) Domesle Rainer (Alzenau-Klberau DEX), Method of improving the thermal shock behavior of monolithic catalysts.
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Noky Werner (Mainz-Gonsenheim DEX), Process for sealing ducts of a monolithic honeycomb body.
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Yukihito Ichikawa JP; Koichi Ikeshima JP, Thin-walled honeycomb structure and method for reinforcing the same.
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Golino Carlo M. (Caton NY) Lachman Irwin M. (Corning NY) Nordlie Lawrence A. (Corning NY), Treatment of monolithic catalyst supports.
이 특허를 인용한 특허 (1)
-
Ikeshima,Koichi, Ceramic honeycomb structure.
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