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Method and system for measuring the relief of an object

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-009/02
출원번호 US-0031031 (2000-07-14)
우선권정보 CA-2277855(1999-07-14)
국제출원번호 PCT/CA00/000834 (2000-07-14)
§371/§102 date 20020423 (20020423)
국제공개번호 WO01/006210 (2001-01-25)
발명자 / 주소
  • Coulombe,Alain
  • Cantin,Michel
  • Nikitine,Alexandre
출원인 / 주소
  • Solvision Inc.
대리인 / 주소
    Merchant &
인용정보 피인용 횟수 : 8  인용 특허 : 30

초록

A method and a system for measuring the relief of an object are described herein. The system includes a grid projecting for projecting a grid, an image acquisition apparatus that includes a camera, and a computer. Providing a reference object having common elements with the object to measure, the m

대표청구항

What is claimed is: 1. A method for measuring the relief of an object using a camera provided with an array of pixels, said method comprising the steps of: a) projecting a grid on a reference object; the grid being located at a first position relative to the camera and to the reference object; b) t

이 특허에 인용된 특허 (30)

  1. Ciszek Theodoer F. (31843 Miwok Trail ; P.O. Box 1453 Evergreen CO 80439), Apparatus and method for measuring the thickness of a semiconductor wafer.
  2. Halioua Maurice (Sea Cliff NY), Apparatus and method for obtaining three dimensional surface contours.
  3. Comstock Robert L. (Santa Clara CA) Hansen Michael R. (Santa Clara CA) Tong Edrick H. (Sunnyvale CA), Apparatus and method for testing coplanarity of semiconductor components.
  4. Sorin Wayne V. (Mountain View CA), Apparatus for measuring the thickness of a moving film utilizing an adjustable numerical aperture lens.
  5. Kato Kinya (Yokohama JPX) Takaoka Kazuhiro (Yokohama JPX), Apparatus for measuring thickness of plate-shaped article.
  6. Uesugi Mitsuaki (Kanagawa JPX) Inomata Masaichi (Kanagawa JPX), Apparatus for measuring three-dimensional curved surface shapes.
  7. Eikmeyer Peter (Bielefeld DEX), Apparatus for the inspection of continuous sheets of material.
  8. Bodlaj ; Viktor, Contact-free thickness measuring method and device.
  9. Bodlaj Viktor (Munich DEX), Device for contact-free thickness measurement.
  10. Fitts John M. (528 Euclid St. Santa Monica CA 90402), Hidden change distribution grating and use in 3D moire measurement sensors and CMM applications.
  11. Fitts John M. (Santa Monica CA), High-speed 3-D surface measurement surface inspection and reverse-CAD system.
  12. Bredberg Robert E. (Markham CAX) Torres Cristian (Downsview CAX), Laser thickness gauge.
  13. Womack Kenneth H. (Rochester NY) Kwarta Brian J. (Pittsford NY) Outterson David H. (Victor NY) Reda James R. (Rochester NY), Method and apparatus for digital morie profilometry calibrated for accurate conversion of phase information into distanc.
  14. Hsel Fritz (Mnchengladbach DEX), Method and apparatus for obtaining measuring values representing the thickness of a coherent fiber mass.
  15. Cline Harvey E. (Schenectady NY) Holik Andrew S. (Schenectady NY) Lorensen William E. (Ballston Lake NY), Method and apparatus for reconstruction of three-dimensional surfaces from interference fringes.
  16. Hof Albrecht (Aalen DEX) Hanssen Adalbert (Konigsbronn DEX), Method and apparatus for three-dimensional optical measurement of object surfaces.
  17. Kondo Noriyuki (Kyoto JPX), Method of and apparatus for measuring film thickness.
  18. Schwaiger Max (Ostermiething ATX) Rieder Heinz (St. Pantaleon ATX), Non-contacting measuring apparatus for measuring a displacement in dependence on the incidence of a laser beam on a lase.
  19. Gabura A. James (Toronto CAX) MacHattie Ross K. (Bolton CAX) McNelles Larry A. (Thornhill CAX), On line electromagnetic web thickness measuring apparatus incorporating a servomechanism with optical distance measuring.
  20. Durland Sven O. (Lake Oswego OR), Optical scanning method and apparatus useful for determining the configuration of an object.
  21. Stauber Hans-Ulrich (Grut CHX) Gruninger Baptist (Russikon CHX), Process and device for measuring the thickness of printed products on moving supports.
  22. Schumann Frank (Machern DDX) Richter Hans-Jrgen (Leipzig DDX) Stiefel Werner (Rckmarsdorf DDX) Fritzsche Klaus (Leipzig DDX), Process for the determination of thickness of adhesive layers of inner book block backings.
  23. Cohen Donald K. (Tucson AZ) Caber Paul J. (Tucson AZ) Brophy Chris P. (White Bear Township ; Ramsey County MN), Rough surface profiler and method.
  24. Sjdin Bo (Jonkping SEX), Scanning of workpieces such as lumber cants.
  25. Ozawa Kenji (Kanagawa JPX), Surface configuration inspection apparatus with moving grating.
  26. Ramsey ; Jr. Stevens David (Palo Alto CA), Surface deformation gauging system by moire interferometry.
  27. Landman Marc M. (Burlington MA) Whitman Steven M. (Danville NH) Duncan Robert J. (Magnolia MA), Surface mount machine with lead coplanarity verifier.
  28. Suzuki Masane (Omiya JA), System for measuring and recording three dimensional configuration of object.
  29. McFarlane Ian Duncan (Beaconsfield EN), Thickness measurement.
  30. Berger Christa (Freiburg DEX) Hofler Heinrich (Teningen DEX) Fichter Otmar (March DEX), Topographical camera operable by applying a grid-generated Moire image onto a CCD image sensor.

이 특허를 인용한 특허 (8)

  1. Koh, Kwangill; Seong, Eun Hyoung; Jeon, Moon Young; Kim, Min Young; Lee, Seung Jun, 3D image measuring apparatus and method thereof.
  2. Keshavmurthy, Shyam P.; Lin, Chengchih; Pease, Alfred A.; Krakowski, Richard A., Contour sensor incorporating MEMS mirrors.
  3. Keshavmurthy, Shyam P.; Lin, Chengchih; Wegryn, David T., Hybrid system.
  4. Vodanovic, Bojko, Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object.
  5. Chambard, Jean-Pierre; Chalvidan, Vincent, Method and device for measuring at least a geometric quantity of an optically reflecting surface.
  6. Vodanovic, Bojko, Method and system for the inspection of integrated circuit devices having leads.
  7. Ikeda, Masanori; Tomomatsu, Michinori; Taniguchi, Masahiro; Hassaku, Yousuke; Okamura, Hiroshi, Method of determining solder paste height and device for determining solder paste height.
  8. Cantin,Michel; Quirion,Benoit, System and method for simultaneous 3D height measurements on multiple sides of an object.
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