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Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold

Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.

대표청구항 ▼

What is claimed is: 1. A molding apparatus comprising: a mold configured to mold simultaneously a plurality of semiconductor devices; a plurality of plungers for injecting a molding compound to encapsulate the semiconductor devices; a plunger block with which the plurality of plungers are assembled

What is claimed is: 1. A molding apparatus comprising: a mold configured to mold simultaneously a plurality of semiconductor devices; a plurality of plungers for injecting a molding compound to encapsulate the semiconductor devices; a plunger block with which the plurality of plungers are assembled to operate at the same time; and a plurality of sensors for sensing whether the plungers operate improperly, each of the plurality of sensors being positioned between one end of a corresponding plunger and the bottom of the plunger block. 2. The molding apparatus of claim 1, wherein the plunger block is positioned under the mold so that the plurality of plungers move from below the mold into the mold, and moves up and down so that the plungers move up and down. 3. A molding apparatus comprising: a mold configured to mold simultaneously a plurality of semiconductor devices; a plurality of plungers having plunger protrusions for injecting a molding compound to encapsulate the semiconductor devices in the mold; a plunger block with which the plurality of plungers are assembled to operate at the same time; a limit bar for limiting movement of the plungers to a predetermined extent; and a plurality of contact sensors for respectively sensing whether respective plunger protrusions of the plungers contact the limit bar. 4. The molding apparatus of claim 3, wherein the plunger block is positioned under the mold; the plurality of plungers ascend from below the mold into the mold and inject the molding compound into the mold; and the limit bar limits the plungers to ascend at their maximum, contacts the plunger protrusions of the plungers with the descent of the plunger block, and causes the plungers to descend due to the continuous descent of the plunger block. 5. The molding apparatus of claim 4, wherein the contact sensors are disposed at contact positions between the limit bar and the plunger protrusions of the plungers so as to contact the plunger protrusions of the plungers when the plungers start descending. 6. The molding apparatus of claim 5, wherein if one of the contact sensors does not contact a plunger protrusion of a corresponding plunger when the plungers start descending, the contact sensor senses that the corresponding plunger is improperly operating. 7. The molding apparatus of claim 5, wherein the limit bar contacts the plunger protrusions of the plungers to cause the contact sensors to contact the plunger protrusions of the plunger while the plunger block waits to ascend. 8. The molding apparatus of claim 5, wherein the limit bar is separated from the plunger protrusions of the plungers when the plungers are ascending due to the ascension of the plunger block so that the contact sensors separate from the plunger protrusions of the plungers. 9. A molding apparatus comprising: a mold configured to mold simultaneously a plurality of semiconductor devices; a plurality of plungers having plunger protrusions for injecting a molding compound to encapsulate the semiconductor devices in the mold; a plunger block with which the plurality of plungers are assembled to operate at the same time; a limit bar for limiting movement of the plungers to a predetermined extent that prevents the plungers from deviating from the plunger block; a plurality of load sensors configured to sense respective pressures that are generated when the plurality of plungers operate; and a plurality of contact sensors configured to sense whether the respective plunger protrusions of the plurality of plungers contact the limit bar along with normal operation of the plungers. 10. The molding apparatus of claim 9, wherein the plunger block is positioned under the mold so that the plurality of plungers move from below the mold into the mold, and moves up and down so that the plungers ascend and descend. 11. The molding apparatus of claim 10, wherein the load sensors sense the respective pressures that are generated when the plungers ascend. 12. The molding apparatus of claim 10, wherein the limit bar limits the plungers to ascend with the plunger block into the mold at their maximum so as to inject the molding compound into the mold, contacts the plunger protrusions of the plungers with the descent of the plunger block, and causes the plungers to descend due to the continuous descent of the plunger block. 13. The molding apparatus of claim 12, wherein the contact sensors are disposed at contact positions between the limit bar and the plunger protrusions of the plungers to contact the plunger protrusions of the plungers when the plungers start descending. 14. The molding apparatus of claim 13, wherein if one of the contact sensors does not contact a plunger protrusion of a corresponding plunger when the plungers start descending, the contact sensor senses that the corresponding plunger is improperly operating. 15. The molding apparatus of claim 13, wherein the limit bar contacts the plunger protrusions of the plungers to cause the contact sensors to contact the plunger protrusions of the plunger while the plunger block waits to ascend. 16. The molding apparatus of claim 13, wherein the limit bar separates from the plunger protrusions of the plungers when the plungers are ascending due to the ascension of the plunger block so that the contact sensors separate from the plunger protrusions of the plungers.