$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Edge grip chuck 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23Q-007/00
  • B05C-013/00
  • B05C-013/02
출원번호 US-0198948 (2002-07-19)
발명자 / 주소
  • Spady,Blaine R.
  • Blaufus,Christopher W.
  • Page,Douglas A.
  • Colban,Dan M.
출원인 / 주소
  • Nanometrics Incorporated
대리인 / 주소
    Silicon Valley Patent Group LLP
인용정보 피인용 횟수 : 7  인용 특허 : 41

초록

An actuated edge grip chuck includes tabs with raised portions that press against the side of a substrate as opposed clamping on the top or bottom surfaces. The edge grip chuck includes a solid-state actuator to move a moveable tab into an open position. The solid-state actuator may be, e.g., a piez

대표청구항

What is claimed is: 1. An edge grip chuck comprising: a body; at least one tab coupled to said body, said tab having a raised portion to contact the edge of a substrate, the tab having a horizontally extending base coupled to the raised portion, the base having a top surface to contact the bottom s

이 특허에 인용된 특허 (41)

  1. Jacques Barbieux FR, Adaptive clamping type chuck.
  2. Koelling Robert, Apparatus and method for precision machining of metal rings.
  3. Richard Abraham, Apparatus and method for spinning a work piece.
  4. Vollaro Joseph F. (Pleasantville NY), Apparatus for providing consistent, non-jamming registration of notched semiconductor wafers.
  5. Vollaro Joseph F. (Pleasantville NY), Apparatus for providing consistent, non-jamming registration of semiconductor wafers.
  6. Mears Eric L. (Rockport MA) Hertel Richard J. (Boxford MA) Brick Robert V. (Gloucester MA) Holt ; Jr. Carl J. (Newburyport MA), Apparatus for retaining wafers.
  7. Mears Eric L. (Rockport MA) Hertel Richard J. (Bradford MA) Brick Robert V. (Gloucester MA), Apparatus for retaining wafers.
  8. Ikeda Masahide,JPX ; Ohtani Masami,JPX, Apparatus for substrate holding.
  9. Yasuyuki Ishitani JP; Makito Seno JP, Circuit board holding apparatus and circuit board hold releasing method.
  10. McClanahan Adolphus E. (870 S. Saratoga Ave. #F-110 San Jose CA 95129) Turner Frederick T. (1478 Bittern Dr. Sunnyvale CA 94087) Anderson Kenneth E. (1958 Janet Ave. San Jose CA 95124) Nicholson Phil, Clamp with wafer release for semiconductor wafer processing equipment.
  11. Hodos, Julian, Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber.
  12. Spady, Blaine R.; Colban, Dan M., Compact rotating stage.
  13. Dominique Jourde FR; Gerard Turc FR, Device allowing the treatment of a substrate in a machine provided for the treatment of bigger substrates and a system of mounting a substrate in this device.
  14. Godsey, Donald W.; Davis, Michael R., Device for holding objects to be treated.
  15. Kawashima Hideaki (Sagamihara) Eguchi Kouhei (Sagamihara JPX), Device for supporting a wafer.
  16. Donoso, Bernardo; Stevens, Joseph J.; Olgado, Donald J.; Ko, Alexander Sou-Kang, Dual post centrifugal wafer clip for spin rinse dry unit.
  17. Joseph T. Adams ; Robert S. Kearns, Edge gripped substrate lift mechanism.
  18. Joseph T. Adams ; Robert S. Kearns, Edge gripped substrate loading and unloading method.
  19. Smedt Rodney G ; Coad George, Edge handling wafer chuck.
  20. Smedt, Rodney G.; Coad, George, Edge handling wafer chuck.
  21. Asai Akira,JPX ; Asai Takashi,JPX ; Asai Yoshiro,JPX, Gripping device.
  22. Spady, Blaine R.; McGahan, William A.; Read, James V.; Goonesekera, Arosha W.; Rost, Eric A., High precision substrate prealigner.
  23. Tyveleijn Johannes H.,NLX, Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder.
  24. Martin Roth DE; Andreas Schuster DE; Heinz Voggenreiter DE; Harald Vorbrugg DE; Markus Reindl DE, Holding and releasing mechanism with a shape memory actuator.
  25. Maltabes John,DEX ; Charles Alain,DEX ; Mautz Karl,DEX, Lithography chuck having piezoelectric elements, and method.
  26. Lenker Jay Alan, Method and apparatus for obtaining improved resolution from intraluminal ultrasound.
  27. Bjornard Erik J. (Northfield MN) Kurman Eric W. (Healdsburg CA) Steffenhagen Debra M. (Santa Rosa CA) Taylor Clifford L. (Nerstrand MN), Method and apparatus for thin film coating an article.
  28. Wang Hui, Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces.
  29. Lenz Eric H., Perimeter wafer lifting.
  30. Lee Jonghyun (Daejeon KRX) Kim Yountae (Daejeon KRX) Kim Bowoo (Daejeon KRX), Precision wafer driving device by utilizing solid type actuator.
  31. Lenker, Jay Alan, Resolution ultrasound devices for imaging and treatment of body lumens.
  32. Appa Kari, Seamless mission adaptive control surface.
  33. Kopacz, Stanislaw; Lawson, John, Semiconductor wafer holding assembly.
  34. Savage, Richard N.; Menagh, Frank S.; Carvalheira, Helder R.; Troiani, Philip A.; Cossentine, Dan L.; Vaughan, Eric R.; Mayer, Bruce E., Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system.
  35. Julien Gerald J. (Puyallup WA) Creson June L. (Graham WA), Shape memory metal precision actuator.
  36. Shuto Mitsutoshi (Tokyo) Fukazawa Yasushi (Tokyo) Ohsaki Minoru (Kumamoto JPX), Substrate supporting apparatus for a CVD apparatus.
  37. Doue Julien (Liancourt FRX) Beauvineau Jacky (Igny FRX), Support device for a thin substrate of a semiconductor material.
  38. Keyser William ; Murphy Kenneth ; Edwards Timothy, Two-piece clamp ring for holding semiconductor wafer or other workpiece.
  39. Jelinek Vaclav, Wafer holding assembly and wafer processing apparatus having said assembly.
  40. Noguchi, Ikuo, Wafer holding device.
  41. Tsuchiya, Masato; Ogasawara, Shunichi; Murooka, Hideyuki, Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism.

이 특허를 인용한 특허 (7)

  1. Thull, Zachariah, Fueldraulic actuator installation and removal tool.
  2. Sakai, Tetsuya; Sakaue, Hideki, Hand member and hand.
  3. Fairhurst, John Robert; Krampert, Jeffrey E.; Hertel, Richard J.; MacIntosh, Edward, Method and apparatus for holding a plurality of substrates for processing.
  4. Krondorfer, Harald; Hund, Roland; Maciel, Alexandre, Piezoelectric clamping device.
  5. Kim, Hyun Jong; Kim, Ju Won; Cho, Jung Keun, Spin head and substrate treating method using the same.
  6. Dawson, Keith E.; Evans, Dave, Tactile wafer lifter and methods for operating the same.
  7. Dawson, Keith E.; Evans, Dave, Tactile wafer lifter and methods for operating the same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로