초록 ▼

A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting memb

A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting members has a porous wick structure formed thereon. Thus, the case can be sustained by the supports with each wick structure firmly mounted in the grooves of the inner walls thereof. When performing heat transferring, the working fluid is heated to be formed as vapor by the electronic element mounted on the outer bottom surface so as to flow toward the inner top surface of the case. The working fluid is then cooled to be liquid again to be absorbed by the wick structures of the supporting members and be transported toward the inner bottom of the case.

대표청구항 ▼

What is claimed is: 1. A heat conductive plate, comprising: a hollow case having a top cover and a bottom cover; a plurality of lateral grooves respectively formed on the inner surface of the top and the bottom covers of the case except the inner surfaces direct above or beneath an open area, where

What is claimed is: 1. A heat conductive plate, comprising: a hollow case having a top cover and a bottom cover; a plurality of lateral grooves respectively formed on the inner surface of the top and the bottom covers of the case except the inner surfaces direct above or beneath an open area, where a small amount metal sinters are formed there and the open area usually is placed direct above a heat generating source; and a plurality of powder sintered supports positioned except at the opening area within the case, respectively bonded to the grooves, and a porous wick structure formed on the surface thereof. 2. The heat conductive plate of claim 1, wherein the case includes a bottom cover and a top cover. 3. The heat conductive plate of claim 1, wherein the supports are radially arranged within the case.