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An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object (W) to be processed by using a plasma in a process chamber (26) in which a vacuum can be formed. An electrode unit (38) has a heater unit ( 44) therein. A cooling block (40) having a cool

An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object (W) to be processed by using a plasma in a process chamber (26) in which a vacuum can be formed. An electrode unit (38) has a heater unit ( 44) therein. A cooling block (40) having a cooling jacket ( 58) is joined to the electrode unit (38) so as to cool the electrode unit. A heat resistant metal seal member (66A, 66 B) seals an electrode-side heat transfer space (62, 64) formed between the electrode unit and the cooling block. Electrode-side heat transfer gas supply means (94) supplies a heat transfer gas to the electrode-side heat transfer space. Accordingly, a sealing characteristic of the electrode-side heat transfer space does not deteriorate even in a high temperature range such as a temperature higher than 200째 C. and, for example, a range from 350째 C. to 500째 C., and the heat transfer gas does not leak.

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What is claimed is: 1. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising: an electrode unit having a heater unit

What is claimed is: 1. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising: an electrode unit having a heater unit therein; a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit; a labyrinth beat transfer space formed by a complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block; and an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space. 2. The electrode structure as claimed in claim 1, further including an insulating member provided between said electrode unit and said cooling block, and wherein said heat transfer space is divided into an upper space and a lower space by the thermally insulating member. 3. The electrode structure as claimed in claim 2, wherein said thermally insulating member is made of a material having a coefficient of thermal conductivity of more than 80 W/mK at a process temperature of said object to be processed. 4. The electrode structure as claimed in claim 1, wherein a surface roughness of a member defining said heat transfer space is smaller than 2.0 μm. 5. The electrode structure as claimed in claim 1, wherein said heater unit is a ceramic heater. 6. The electrode structure as claimed in claim 1, wherein said electrode unit is an upper electrode unit positioned above said object to be processed. 7. A placement table structure used for a processing apparatus performing a predetermined process on an object to be processed in a process chamber in which a vacuum can be formed, the placement table structure comprising: a placement table having a heater unit therein so as to heat said object to be processed; a cooling block joined to the placement table and having a cooling jacket which cools said placement table; a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said placement table and said cooling block; and a heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space. 8. The placement table structure as claimed in claim 7, wherein a surface roughness of a member defining said heat-transfer space is smaller than 2.0 μm. 9. The placement table structure as claimed in claim 7, wherein the center of said placement table is held by a column, and the column is connected to said cooling block via a heat conductive member. 10. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising: an electrode unit having a heater unit therein; a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit; a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block; an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space; and an aluminum nitride (AlN) thermally insulating member provided between said electrode unit and said cooling block, the heat transfer space being divided into an upper space and a lower space by the thermally insulating member, said thermally insulating member having a coefficient of thermal conductivity of more than 80 W/mK at a process temperature of said object to be processed. 11. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure, comprising: an electrode unit having a heater unit therein; a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit; a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block; and an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein a contact rate of a joining surface of a member, which is joined to define said heat transfer space, is set to fall within a range from 40% to 80%. 12. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising: an electrode unit having a heater unit therein; a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit; a labyrinth heat transfer space formed by a complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block; and an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein said heater unit is divided into concentric zones, and the divided zones are controllable on an individual basis. 13. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising: an electrode unit having a heater unit therein; a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit; a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block; and an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein said electrode unit is a lower electrode unit which also serves as a placement table on which said object to be processed is placed, and the electrode structure further comprises an electrostatic chuck which is joined to an upper surface of the lower electrode unit so as to attract said object to be processed and a chuck-side heat transfer gas supply structure configured to supply a heat transfer gas to a chuck-side heat transfer space formed between said electrostatic chuck and said object to be processed. 14. The electrode structure as claimed in claim 13 wherein at least one of said electrode side heat transfer space, said labyrinth heat transfer space and said chuck-side heat transfer space is provided with a heat resistant pressure sensor, and an amount of gas supplied by said corresponding heat transfer gas supply structure is controlled based on an output of the heat resistant pressure sensor. 15. An electrode structure used in a plasma processing apparatus which performs a predetermined process on an object to be processed by using a plasma in a process chamber in which a vacuum can be formed, the electrode structure comprising: an electrode unit having a heater unit therein; a cooling block joined to the electrode unit and having a cooling jacket which cools said electrode unit; a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said electrode unit and said cooling block; and an electrode-side heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein the center of said electrode unit is held by a hollow column, and a gas blower is provided in said column for promoting a release of heat by blowing a gas toward the center of a back surface of said electrode unit. 16. A placement table structure used for a processing apparatus performing a predetermined process on an object to be processed in a process chamber in which a vacuum can be formed, the placement table structure comprising: a placement table having a heater unit therein so as to heat said object to be processed; a cooling block joined to the placement table and having a cooling jacket which cools said placement table; a labyrinth heat transfer space formed by a complementary concentric or spiral grooves provided on opposite surfaces of said placement table and said cooling block; and a heat transfer gas supply structure configured to supple a heat transfer gas to said labyrinth heat transfer space, wherein a rate of contact of a joining surface of a member joined to define said heat transfer space is set to fall within a range from 40% to 80%. 17. The placement table structure as claimed in claim 16, wherein a surface roughness of a member defining said heat-transfer space is smaller than 2.0 μm. 18. A placement table structure used for a processing apparatus performing a predetermined process on an object to be processed in a process chamber in which a vacuum can be formed, the placement table structure comprising: a placement table having a heater unit therein so as to heat said object to be processed; a cooling block joined to the placement table and having a cooling jacket which cools said placement table; a labyrinth heat transfer space formed by complementary concentric or spiral grooves provided on opposite surfaces of said placement table and said cooling block; and a heat transfer gas supply structure configured to supply a heat transfer gas to said labyrinth heat transfer space, wherein the center of said placement table is held by a hollow column, and a gas blower is provided in said column for promoting a release of heat by blowing a gas toward the center of a back surface of said electrode unit. 19. A plasma processing apparatus comprising: a process chamber in which a vacuum can be formed; an electrode structure recited in one of claims 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14 and 15; and a high-frequency source applying a high-frequency voltage to the electrode structure. 20. A processing apparatus comprising: a process chamber in which a vacuum can be formed; and a placement table structure recited in one of claims 7, 8, 9, 16, 18, and 17.