IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0122741
(2002-04-15)
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우선권정보 |
EP-01201400(2001-04-17) |
발명자
/ 주소 |
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출원인 / 주소 |
- Koninklijke Philips Electronics N. V.
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인용정보 |
피인용 횟수 :
0 인용 특허 :
5 |
초록
▼
A heating system employs a ceramic substrate and a resistive layer. The resistive layer includes a thermally stable resin, which is filled with a conductive material. A method of manufacturing such a heating system involves a provision of a ceramic substrate and an application of a resistive layer o
A heating system employs a ceramic substrate and a resistive layer. The resistive layer includes a thermally stable resin, which is filled with a conductive material. A method of manufacturing such a heating system involves a provision of a ceramic substrate and an application of a resistive layer on the substrate. In the method, the resistive layer comprises includes a thermally stable resin, which is filled with a conductive material. Before application of the resistive layer, an adhesion promotor is applied on the ceramic substrate.
대표청구항
▼
The invention claimed is: 1. A heating system, comprising: a ceramic substrate; an adhesive promotor applied to the ceramic substrate; and a resistive layer applied to the adhesive promotor to thereby bond the resistive layer to the ceramic substrate, wherein the resistive layer includes a thermall
The invention claimed is: 1. A heating system, comprising: a ceramic substrate; an adhesive promotor applied to the ceramic substrate; and a resistive layer applied to the adhesive promotor to thereby bond the resistive layer to the ceramic substrate, wherein the resistive layer includes a thermally stable resin filled with a conductive material; and the ceramic substrate includes a substrate of steel that is provided with an enamel layer. 2. The heating system of claim 1, wherein the thermally stable resin includes one or more materials selected from a group consisting of polyimide, polyetherimide, polyethersulfone, aromatic polyamides, and silicon resins. 3. The heating system of claim 1, wherein the thermally stable resin includes polyimide. 4. The heating system of claim 1, wherein the conductive material includes one or more materials selected from the group consisting of carbon, graphite, silver, nickel and silver-plated nickel. 5. The heating system of claim 1, wherein the adhesive promotor reacts with the ceramic substrate to bind the resistive layer to the ceramic substrate. 6. The heating system of claim 1, wherein the adhesive promotor includes an aminosilane. 7. The heating system of claim 1, wherein the adhesive promotor includes γ-aminopropyl trimethoxysilane. 8. The heating system of claim 1, wherein the heating system is employed within an electrical appliance. 9. The heating system of claim 8, wherein the electrical appliance is one of a coffeemaker or a water kettle. 10. The heating system of claim 6, wherein the heating system is employed within an electrical appliance. 11. The heating system of claim 10, wherein the electrical appliance is one of a coffeemaker or a water kettle. 12. The heating system of claim 7, wherein the heating system is employed within an electrical appliance. 13. The heating system of claim 12, wherein the electrical appliance is one of a coffeemaker or a water kettle. 14. A method of manufacturing a heating system, the method comprising: providing a ceramic substrate, the substrate comprising an enamel layer on a substrate of steel; applying an adhesive promotor on the enamel layer of the ceramic substrate; and applying a resistive layer on the adhesive promotor to thereby bond the resistive layer to the ceramic substrate, wherein the resistive layer includes a polyimide filled with a conductive material. 15. The method of claim 14, wherein the adhesive promotor includes an aminosilane. 16. The method of claim 14, wherein the adhesive promotor includes γ-aminopropyl trimethoxysilane. 17. The method of claim 14, wherein the adhesive promotor reacts with the ceramic substrate to bind the resistive layer to the ceramic substrate. 18. A heating system, comprising: a ceramic substrate with an enamel layer on a substrate of steel; an adhesive promotor applied to the enamel layer; and a resistive layer applied to the adhesive promotor to thereby bond the resistive layer to the ceramic substrate, wherein the resistive layer includes a thermally stable resin filled with a conductive material.
이 특허에 인용된 특허 (5)
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Fuller Timothy J. (Pittsford NY) Mammino Joseph (Penfield NY) Brach Paul J. (Rochester NY) Blaszak Robert (Penfield NY) Finsterwalder Robert N. (Webster NY) Badesha Santokh S. (Pittsford NY), Coated fuser member processes.
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Miller Cole F., Electrically conductive exothermic coatings.
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Akutsu Eiichi,JPX ; Soga Hiroh,JPX ; Ando Shigehito,JPX, Laminate fixing roller, apparatus using same and method for manufacturing laminate fixing roller.
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Shafe Jeff (Redwood City CA) Straley O. James (Redwood City CA) McCarty Gordon (San Jose CA) Oswal Ravinder K. (Union City CA) Dharia Amitkumar N. (Newark CA), Method of making an electrical device comprising a conductive polymer composition.
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Smuckler Jack H. (9 Countryside La. Marblehead MA 01945), Positive temperature coefficient composition.
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