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A cooling arrangement for one or more integrated circuits which are mounted in a socket on a printed circuit board and which each are cooled by a cooling element based on a compressor. The surface of each integrated circuit has arranged thereon a cooling element which is formed by an evaporator in t

A cooling arrangement for one or more integrated circuits which are mounted in a socket on a printed circuit board and which each are cooled by a cooling element based on a compressor. The surface of each integrated circuit has arranged thereon a cooling element which is formed by an evaporator in the form of a housing (15) which has a lid with protruding cooling rods. Coolant is supplied to the housing ( 15) via a supply pipe (22, 23) that ends in an inlet stub ( 24) in the housing, which is constructed such that the coolant changes its direction, such as 90째, when entering the interior of the housing. The coolant is returned form the housing via an outlet stub ( 25) which is concentric with the inlet stub (22). The supply pipe has a smaller diameter than the inlet stub (24) and the outlet stub (25), which means that cooling of the coolant and thereby of the cooling rods takes place in the housing, said cooling being transferred to the individual ICs. With a view to avoiding formation of condensate in connection with the cooling process, the housing is fixed against the printed circuit board according to the invention, a sealing material, such as butyl, being arranged between the housing (15) and the printed circuit board (3). For additional sealing, a rear flange may be fixed on the rear side of the printed circuit board in the area where wires are run to the IC, said rear flange being sealed with butyl against the printed circuit board.

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The invention claimed is: 1. A cooling arrangement for an integrated circuit which is mounted in a socket on a printed circuit board, comprising, an insulating housing positioned around the integrated circuit and defining an edge near the printed circuit board, said insulating housing including an

The invention claimed is: 1. A cooling arrangement for an integrated circuit which is mounted in a socket on a printed circuit board, comprising, an insulating housing positioned around the integrated circuit and defining an edge near the printed circuit board, said insulating housing including an inlet stub for coolant, an outlet stub for coolant, and a supply pipe for supplying coolant to said inlet stub, a lid positioned against the insulated housing and on said printed circuit so as to define an evaporation cavity within the housing, said lid including a plurality of cooling rods so that coolant flowing through said evaporator cavity will cool said lid and thus said printed circuit board, a sealing material which is impermeable to the transport of fluids circumferentially positioned between the housing and the printed circuit board to prevent air flow therethrough and moisture formation on the printed circuit board, said sealing material being an ethylene-propylene-diene copolymer, and a bottom flange having a bottom fixed below the printed circuit board, and said sealing material is located between the bottom flange and the printed circuit board. 2. A cooling arrangement according to claim 1, wherein the sealing material has a glass temperature which is below-50째 C. 3. A cooling arrangement according to claim 1, wherein the sealing material has a good adhesiveness to the housing, and a good adhesiveness to the surface of the mounting plate which is coated with a substance containing a resin. 4. A cooling arrangement according to claim 1, wherein the sealing material has a permeability coefficient to water vapour which is lower than 82.10-13 at 37.5 degrees Celsius, stated according to the units of the SI system. 5. A cooling arrangement according to claim 1, wherein the supply pipe for supplying coolant to the inlet stub in the evaporator is constructed such that the coolant changes its direction when entering the inlet stub, and the diameter of the inlet stub and of the outlet stub is larger than the diameter of the supply pipe. 6. A cooling arrangement according to claim 3, wherein the housing is made of aluminum. 7. A cooling arrangement according to claim 3, wherein said resin is a epoxy acrylate resin. 8. A cooling arrangement according to claim 1, wherein said evaporation cavity includes polyethylene foam. 9. In a cooling arrangement according to claim 1 for the cooling of two or more ICs using a common, compressor-based cooling arrangement from which coolant is conveyed to all the ICs, and wherein each IC is cooled separately by means of connected evaporators, a method wherein the temperature control of the ICs is performed by adjusting the flow rate and amount of the coolant in the evaporators of the individual IC circuits by generating gas bubbles that decelerate the liquid movement of coolant by local heating of the coolant. 10. A method according to claim 9, wherein the temperature control is performed by adjusting the speed of rotation of cooling blowers which are included in the coolant arrangement and are coupled to their respective condensers.