초록 ▼

Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method. According to the metal plating method of the present invention, electroless plating is performed after the surface of a object to be plated is treated with a pretr

Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method. According to the metal plating method of the present invention, electroless plating is performed after the surface of a object to be plated is treated with a pretreatment agent obtained by reacting or mixing in advance a noble metal compound (catalyst) with a silane-coupling agent having functional groups capable of capturing metals. According to this method, metal plating can be securely applied to powders, resin cloths, semiconductor wafers, and other specular bodies. Moreover, the problem of the insufficient coverage of the seed layer on the inside walls of vias and trenches during the formation of fine wiring can be addressed by applying this method to semiconductor wafers. The silane-coupling agent may be a compound containing azole groups, preferably an imidazole.

대표청구항 ▼

What is claimed is: 1. A metal plating method comprising: preparing pretreatment agent consisting essentially of a palladium compound reacted or mixed with a silane-coupling agent obtained by reacting an imidazole-based compound and an epoxysilane-based compound; treating the surface of an object

What is claimed is: 1. A metal plating method comprising: preparing pretreatment agent consisting essentially of a palladium compound reacted or mixed with a silane-coupling agent obtained by reacting an imidazole-based compound and an epoxysilane-based compound; treating the surface of an object to be plated with said pretreatment agent; and then electroless plating said plating object. 2. The metal plating method according to claim 1, wherein said object is a semiconductor wafer. 3. The metal plating method according to claim 1, wherein said electroless plating is a copper or nickel electroless plating. 4. The metal plating method according to claim 3, wherein a conductive layer is formed by said copper or nickel electroless plating, and a copper is electroplated on said conductive layer. 5. A semiconductor wafer, whereon a metal plating layer been formed with the metal plating method according to claim 1. 6. A semiconductor device using the semiconductor wafer according to claim 5. 7. The metal plating method of claim 1, wherein the pretreatment agent consists of the palladium compound reacted or mixed with the silane-coupling agent. 8. The metal plating method of claim 1, wherein the palladium compound is palladium chloride, the imidazole-based compound is imidazole and the epoxysilane-based compound is γ-glycidoxypropyltrimethoxysilane. 9. A metal plating pretreatment agent consisting essentially of a solution obtained by reacting or mixing in advance a palladium compound with a silane-coupling agent obtained by reacting an imidazole-based compound and an epoxysilane-based compound. 10. The metal plating pretreatment agent of claim 9, consisting of the palladium compound reacted or mixed with the silane-coupling agent. 11. The metal plating pretreatment agent of claim 9, wherein the palladium compound is palladium chloride, the imidazole-based compound is imidazole and the epoxysilane-based compound is γ-glycidoxypropyltrimethoxysilane.